IEEE Transactions on Dielectrics and Electrical Insulation最新文献

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High-Temperature Polarization Analysis of Polyethylene and Polyethylene- Semicon Bilayers 聚乙烯和聚乙烯-硅双层膜的高温偏振分析
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-29 DOI: 10.1109/TDEI.2024.3434770
Roger C. Walker;Amira B. Meddeb;Steve Perini;Eugene Furman;Michael Norrell;William H. Woodward;Tim Person;Saurav Sengupta;Ramakrishnan Rajagopalan;Michael Lanagan
{"title":"High-Temperature Polarization Analysis of Polyethylene and Polyethylene- Semicon Bilayers","authors":"Roger C. Walker;Amira B. Meddeb;Steve Perini;Eugene Furman;Michael Norrell;William H. Woodward;Tim Person;Saurav Sengupta;Ramakrishnan Rajagopalan;Michael Lanagan","doi":"10.1109/TDEI.2024.3434770","DOIUrl":"10.1109/TDEI.2024.3434770","url":null,"abstract":"Crosslinked polyethylene (XLPE) is a key material for power cables due to its superior performance as electrical insulation. It is co-extruded with a carbon black-filled semiconducting “semicon” polymer layer, which is significantly more conductive than XLPE. Understanding the electrical properties of the XLPE/semicon bilayer and the interface between the layers is critical due to their common use in high-voltage cables, and so, XLPE/semicon bilayers were developed, examined, and compared to XLPE in isolation. These materials were examined using current-voltage and dielectric displacement-voltage [D(P)–E] loop measurements. Current-voltage measurements were meant to examine the changes in leakage current while D(P)–E loops were used to examine the changes in dielectric loss, in both cases due to the addition of the semicon interface. Both techniques were used to analyze the charge transport response and development of space charge polarization in the bulk polymer and across the bilayer interface as a function of polarity at \u0000<inline-formula> <tex-math>$90~^{circ }$ </tex-math></inline-formula>\u0000C. An increase in the apparent conductivity of the XLPE was measured when layered with the semicon, attributed to the increase in charge injection at the XLPE/semicon interface. Additionally, increases in the conductivity were observed with the application of higher electric fields. The addition of the semicon layer resulted in an increase in both the dielectric constant and the dielectric loss, and greater increases in both as the field is increased. Thus, it led to an enhancement in space charge polarization. Based on the experimental measurements from high-voltage D(P)–E loop measurement, a nonlinear circuit model was developed to fit the data and provide a close match to experimental values for resistivity and capacitance. The high-field circuit model was based on forward and reverse biased resistor and diode pathways in parallel with each other and with the bulk damped capacitor, and it predicts space charge limited conduction with a semicon electrode and Poole-Frenkel conduction with a metal electrode, highlighting the importance of interfaces on XLPE insulation performance.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2632-2641"},"PeriodicalIF":2.9,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141868863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Method Based on Stacking-Attention to Find Decomposition Indicators of Discharge Mechanism in C4F7N-CO2-O2 Gas 基于叠加注意力的方法寻找 C4F7N-CO2-O2 气体中放电机制的分解指标
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-29 DOI: 10.1109/TDEI.2024.3434780
Cong Wang;Guangkai Cui;Xuke Gao;Geng Chen;Youping Tu;Zhong Zheng;Hua Jin;Yuan Yang
{"title":"Method Based on Stacking-Attention to Find Decomposition Indicators of Discharge Mechanism in C4F7N-CO2-O2 Gas","authors":"Cong Wang;Guangkai Cui;Xuke Gao;Geng Chen;Youping Tu;Zhong Zheng;Hua Jin;Yuan Yang","doi":"10.1109/TDEI.2024.3434780","DOIUrl":"10.1109/TDEI.2024.3434780","url":null,"abstract":"The correlation between the decomposition products and discharge faults in the electrical equipment with the environmentally friendly insulating gas mixture C4F7N/CO2/O2 remains inadequately revealed and the corresponding characterization methods also need to be determined. In this article, a feature fusion algorithm based on the stacking-attention mechanism is proposed. The ratios of decomposition products from C4F7N/CO2/O2 mixtures in various proportions under different discharge conditions are utilized as the dataset. Multiple feature extraction algorithms are employed as base learners to derive feature subsets from diverse dimensions. Subsequently, these feature subsets are fused using the attention mechanism as the meta-learner, and the contribution of each feature value is determined, thereby identifying the optimal feature subset. Experimental results demonstrate that the optimal feature values extracted by this method, when applied to classification algorithms such as support vector machine (SVM) and artificial neural network (ANN), effectively distinguish between defects including corona discharge, spark discharge, and suspended discharge in environmentally friendly gas-insulated equipment. Based on the decomposition characteristics, the ratios of CO/(C3F6+CF4) and CF4/C3F8 are proposed as diagnostic indicators for identifying discharge faults in engineering applications of C4F7N/CO2/O2 gas-insulated equipment. The research results of this article provide both theoretical and technical support for the operation and maintenance of gas-insulated electrical equipment.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 6","pages":"3110-3119"},"PeriodicalIF":2.9,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141868864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mechanism of Cathode Microcrater Formation under Vacuum Arc Based on Smoothed Particle Hydrodynamics Method 基于平滑粒子流体力学方法的真空电弧下阴极微凹坑形成机制
