IEEE\/ASME Journal of Microelectromechanical Systems最新文献_第5页

Fabrication and characterization of a micromechanical sensor for differential detection of nanoscale motions 用于纳米级运动差分检测的微机械传感器的制造与表征

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805057

C. Savran, A. Sparks, J. Sihler, Jian Li, Wangsong Wu, Dean Berlin, T. Burg, J. Fritz, M. Schmidt, S. Manalis

引用次数: 40

Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces 静电与粘接合力作用下微悬臂梁的力学

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805047

J. Knapp, M. P. Boer

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引用次数: 115

Design, fabrication, and testing of an electrohydrodynamic ion-drag micropump 电流体动力离子拖微泵的设计、制造和测试

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805046

J. Darabi, M. Rada, M. Ohadi, J. Lawler

{"title":"Design, fabrication, and testing of an electrohydrodynamic ion-drag micropump","authors":"J. Darabi, M. Rada, M. Ohadi, J. Lawler","doi":"10.1109/JMEMS.2002.805046","DOIUrl":"https://doi.org/10.1109/JMEMS.2002.805046","url":null,"abstract":"This paper presents the design, fabrication, and testing of a novel electrohydrodynamic (EHD) ion-drag micropump. In order to maximize the electrical field gradients that are responsible for EHD pumping, we incorporated three-dimensional (3-D) triangular bumps of solder as part of the EHD electrodes. To form these bumps, Niobium was sputter-deposited onto a ceramic substrate, coated with photoresist, optically exposed and etched using a reactive ion etcher to define the electrode pattern. The substrate was then \"dipped\" into a molten solder pool. Since the solder adheres only to the metallic film, bumps of solder form on the electrodes, giving the electrodes a significant 3-D character. The overall dimensions of the micropump are 19 mm /spl times/ 32 mm /spl times/ 1.05 mm. Four different designs were fabricated and tested. Static pressure tests were performed with a 3M Thermal Fluid (HFE-7100) as the working fluid and the optimum design was identified. The results with the thermal fluid were highly promising and indicated a pumping head of up to 700 Pa at an applied voltage of 300 V. The experimental results for the four different designs show that the presence of the 3-D bump structures significantly improves the pumping performance. Also, a much better pumping performance was obtained with the micropump in which the emitter had a saw-tooth shape.","PeriodicalId":13438,"journal":{"name":"IEEE\\/ASME Journal of Microelectromechanical Systems","volume":"85 1","pages":"684-690"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89032908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

A MEMS piggyback actuator for hard-disk drives 一种用于硬盘驱动器的MEMS背负式驱动器

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805054

H. Toshiyoshi, M. Mita, H. Fujita

引用次数: 44

Electrically tunable collective response in a coupled micromechanical array 耦合微机械阵列中的电调谐集体响应

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805056

E. Buks, M. Roukes

引用次数: 149

Piezoresistive accelerometers for MCM package 用于MCM封装的压阻式加速度计

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2002-12-16 DOI: 10.1109/JMEMS.2002.805213

J. Plaza, A. Collado, E. Cabruja, J. Esteve

引用次数: 54

Miniaturization and integration of photoacoustic detection with a microfabricated chemical reactor system 光声探测与微型化学反应器系统的小型化与集成化

IEEE\/ASME Journal of Microelectromechanical Systems Pub Date : 2001-06-01 DOI: 10.1007/978-94-017-2264-3_10

S. Firebaugh, K. Jensen, M. Schmidt

引用次数: 47