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IEEE Transactions on Dielectrics and Electrical Insulation最新文献

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Mechanism of Cathode Microcrater Formation under Vacuum Arc Based on Smoothed Particle Hydrodynamics Method 基于平滑粒子流体力学方法的真空电弧下阴极微凹坑形成机制
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-25 DOI: 10.1109/tdei.2024.3433828
Yingyao Zhang, Yuan Ma, Shuai Lei, Zhikang Yuan, Lijun Jin
{"title":"Mechanism of Cathode Microcrater Formation under Vacuum Arc Based on Smoothed Particle Hydrodynamics Method","authors":"Yingyao Zhang, Yuan Ma, Shuai Lei, Zhikang Yuan, Lijun Jin","doi":"10.1109/tdei.2024.3433828","DOIUrl":"https://doi.org/10.1109/tdei.2024.3433828","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"93 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enhancing Surface Insulation Performance of Ceramic for Spark Plug by APPJ Treatment 通过 APPJ 处理提高火花塞用陶瓷的表面绝缘性能
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/tdei.2024.3433323
Xinglei Cui, Runhua Li, Chengshuo Huang, Xi Zhu, Zhi Fang
{"title":"Enhancing Surface Insulation Performance of Ceramic for Spark Plug by APPJ Treatment","authors":"Xinglei Cui, Runhua Li, Chengshuo Huang, Xi Zhu, Zhi Fang","doi":"10.1109/tdei.2024.3433323","DOIUrl":"https://doi.org/10.1109/tdei.2024.3433323","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"191 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Moisture-Diffusion Behavior in Oil–Paper Insulation Based on Terahertz Time–Frequency Technology 基于太赫兹时频技术的油纸绝缘中的湿气扩散行为
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/TDEI.2024.3432489
Yuxin He;Lijun Yang;Xiong Liu;Li Cheng;Meicun Kang;Yong Li
{"title":"Moisture-Diffusion Behavior in Oil–Paper Insulation Based on Terahertz Time–Frequency Technology","authors":"Yuxin He;Lijun Yang;Xiong Liu;Li Cheng;Meicun Kang;Yong Li","doi":"10.1109/TDEI.2024.3432489","DOIUrl":"10.1109/TDEI.2024.3432489","url":null,"abstract":"Moisture content significantly impacts the electrical strength of oil-paper insulation. Acquiring moisture content accurately and promptly at different points in oil-paper insulation is crucial to assess the risks associated with oil-filled equipment. Moisture primarily resides in the insulating paper within oil-paper insulation, and the change in moisture content in pressboard is a dynamic process, especially after localized dampening. Besides the exchanges between oil and paper, the predominant movement of moisture occurs within different regions of the insulating paper. Previous studies have primarily focused on moisture exchange at the interface between insulating paper and insulating oil. Due to the lack of nondestructive testing methods, exploration of the migration and diffusion of moisture within the internal structure of insulating pressboard is limited. This aspect is pivotal for accurately assessing moisture distribution within the insulation, thereby directly influencing the evaluation of insulation risks. In this study, the rapid and nondestructive sensing capabilities of terahertz (THz) spectroscopy are used to quantify moisture content in solid insulation. The integral value of the absorption coefficient spectrum within the frequency range of 0.3–1 THz serves as a characteristic parameter for quantifying moisture content in insulating paper. A 2-D moisture-diffusion model for localized dampening in pressboard is established based on the Fick model. Using this approach, the diffusion behavior of localized dampening in new and aged oil-impregnated pressboard is demonstrated, and the diffusion coefficient within the pressboard is calculated. A relationship between this coefficient and moisture concentration is determined. Finally, the obtained diffusion coefficient is used to numerically deduce 3-D localized moisture-diffusion behavior within the pressboard.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2621-2631"},"PeriodicalIF":2.9,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Aging State Evaluation of Oil-Paper Insulation Based on Electro-Mechanical Impedance Technology 基于机电阻抗技术的油纸绝缘老化状态评估
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/TDEI.2024.3433321
Xiujun Huang;Shengchang Ji;Mingyang Xu;Fan Zhang
{"title":"Aging State Evaluation of Oil-Paper Insulation Based on Electro-Mechanical Impedance Technology","authors":"Xiujun Huang;Shengchang Ji;Mingyang Xu;Fan Zhang","doi":"10.1109/TDEI.2024.3433321","DOIUrl":"10.1109/TDEI.2024.3433321","url":null,"abstract":"The oil-paper insulation’s aging can deteriorate the mechanical and electrical performance of the electrical power device; thus, it is necessary to evaluate the aging state of oil-paper insulation. Based on the electro-mechanical impedance technology, a novel aging state evaluation method of oil-paper insulation is proposed in this letter, which utilizes the piezoelectricity caused by the insulating paper attached to the piezoelectric material (PZT). The electro-mechanical model of the paper-PZT system is established considering the electric-vibration coupling effect and its characteristics are analyzed using the principle of stationary action. The insulating paper with different aging states, indicated by the degree of polymerization (DP), is selected to obtain the impedance characteristics of the paper-PZT system. The experimental results show the impedance amplitudes of the paper-PZT system increase with the aging degree, which can help in the nondestructive aging evaluation of the oil-paper insulation.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2853-2856"},"PeriodicalIF":2.9,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Bending Deformation on Electrical Tree Properties of Polypropylene Copolymer and Blend Insulation for HVDC Cables 弯曲变形对高压直流电缆用聚丙烯共聚物和混合物绝缘层电树特性的影响
