{"title":"IEEE Transactions on Dielectrics and Electrical Insulation Information for Authors","authors":"","doi":"10.1109/TDEI.2025.3551404","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3551404","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"C4-C4"},"PeriodicalIF":2.9,"publicationDate":"2025-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10947663","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143783202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Transactions on Dielectrics and Electrical Insulation Publication Information","authors":"","doi":"10.1109/TDEI.2025.3551410","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3551410","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"C2-C2"},"PeriodicalIF":2.9,"publicationDate":"2025-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10947643","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143761565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Dielectrics and Electrical Insulation Society Information","authors":"","doi":"10.1109/TDEI.2025.3551408","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3551408","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"C3-C3"},"PeriodicalIF":2.9,"publicationDate":"2025-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10947667","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143783270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Generating Method for UHF Maps of Epoxy Surface Discharge Based on the Multiscale Simulation System","authors":"Zhaoqi Zhang;Hui Song;Jiejie Dai;Lingen Luo;Gehao Sheng;Xiuchen Jiang","doi":"10.1109/TDEI.2025.3540000","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3540000","url":null,"abstract":"The ultrahigh-frequency (UHF) maps are often used as an important basis to evaluate the insulation status. However, the current research is mostly driven by pure data, making it difficult to judge the actual status of defects through UHF maps. Multiscale simulation technologies are adopted to simulate the UHF maps of surface defects from physical mechanisms. The microprocess of surface discharge is simulated using the plasma model, and the electromagnetic (EM) signal amplitudes are calculated based on the finite-difference time-domain (FDTD) method, using the current in the microsimulation as an excitation. Then, the segmented equivalent parameters of the circuit model are solved using the microsimulation results. The phases of the UHF pulses are simulated in the circuit model, and the UHF maps are obtained combined with the signal amplitude. It is found that the undischarged segment resistance determines the voltage recovery time, which is a key parameter that affects the UHF maps. The random settings of the simulation are important factors making the simulation results more reasonable. The relationship between the microprocess of surface discharge and the UHF maps is established theoretically, providing a basis for the accurate assessment of the insulation defect status of power equipment.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"859-868"},"PeriodicalIF":2.9,"publicationDate":"2025-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143761394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Evidently Retarded Degradation in Breakdown Strength of Polypropylene Eco-Friendly Cable Insulation From Trace Self-Grown γ-Crystals During Thermal Aging","authors":"Kangning Wu;Haoran Sui;Yongruo Ren;Kai Yang;Peng Zhao;Benhong Ouyang;Huan Li;Xu Zhang;Li Ran;Jianying Li","doi":"10.1109/TDEI.2025.3540004","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3540004","url":null,"abstract":"Recyclable thermoplastic polypropylene (PP) cable insulation with excellent performances is expected to represent traditional thermoset cross-linked polyethylene (XLPE) insulation. However, the poor resistance to thermal aging of PP-based cable insulation is generally considered as an obstacle limiting their practical applications. In this article, trace self-grown <inline-formula> <tex-math>$gamma $ </tex-math></inline-formula>-crystals of PP were accidentally found in impact PP copolymer (IPC) cable insulation during thermal aging, which evidently retarded degradation in breakdown strength caused by decline in crystallinity. The unexpected growth of <inline-formula> <tex-math>$gamma $ </tex-math></inline-formula>-crystals is further proven to be facilitated by crystalline ethylene segments from rubber phases and those blocked in PP chains. As a result, more deep traps are introduced by <inline-formula> <tex-math>$gamma $ </tex-math></inline-formula>-crystals that are presented as crystalline structure defects. It makes carriers in IPC more difficult to migrate and detrap under external electric field. Therefore, although the crystallinity, which determines the breakdown strength of semi-crystalline polymers, decreases at day 12 of thermal aging, the degradation in breakdown strength is delayed until day 24. The self-grown <inline-formula> <tex-math>$gamma $ </tex-math></inline-formula>-crystals in IPC insulation thus achieve the self-protective resistance against thermal aging. This work provides a new understanding to the effect of elastomers on thermal-aging stability in PP-based eco-friendly power cable insulation.