Effect of recess length on DC and RF performance of gate-recessed AlGaN/GaN HEMTs

A. Kuliev, V. Kumar, R. Schwindt, D. Selvanathan, A. Dabiran, P. Chow, I. Adesida
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引用次数: 6

Abstract

We present the effect of gate-recess length on DC and RF performance of AlGaN/GaN gate-recessed HEMTs. 0.15 /spl mu/m gate-length AlGaN/GaN HEMTs with varying gate-recess lengths were fabricated. DC and microwave performance did not exhibit significant dependence on the gate-recess length. We attribute these results to essentially identical series source resistances, so that all the gate-recessed HEMTs exhibited similar DC and RF performance. This conclusion is derived from the fact that the values of ohmic contact resistances dominated over the values of channel resistances. The nature of the breakdown in the HEMTs was also studied. The results of temperature-dependent breakdown voltage measurements suggest that the breakdown mechanism was mainly due to tunneling gate leakage currents via shallow traps.
凹槽长度对栅极凹槽AlGaN/GaN hemt直流和射频性能的影响
我们研究了栅极凹槽长度对AlGaN/GaN栅极凹槽hemt直流和射频性能的影响。制备了不同栅极凹槽长度的栅极长度为0.15 /spl mu/m的AlGaN/GaN hemt。直流和微波性能对栅极凹槽长度没有显著的依赖性。我们将这些结果归因于基本上相同的串联源电阻,因此所有栅极嵌入式hemt都具有相似的直流和射频性能。这一结论是由欧姆接触电阻的值大于通道电阻的值这一事实得出的。还研究了hemt击穿的性质。温度相关的击穿电压测量结果表明,击穿机制主要是由于隧道栅泄漏电流通过浅阱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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