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432092
Boxue Du, Guoning Sun, Heyu Wang, Zhonglei Li
{"title":"Effect of Bending Deformation on Electrical Tree Properties of Polypropylene Copolymer and Blend Insulation for HVDC Cables","authors":"Boxue Du, Guoning Sun, Heyu Wang, Zhonglei Li","doi":"10.1109/tdei.2024.3432092","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432092","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"48 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design Space Optimization for Eradication of NDR Effect in Dielectric/Ferroelectric Stacked Negative Capacitance Multi-Gate FETs at Sub-3nm Technology for Digital/Analog/RF Applications 优化设计空间，消除 3 纳米以下技术中用于数字/模拟/射频应用的介电/费电叠层负电容多栅极场效应晶体管中的 NDR 效应
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432088
Sresta Valasa, Venkata Ramakrishna Kotha, Shubham Tayal, Narendar Vadthiya
{"title":"Design Space Optimization for Eradication of NDR Effect in Dielectric/Ferroelectric Stacked Negative Capacitance Multi-Gate FETs at Sub-3nm Technology for Digital/Analog/RF Applications","authors":"Sresta Valasa, Venkata Ramakrishna Kotha, Shubham Tayal, Narendar Vadthiya","doi":"10.1109/tdei.2024.3432088","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432088","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"15 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electric Field Regulation of DC-GIS Spacer by Surface Conductivity Gradient Coatings under Variable Temperature Gradients 不同温度梯度下通过表面电导率梯度涂层调节直流-地理信息系统垫片的电场
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432100
H. Yao, B. X. Du, H. C. Liang, L. C. Hao, Y. X. Wang
{"title":"Electric Field Regulation of DC-GIS Spacer by Surface Conductivity Gradient Coatings under Variable Temperature Gradients","authors":"H. Yao, B. X. Du, H. C. Liang, L. C. Hao, Y. X. Wang","doi":"10.1109/tdei.2024.3432100","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432100","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"34 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Relationship Between Prestress Breakdown and Space Charge in Micrometer-Thin Metalized Polymer Films 微米级金属化聚合物薄膜中的预应力破坏与空间电荷之间的关系
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/TDEI.2024.3432097
Jiachen Li;Feihu Zheng;Shijie Chen
{"title":"Relationship Between Prestress Breakdown and Space Charge in Micrometer-Thin Metalized Polymer Films","authors":"Jiachen Li;Feihu Zheng;Shijie Chen","doi":"10.1109/TDEI.2024.3432097","DOIUrl":"10.1109/TDEI.2024.3432097","url":null,"abstract":"Micrometer-thin polymer films often endure harsh operating environments such as high electric fields and high temperatures, when utilized as insulating or capacitive media. These conditions may cause significant space charge accumulation, potentially leading to premature breakdown of the film. However, due to the limitations in space charge measurement techniques, there are few reports on the relationship between space charge accumulation and prestress breakdown in micrometer thin films. In this work, the relationship between the space charge and the prestress failure in double-sided metalized biaxially oriented polypropylene (BOPP) film with a thickness of \u0000<inline-formula> <tex-math>$3.8~mu $ </tex-math></inline-formula>\u0000m is investigated. Both dc prestress treatment and breakdown testing of the thin films are conducted using a ball plate electrode. The Weibull breakdown distribution illustrates the impact of prestress voltage and duration on the breakdown strength of the thin films. The residual electric field of the films, induced by space charge accumulation during prestress treatment, is measured using the thermal pulse method (TPM). The data indicate that the breakdown strength of the samples subjected to prestress treatment decreases, with the degree of decrease in breakdown strength basically consistent with the highest residual electric field of prestress treatment in numerical values. This experimentally demonstrates that the accumulation of space charges is the direct cause of the decrease in breakdown field strength in micrometer-thin films.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2389-2397"},"PeriodicalIF":2.9,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Aging Characteristics of New Insulating Oil-Bamboo Paper Composite Material 新型绝缘油-竹纸复合材料的热老化特性
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-19 DOI: 10.1109/tdei.2024.3431469
Qingyu Wang, Rui Wang, Tianlei Xu, Songbo Tian, Dingxin Wei, Zongren Peng, Peng Liu, Xiaoyu Zhou
{"title":"Thermal Aging Characteristics of New Insulating Oil-Bamboo Paper Composite Material","authors":"Qingyu Wang, Rui Wang, Tianlei Xu, Songbo Tian, Dingxin Wei, Zongren Peng, Peng Liu, Xiaoyu Zhou","doi":"10.1109/tdei.2024.3431469","DOIUrl":"https://doi.org/10.1109/tdei.2024.3431469","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"26 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141745118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improvement of Nonlinear Conductivity and Flashover Characteristics of SiC/LDPE Composite Via the DC Electric Field Assist 通过直流电场辅助改善 SiC/LDPE 复合材料的非线性传导性和闪变特性
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-19 DOI: 10.1109/tdei.2024.3431467
Yongsen Han, Jie Chen, Hang Yin, Yunlong Sun, Xinyu Wang, Zhonghua Li
{"title":"Improvement of Nonlinear Conductivity and Flashover Characteristics of SiC/LDPE Composite Via the DC Electric Field Assist","authors":"Yongsen Han, Jie Chen, Hang Yin, Yunlong Sun, Xinyu Wang, Zhonghua Li","doi":"10.1109/tdei.2024.3431467","DOIUrl":"https://doi.org/10.1109/tdei.2024.3431467","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"14 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141745116","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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