2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献_第3页

Thermal analysis of advanced microelectronic devices using thermoreflectance thermography 利用热反射热成像技术对先进微电子器件进行热分析

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749037

D. Kendig, A. Tay, A. Shakouri

引用次数: 8

Simulation of the thermal behavior of a conductive adhesive 导电胶粘剂热行为的模拟

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749077

S. Lefèvre, Aylin Yüksel Güngör, S. Gomés

引用次数: 0

Design methodology for over-temperature protection of an LDO voltage regulator by using electro-thermal simulations 利用电热模拟的LDO稳压器过温保护设计方法

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7748646

C. Pleşa, M. Neag, C. Boianceanu, A. Negoita

引用次数: 3

Fabrication of a micro-thermoelectric cooler for room temperature applications by template assisted electrodeposition 用模板辅助电沉积法制备室温应用的微型热电冷却器

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7748640

Javier García, Nicolás Pérez, Melanie Mohn, T. Sieger, H. Schlorb, H. Reith, G. Schierning, K. Nielsch

引用次数: 0

In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package 以倒装封装为例，用局部热传感器对界面分层进行现场监测

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749057

B. Wunderle, D. May, M. A. Ras, S. Sheva, M. Schulz, M. Wohrmann, J. Bauer, J. Keller

{"title":"In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package","authors":"B. Wunderle, D. May, M. A. Ras, S. Sheva, M. Schulz, M. Wohrmann, J. Bauer, J. Keller","doi":"10.1109/THERMINIC.2016.7749057","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749057","url":null,"abstract":"We have developed a novel, rapid, robust and non-destructive experimental technique for in-situ monitoring of delamination of interfaces for electronic packages. The method is based on a simple thermal transducer matrix of so-called THIXELS (thermal pixels) which allows a spatially resolved real-time image of the current status of delamination. The transducers are small metal wire meanders which are driven and electrically read out using the well-known 3-omega method. This method has special advantages over other thermal contrast methods with respect to robustness, sensitivity and signal-to-noise ratio. Notable is the absence of cross-effects. The proof of concept has been furnished on an industry-grade flip-chip package with underfill on an organic substrate. The technique is especially powerful for buried interfaces, where time-honoured methods like scanning acoustic microscopy (SAM) cannot be applied. As the technique effectively performs a thermal diffusivity sensitive scan, it may not only be useful for stress testing during package qualification, but sensor applications on other fields of health monitoring seem also possible.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"170 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133425648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments 通过热模拟和实验设计研究LED模组的温度依赖热路径

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749051

L. Mitterhuber, S. Defregger, R. Hammer, J. Magnien, F. Schrank, Stefan Horth, M. Hutter, E. Kraker

{"title":"Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments","authors":"L. Mitterhuber, S. Defregger, R. Hammer, J. Magnien, F. Schrank, Stefan Horth, M. Hutter, E. Kraker","doi":"10.1109/THERMINIC.2016.7749051","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749051","url":null,"abstract":"One key aspect in light emitting diode (LED) systems engineering lies in the understanding and management of the heat transfer during device operation. A deeper understanding of the thermal behavior of an LED module can be gained by an in-depth thermal path analysis. The three-dimensional heat path of the LED is influenced by its operating conditions (e.g. heat sink temperature, driving current, the properties of the thermal interface materials of the device attachment to the heatsink). In this paper, different operating conditions were systematically varied in a set of experiments and its corresponding numerical simulations making use of a statistical Design of Experiments (DOE) approach. The operating conditions were treated as experimental factors of the DOE and the responses were derived from analyzing the resulting structure functions. The results quantified not only the sensitivities of the responses (thermal transients) to the operating conditions but also showed the influence of temperature dependencies in the material properties on the thermal behavior of an LED module.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116862077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Determination of bond wire failure probabilities in microelectronic packages 微电子封装中键合线失效概率的测定

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7748645

T. Casper, U. Römer, S. Schöps

引用次数: 4

Novel partition-based approach to dynamic compact thermal modeling 基于分区的动态致密热建模新方法

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7748652

L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi

引用次数: 13

Design of heated-micro-resonator rings 加热微谐振环的设计

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749058

S. Lei, R. Enright, A. Shen

引用次数: 0

Peltier cells cooling system for switch mode power supply 用于开关电源的珀尔帖电池冷却系统

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749066

G. Casano, S. Piva

引用次数: 3