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-25 DOI: 10.1109/tdei.2024.3433828
Yingyao Zhang, Yuan Ma, Shuai Lei, Zhikang Yuan, Lijun Jin
{"title":"Mechanism of Cathode Microcrater Formation under Vacuum Arc Based on Smoothed Particle Hydrodynamics Method","authors":"Yingyao Zhang, Yuan Ma, Shuai Lei, Zhikang Yuan, Lijun Jin","doi":"10.1109/tdei.2024.3433828","DOIUrl":"https://doi.org/10.1109/tdei.2024.3433828","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"93 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enhancing Surface Insulation Performance of Ceramic for Spark Plug by APPJ Treatment 通过 APPJ 处理提高火花塞用陶瓷的表面绝缘性能
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/tdei.2024.3433323
Xinglei Cui, Runhua Li, Chengshuo Huang, Xi Zhu, Zhi Fang
{"title":"Enhancing Surface Insulation Performance of Ceramic for Spark Plug by APPJ Treatment","authors":"Xinglei Cui, Runhua Li, Chengshuo Huang, Xi Zhu, Zhi Fang","doi":"10.1109/tdei.2024.3433323","DOIUrl":"https://doi.org/10.1109/tdei.2024.3433323","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"191 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769475","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Moisture-Diffusion Behavior in Oil–Paper Insulation Based on Terahertz Time–Frequency Technology 基于太赫兹时频技术的油纸绝缘中的湿气扩散行为
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/TDEI.2024.3432489
Yuxin He;Lijun Yang;Xiong Liu;Li Cheng;Meicun Kang;Yong Li
{"title":"Moisture-Diffusion Behavior in Oil–Paper Insulation Based on Terahertz Time–Frequency Technology","authors":"Yuxin He;Lijun Yang;Xiong Liu;Li Cheng;Meicun Kang;Yong Li","doi":"10.1109/TDEI.2024.3432489","DOIUrl":"10.1109/TDEI.2024.3432489","url":null,"abstract":"Moisture content significantly impacts the electrical strength of oil-paper insulation. Acquiring moisture content accurately and promptly at different points in oil-paper insulation is crucial to assess the risks associated with oil-filled equipment. Moisture primarily resides in the insulating paper within oil-paper insulation, and the change in moisture content in pressboard is a dynamic process, especially after localized dampening. Besides the exchanges between oil and paper, the predominant movement of moisture occurs within different regions of the insulating paper. Previous studies have primarily focused on moisture exchange at the interface between insulating paper and insulating oil. Due to the lack of nondestructive testing methods, exploration of the migration and diffusion of moisture within the internal structure of insulating pressboard is limited. This aspect is pivotal for accurately assessing moisture distribution within the insulation, thereby directly influencing the evaluation of insulation risks. In this study, the rapid and nondestructive sensing capabilities of terahertz (THz) spectroscopy are used to quantify moisture content in solid insulation. The integral value of the absorption coefficient spectrum within the frequency range of 0.3–1 THz serves as a characteristic parameter for quantifying moisture content in insulating paper. A 2-D moisture-diffusion model for localized dampening in pressboard is established based on the Fick model. Using this approach, the diffusion behavior of localized dampening in new and aged oil-impregnated pressboard is demonstrated, and the diffusion coefficient within the pressboard is calculated. A relationship between this coefficient and moisture concentration is determined. Finally, the obtained diffusion coefficient is used to numerically deduce 3-D localized moisture-diffusion behavior within the pressboard.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2621-2631"},"PeriodicalIF":2.9,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Aging State Evaluation of Oil-Paper Insulation Based on Electro-Mechanical Impedance Technology 基于机电阻抗技术的油纸绝缘老化状态评估
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-24 DOI: 10.1109/TDEI.2024.3433321
Xiujun Huang;Shengchang Ji;Mingyang Xu;Fan Zhang
{"title":"Aging State Evaluation of Oil-Paper Insulation Based on Electro-Mechanical Impedance Technology","authors":"Xiujun Huang;Shengchang Ji;Mingyang Xu;Fan Zhang","doi":"10.1109/TDEI.2024.3433321","DOIUrl":"10.1109/TDEI.2024.3433321","url":null,"abstract":"The oil-paper insulation’s aging can deteriorate the mechanical and electrical performance of the electrical power device; thus, it is necessary to evaluate the aging state of oil-paper insulation. Based on the electro-mechanical impedance technology, a novel aging state evaluation method of oil-paper insulation is proposed in this letter, which utilizes the piezoelectricity caused by the insulating paper attached to the piezoelectric material (PZT). The electro-mechanical model of the paper-PZT system is established considering the electric-vibration coupling effect and its characteristics are analyzed using the principle of stationary action. The insulating paper with different aging states, indicated by the degree of polymerization (DP), is selected to obtain the impedance characteristics of the paper-PZT system. The experimental results show the impedance amplitudes of the paper-PZT system increase with the aging degree, which can help in the nondestructive aging evaluation of the oil-paper insulation.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2853-2856"},"PeriodicalIF":2.9,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Bending Deformation on Electrical Tree Properties of Polypropylene Copolymer and Blend Insulation for HVDC Cables 弯曲变形对高压直流电缆用聚丙烯共聚物和混合物绝缘层电树特性的影响