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"815-822"},"PeriodicalIF":2.9,"publicationDate":"2025-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143761462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Transactions on Dielectrics and Electrical Insulation Information for Authors","authors":"","doi":"10.1109/TDEI.2025.3530651","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3530651","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 1","pages":"C4-C4"},"PeriodicalIF":2.9,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10858326","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143360944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Transactions on Dielectrics and Electrical Insulation Publication Information","authors":"","doi":"10.1109/TDEI.2025.3530653","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3530653","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 1","pages":"C2-C2"},"PeriodicalIF":2.9,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10858292","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Dielectrics and Electrical Insulation Society Information","authors":"","doi":"10.1109/TDEI.2025.3530649","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3530649","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 1","pages":"C3-C3"},"PeriodicalIF":2.9,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10858295","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143361034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Self-Clearing Electrode Concept for Dielectric Elastomer Applications Using Single-Wall Carbon Nanotubes Line","authors":"Zihang Xu;Zepeng Lv;Chen Zhang;Kai Wu;Peter Morshuis;Aurore Claverie","doi":"10.1109/TDEI.2025.3530384","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3530384","url":null,"abstract":"For the electronic components made of electroactive polymer (EAP) materials, a breakdown between the compliant electrodes is the main cause of failure. Similar to high-voltage capacitors, a self-clearing mechanism is needed to minimize the probability of a single defect leading to complete failure. In order to meet compliance and self-clearing needs, single-wall carbon nanotube (SWCNT) films are widely used. However, the complex and expensive process of manufacturing of large-area SWCNT film hinders its application in industry. To reduce the usage of SWCNT while maintaining self-clearing properties, a novel stretchable and self-clearing electrode configuration is proposed in this article, using a patterned electrode consisting of carbon black (CB) connected by SWCNT line. A criterion was established for a successful self-clearing process of the SWCNT line electrode. Some key factors affecting the self-clearing properties were investigated. It was found that high breakdown voltage and thin and narrow SWCNT line electrodes are beneficial to the self-clearing success rate. Besides the self-clearing properties, the effect of the size and number of the CB patterns on capacitance retention was studied. After a self-clearing event, part of the active area of the dielectric is lost. The objective is to maximize capacitance retention after a self-clearing event, which was analyzed experimentally and theoretically. Finally, it is suggested how to select the number and area of the patterned CB, making optimal use of the electrode area. This study provides a theoretical and experimental basis for further mass production of carbon-based self-clearing electrodes.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"632-640"},"PeriodicalIF":2.9,"publicationDate":"2025-01-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143761564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Giovana Pereira Dos Santos Lima;Sonia Ait-Amar;Gabriel Vélu
{"title":"Electrical Performance Analysis of Enameled-Extruded Wires Based on Partial Discharges and Voltage Endurance","authors":"Giovana Pereira Dos Santos Lima;Sonia Ait-Amar;Gabriel Vélu","doi":"10.1109/TDEI.2025.3529417","DOIUrl":"https://doi.org/10.1109/TDEI.2025.3529417","url":null,"abstract":"This study aims to explore an economically feasible enameled wire technology based on sol-gel, offering enhanced performance compared to traditional enameled wire. The evaluation involves assessing insulation configurations for copper wires designed for high-temperature applications, with a proposed configuration combining sol-gel solution on enamel and polyphenylene sulfide (PPS) extrusion resins. Electrical performance is compared across these insulation configurations, building upon their demonstrated higher thermal performance in prior research. Experimental data, including partial discharge (PD) parameters, dielectric strength, and electrical aging endurance, are collected from twisted pair samples for each insulation type. Promising results emerge from PD studies, favoring hybrid technology (enameled-extruded wires) over the classical approach polyesterimide (PEI) + polyamide (PAI) enameled wires. Measurements reveal a higher intensity of PDs for classical enameled wires under 3 kV–50 Hz. Moreover, lifespan models under voltage stress indicate that enameled-extruded wires with PPS extruded resin have advantages, withstanding 1525 min compared to 530 min for classical wires under 3 kV–50 Hz. A correlation between lifespan under voltage stress and PD intensity is observed. Furthermore, microfillers on PPS show lower results compared to nonfilled enameled -extruded wire configurations.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"32 2","pages":"1191-1198"},"PeriodicalIF":2.9,"publicationDate":"2025-01-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143783271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}