2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)最新文献_第2页

Influence of the photoactive layer thickness on the device parameters and their temperature dependence in thin crystalline silicon photovoltaic devices 薄晶硅光电器件中光活性层厚度对器件参数及其温度依赖性的影响

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749073

B. Plesz, J. Mizsei

引用次数: 3

Modelling and measurement of the thermal conductivity of composites with silver particles 银颗粒复合材料导热系数的建模与测量

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749038

J. Ordonez-Miranda, M. A. Ras, B. Wunderle, S. Volz

引用次数: 2

Modelling of thermal processes in heat flux sensors 热通量传感器中热过程的建模

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749078

A. Kozlov

引用次数: 1

Closing the power delivery/heat removal cycle for heterogeneous multi-scale systems 关闭异构多尺度系统的电力输送/热量去除周期

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749034

M. Stan, Ke Wang, K. Skadron

{"title":"Closing the power delivery/heat removal cycle for heterogeneous multi-scale systems","authors":"M. Stan, Ke Wang, K. Skadron","doi":"10.1109/THERMINIC.2016.7749034","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749034","url":null,"abstract":"The semiconductor industry is poised to continue the historic Moore's law trend of doubling the level of integration every 1.5-2 years, even as the virtuous cycle benefits of Dennard scaling are quickly vanishing. Once devices no longer scale laterally, the only way to continue to increase areal density is by going vertical using 3D-IC. However, 3D-IC raises several fundamental difficulties in addition to the clear fabrication challenges: as the number of physical layers in a 3D-IC stack increases, from the present 2.5D multi-layer solutions (with an interposer, or only a couple of layers), to true 3D many-layer stacks, the energy cycle problem of delivering power to and removing heat from the 3D stack become daunting. The main reason for this power wall is the mismatch between the volumetric (cubic) power consumption and heat dissipation in 3D-IC, and the areal (quadratic) power delivery and heat removal through a 2D surface (top and/or bottom of the stack). In this paper we propose MultiSpot, a framework to provide fundamental solutions to the 3D-IC power wall that are also practical.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127899919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Implementation of moisture diffusion model in multi-material system including air cavities 含空腔的多材料系统中水分扩散模型的实现

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749056

N. Peter, Péter Tóth, Boldizsár Kovács, G. Kristóf

引用次数: 1

A novel approach to Heatsink mass minimisation 散热片质量最小化的新方法

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749043

R. Bornoff, J. Parry, John Wilson

引用次数: 3

Methodology to achieve the thermal management of a 6U conduction-cooled board with 130W power dissipation and an operating temperature of 85°C 介绍了一块功耗130W、工作温度85℃的6U导冷板的热管理方法

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749047

J. Maquet

{"title":"Methodology to achieve the thermal management of a 6U conduction-cooled board with 130W power dissipation and an operating temperature of 85°C","authors":"J. Maquet","doi":"10.1109/THERMINIC.2016.7749047","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749047","url":null,"abstract":"We are presenting a methodology to optimize the design of a thermally challenging Single Board Computer (SBC) in order to achieve ambitious thermal management goals at reasonable cost. The case study presented describes the design of a conduction cooled SBC in 6U-VPX [1] form factor, dissipating up to 130 W (2 high performance CPUs) and presenting a high density of components (ca 4500 on 640cm2). In order to achieve high reliability (low MTBF), all components must be operated at least 5°C below their maximum rating, while the board's thermal interface, i.e. the upper and lower board edges, are kept at 85°C. Any “active” cooling (including heat pipes) is prohibited. This puts tight constraints on the allowable temperature gradients between the board edges and any of the thermally critical components. It turns out that a heat frame design based on advanced composite materials (aluminium, copper and graphite) can meet these constraints even in the presence of layout constraints that impose a less-than-optimal placement of thermally critical components.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131903315","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Digital thermal sensor based on ring-oscillators in Zynq SoC technology 基于Zynq SoC技术的环形振荡器数字热传感器

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749065

Charles-Alexis Lefebvre, Leire Rubio, Jose Luis Montero

引用次数: 6

Relibability assessment of wafer level chip scale package (WLCSP) based on distance-to-neutral point (DNP) 基于中性点距离(DNP)的晶圆级芯片级封装(WLCSP)可靠性评估

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749063

Tung Ching Lui, B. Muthuraman

引用次数: 6

Fabrication, performance and reliability of a thermally enhanced wafer level fan out demonstrator with integrated heatsink 集成散热器的热增强晶圆级扇出演示器的制造、性能和可靠性

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2016-09-01 DOI: 10.1109/THERMINIC.2016.7749079

A. Cardoso, Hugo Barros, G. Hantos

{"title":"Fabrication, performance and reliability of a thermally enhanced wafer level fan out demonstrator with integrated heatsink","authors":"A. Cardoso, Hugo Barros, G. Hantos","doi":"10.1109/THERMINIC.2016.7749079","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749079","url":null,"abstract":"The leading Fan-Out Wafer-Level Packaging technology, WLFO by NANIUM, stemmed from Infineon's embedded Wafer-Level BGA (eWLB) technology, has limited heat dissipation capability, as the materials used in, namely the epoxy mold compound (EMC), originally aimed process ability and mechanical stability, but not heat conduction. As WLFO technology expands to WLSiP (Wafer-Level System-in-Package) for very high-density system integration, the thermal performance becomes a critical factor. In a broader scope, improving heat dissipation capabilities opens WLFO technology platform to power applications. The main challenge for power dissipation on WLSiP packaging is that the EMC must be electrical insulator, placing challenges on both heat conduction and bonding to metallic heat spreader. Whereas mold compounds are typically organic resins filled with inorganic fillers, high performance thermal interface material (TIM) are designed for metal-metal interfaces, not for organic-metal interface as required for chip backside overmolded WLFO package. Another challenge is the assembly of an integrated heatsink, over and larger than the package, on a volume manufacturing capable process, to yield both good thermal conduction and reliable thermomechanical bonding. The work done is part of the collaborative European FP7-ICT project NANOTHERM (Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces), together with a consortium of leading IDM, OEM, OSAT, material suppliers and academic/institutes.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131004995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3