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432092
Boxue Du, Guoning Sun, Heyu Wang, Zhonglei Li
{"title":"Effect of Bending Deformation on Electrical Tree Properties of Polypropylene Copolymer and Blend Insulation for HVDC Cables","authors":"Boxue Du, Guoning Sun, Heyu Wang, Zhonglei Li","doi":"10.1109/tdei.2024.3432092","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432092","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"48 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design Space Optimization for Eradication of NDR Effect in Dielectric/Ferroelectric Stacked Negative Capacitance Multi-Gate FETs at Sub-3nm Technology for Digital/Analog/RF Applications 优化设计空间,消除 3 纳米以下技术中用于数字/模拟/射频应用的介电/费电叠层负电容多栅极场效应晶体管中的 NDR 效应
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432088
Sresta Valasa, Venkata Ramakrishna Kotha, Shubham Tayal, Narendar Vadthiya
{"title":"Design Space Optimization for Eradication of NDR Effect in Dielectric/Ferroelectric Stacked Negative Capacitance Multi-Gate FETs at Sub-3nm Technology for Digital/Analog/RF Applications","authors":"Sresta Valasa, Venkata Ramakrishna Kotha, Shubham Tayal, Narendar Vadthiya","doi":"10.1109/tdei.2024.3432088","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432088","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"15 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electric Field Regulation of DC-GIS Spacer by Surface Conductivity Gradient Coatings under Variable Temperature Gradients 不同温度梯度下通过表面电导率梯度涂层调节直流-地理信息系统垫片的电场
IF 3.1 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/tdei.2024.3432100
H. Yao, B. X. Du, H. C. Liang, L. C. Hao, Y. X. Wang
{"title":"Electric Field Regulation of DC-GIS Spacer by Surface Conductivity Gradient Coatings under Variable Temperature Gradients","authors":"H. Yao, B. X. Du, H. C. Liang, L. C. Hao, Y. X. Wang","doi":"10.1109/tdei.2024.3432100","DOIUrl":"https://doi.org/10.1109/tdei.2024.3432100","url":null,"abstract":"","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"34 1","pages":""},"PeriodicalIF":3.1,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Relationship Between Prestress Breakdown and Space Charge in Micrometer-Thin Metalized Polymer Films 微米级金属化聚合物薄膜中的预应力破坏与空间电荷之间的关系
IF 2.9 3区 工程技术
IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2024-07-22 DOI: 10.1109/TDEI.2024.3432097
Jiachen Li;Feihu Zheng;Shijie Chen
{"title":"Relationship Between Prestress Breakdown and Space Charge in Micrometer-Thin Metalized Polymer Films","authors":"Jiachen Li;Feihu Zheng;Shijie Chen","doi":"10.1109/TDEI.2024.3432097","DOIUrl":"10.1109/TDEI.2024.3432097","url":null,"abstract":"Micrometer-thin polymer films often endure harsh operating environments such as high electric fields and high temperatures, when utilized as insulating or capacitive media. These conditions may cause significant space charge accumulation, potentially leading to premature breakdown of the film. However, due to the limitations in space charge measurement techniques, there are few reports on the relationship between space charge accumulation and prestress breakdown in micrometer thin films. In this work, the relationship between the space charge and the prestress failure in double-sided metalized biaxially oriented polypropylene (BOPP) film with a thickness of \u0000<inline-formula> <tex-math>$3.8~mu $ </tex-math></inline-formula>\u0000m is investigated. Both dc prestress treatment and breakdown testing of the thin films are conducted using a ball plate electrode. The Weibull breakdown distribution illustrates the impact of prestress voltage and duration on the breakdown strength of the thin films. The residual electric field of the films, induced by space charge accumulation during prestress treatment, is measured using the thermal pulse method (TPM). The data indicate that the breakdown strength of the samples subjected to prestress treatment decreases, with the degree of decrease in breakdown strength basically consistent with the highest residual electric field of prestress treatment in numerical values. This experimentally demonstrates that the accumulation of space charges is the direct cause of the decrease in breakdown field strength in micrometer-thin films.","PeriodicalId":13247,"journal":{"name":"IEEE Transactions on Dielectrics and Electrical Insulation","volume":"31 5","pages":"2389-2397"},"PeriodicalIF":2.9,"publicationDate":"2024-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141769478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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