M. Cole, J. Demaree, C. Hubbard, M. Wood, M. Ervin
{"title":"Novel Ni-based ohmic contacts to n-SiC for high temperature and high power device applications","authors":"M. Cole, J. Demaree, C. Hubbard, M. Wood, M. Ervin","doi":"10.1109/LECHPD.2002.1146733","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146733","url":null,"abstract":"Novel Pt/Ti/WSi/Ni composite ohmic contacts to n-SiC were investigated as a function of annealing temperatures up to 1000/spl deg/C. The onset of ohmic behavior occurred after annealing at 900/spl deg/C. Annealing at temperatures between 950 and 1000/spl deg/C yielded excellent ohmic behavior. At these temperatures the contact-SiC interface was smooth, defect free and characterized by a narrow Ni/sub 2/Si reaction region. The annealed contacts possessed smooth surface morphologies and exhibited minimal contact expansion. The residual carbon, resultant from SiC decomposition, was constrained by reaction with the WSi and Ti metallization layers forming carbide phases of W and Ti. The locations of the carbide phases were spatially distant from the metal semiconductor interface. The anneal optimized (annealed at 950 and 1000/spl deg/C for 30 s) Pt/Ti/WSi/Ni ohmic contacts to n-SiC were evaluated for thermal stability via pulsed/cyclic thermal fatigue and aging experiments at 650/spl deg/C. Negligible changes in the electrical properties, microstructure, and surface morphology/roughness were observed for both annealed ohmic contacts in response to 100 cycles of acute cyclic thermal fatigue. Aging of the 950/spl deg/C annealed contact for 75 hours at 650/spl deg/C resulted in electrical failure and chemical interdiffusion/reaction between the contact and SiC substrate. The 1000/spl deg/C annealed contact retained omicity after 100 h of aging and was found to be chemically and microstructurally stable. These findings indicate that the 1000/spl deg/C annealed Pt/Ti/WSi/Ni ohmic contact to n-SiC is thermally stable and merits strong, potential for utilization in high temperature and pulsed power devices.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126493483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The status of fiber optics","authors":"D. Welch","doi":"10.1109/LECHPD.2002.1146727","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146727","url":null,"abstract":"This paper gives a general review of the historical development and current status of the fiber optic industry. It encompasses such technical topics as erbium doped fiber amplifiers (EDFA), semiconductor lasers, dense wavelength division multiplexed (DWDM) systems, fiber networks, LiNbO based modulators, and dispersion compensation. In addition, it discussed the economic infrastructure of the fiber optics industry and the role played by basic materials and device development.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126651650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
V. Paidi, S. Xie, R. Coffie, Utkarsh Mishra, S. Long, M. Rodwell
{"title":"Simulations of high linearity and high efficiency of class B power amplifiers in GaN HEMT technology","authors":"V. Paidi, S. Xie, R. Coffie, Utkarsh Mishra, S. Long, M. Rodwell","doi":"10.1109/LECHPD.2002.1146737","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146737","url":null,"abstract":"We describe the design and simulation of highly linear and highly efficient common source class B power amplifiers. Efficient broadband class B push-pull amplifiers are not feasible at microwave frequencies as baluns with desired broadband even-mode impedance are unavailable. We find, however, that a single-ended class B amplifier with bandpass filtering has an equivalent efficiency and linearity. Simulations of class B designs predict a power added efficiency (PAE) of 48% with 40 dBc of third order intermodulation product (IMD3) performance when biased close to the pinch-off voltage.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116089861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Kuliev, V. Kumar, R. Schwindt, D. Selvanathan, A. Dabiran, P. Chow, I. Adesida
{"title":"Effect of recess length on DC and RF performance of gate-recessed AlGaN/GaN HEMTs","authors":"A. Kuliev, V. Kumar, R. Schwindt, D. Selvanathan, A. Dabiran, P. Chow, I. Adesida","doi":"10.1109/LECHPD.2002.1146784","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146784","url":null,"abstract":"We present the effect of gate-recess length on DC and RF performance of AlGaN/GaN gate-recessed HEMTs. 0.15 /spl mu/m gate-length AlGaN/GaN HEMTs with varying gate-recess lengths were fabricated. DC and microwave performance did not exhibit significant dependence on the gate-recess length. We attribute these results to essentially identical series source resistances, so that all the gate-recessed HEMTs exhibited similar DC and RF performance. This conclusion is derived from the fact that the values of ohmic contact resistances dominated over the values of channel resistances. The nature of the breakdown in the HEMTs was also studied. The results of temperature-dependent breakdown voltage measurements suggest that the breakdown mechanism was mainly due to tunneling gate leakage currents via shallow traps.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116104323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yun Wei, K. Sundararajan, M. Urteaga, Z. Griffith, D. Scott, V. Paidi, N. Parthasarathy, M. Rodwell
{"title":"40 GHz MMIC power amplifier in InP DHBT technology","authors":"Yun Wei, K. Sundararajan, M. Urteaga, Z. Griffith, D. Scott, V. Paidi, N. Parthasarathy, M. Rodwell","doi":"10.1109/LECHPD.2002.1146774","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146774","url":null,"abstract":"We report a 40 GHz MMIC power amplifier in InP DHBT technology that exhibits 14 dBm output power at 1 dB gain compression and 17 dBm saturated output power with 4 dB associated gain. The small-signal power gain is 6.8 dB, the input return loss is less than -20 dB and the output return loss is less than -6 dB. The peak power added efficiency is 12.5%.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132627481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Pala, S. Rumyantsev, R. Gaska, M. Shur, J. Yang, X. Hu, G. Simin, M.A. Khan
{"title":"Low frequency noise in Al/sub 0.4/Ga/sub 0.6/N thin films","authors":"N. Pala, S. Rumyantsev, R. Gaska, M. Shur, J. Yang, X. Hu, G. Simin, M.A. Khan","doi":"10.1109/LECHPD.2002.1146746","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146746","url":null,"abstract":"Low-frequency noise in Al/sub 0.4/GaN/sub 0.6/ thin films (50 nm) was measured at room and elevated temperatures as a function of gate and drain voltages. Both 1/f noise and generation-recombination (g-r) noise were observed. The Hooge parameter, /spl alpha/, was estimated to be about 7. The activation energy for observed g-r noise was found to be E/sub a//spl sim/1.0 eV. This activation energy is consistent, with the activation energy observed for g-r noise in AlGaN/GaN HFETs.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117148474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Dashiell, A.T. Kalambur, R. Leeson, K.J. Roe, J. Rabolt, J. Kolodzey
{"title":"The electrical effects of DNA as the gate electrode of MOS transistors","authors":"M. Dashiell, A.T. Kalambur, R. Leeson, K.J. Roe, J. Rabolt, J. Kolodzey","doi":"10.1109/LECHPD.2002.1146761","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146761","url":null,"abstract":"The gate conductor material affects the threshold voltage of metal-oxide-semiconductor (MOS) transistors through the influence of the electrochemical work function and electric charge. Measurements of the threshold voltage from current voltage characteristics may therefore provide a method to estimate the electronic properties of biomolecules located on the gate electrode. We have deposited DNA from the corn genome onto the gate oxide of Si nMOS transistors and measured the effects on the current-voltage characteristics. We found that the DNA decreased the drain-source current compared to devices with clean gate oxides and pure buffer solutions. The threshold voltage was extracted by current-voltage measurements in the linear operating region and was found to increase by +1.9 volts after application of the DNA specimen, a value consistent with the expected negative charge density. This large change suggests that MOS devices may be useful as sensitive bioelectronic detectors.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"2020 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123134234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Professor Lester F. Eastman","authors":"M. Shur","doi":"10.1109/LECHPD.2002.1146723","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146723","url":null,"abstract":"A brief biography of Professor Lester F. Eastman is given highlighting his professional achievements. Professor Eastman is one of the world leaders in the physics and technology of compound semiconductor materials and devices. He has invented, fabricated, and investigated many novel semiconductor materials and devices, and his work on so many occasions has resulted in breakthroughs enabling important practical applications. The best solid-state device groups have followed his ideas with great success, and his former students and associates work in leadership positions in hundreds of leading companies, research laboratories and Universities in the United States and around the globe.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127034528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
G. Bu, D. Čiplys, M. Shur, R. Gaska, R. Rimeika, A. Khan, J. Yang
{"title":"CCD measurements of guided optical mode attenuation in GaN layers","authors":"G. Bu, D. Čiplys, M. Shur, R. Gaska, R. Rimeika, A. Khan, J. Yang","doi":"10.1109/LECHPD.2002.1146759","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146759","url":null,"abstract":"The wide band gap and strong piezoelectric effects make GaN-based materials attractive for visible and ultraviolet optoelectronic applications, especially for optical integration devices. The optical waveguide is a fundamental component of integrated optical devices. The measurement of the propagation loss is essential for waveguide characterization, where the loss is due to absorption and scattering. The conventional methods require the measurement of the absolute optical power, polishing of sample edges, and, sometimes, the sliding of a coupling prism. Therefore, the conventional techniques are not very convenient or controllable. In this paper, a straightforward method has been proposed to characterize the attenuation of guided modes in GaN layer by employing a CCD system. As an optical mode propagates in the waveguide, the light is scattered and a characteristic light track appears on the waveguide surface. It is assumed that the scattered light is proportional to the guided mode intensity. By taking a digital picture of the track for each guided mode, the light intensity variation along the track is obtained. We used this technique to measure the attenuation of guided optical modes in multi-mode GaN layers grown by MOCVD on (0001) sapphire substrates. The results demonstrate that the CCD technique is a fast, convenient and reliable method to characterize attenuation in optical waveguides.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128766585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Digital etching for highly reproducible low damage gate recessing on AlGaN/GaN HEMTs","authors":"D. Buttari, S. Heikman, S. Keller, U. Mishra","doi":"10.1109/LECHPD.2002.1146788","DOIUrl":"https://doi.org/10.1109/LECHPD.2002.1146788","url":null,"abstract":"A room temperature digital etching technique for aluminum gallium nitride has been developed. An oxidizing agent and an acid have been used in a two step etching cycle to remove aluminum gallium nitride in approximately 5-6 /spl Aring/ increments. The process has been characterized to be reasonably linear and highly repeatable, offering an alternative to currently not available gate recess etch stopper technologies. Recessed gate Al/sub 0.35/Ga/sub 0.65/N/GaN HEMTs on sapphire were compared to unrecessed devices realized on the same sample. A fivefold gate leakage decrease and negligible variations on breakdown voltage support digital recessing as a viable solution for highly reproducible low surface-damage gate recessed structures.","PeriodicalId":137839,"journal":{"name":"Proceedings. IEEE Lester Eastman Conference on High Performance Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131220453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}