Impact of Combined Current and Voltage Harmonics on the Thermal Behavior of Distribution Transformers: A Coupled Nonuniform Magnetic–Thermal Approach

IF 3.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2025-02-11 DOI:10.1109/TDEI.2025.3540786

Ali Abdali;Akbar Bayat;Payam Javadi;Kazem Mazlumi;Abbas Rabiee

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引用次数: 0

Abstract

Since the insulation state and hotspot temperature (HST) are closely linked, monitoring the thermal condition of distribution transformers (DTs)—critical and costly power grid components—can help prevent failures. This study focuses on accurately predicting the HST in DTs. During the temperature rise test, optical fiber sensors (OFSs) are used to evaluate proposed nonuniform 3-D computational fluid dynamic (CFD)-based models. In contrast to the OFS measurements, the new 3-D CFD-based thermal study displays an error percentage of 0.11% (

$0.1~^{\circ }$

C), indicating the high accuracy and efficiency of the model. Furthermore, the results of nonuniform 3-D CFD-based thermal assessments are validated using thermography for both top-oil temperature and bottom-oil temperature. With an error percentage of <0.65%,> $3.3~^{\circ }$ C,

$7.1~^{\circ }$

C, and

$10.3~^{\circ }$

C more than the previous model without harmonics.

查看原文本刊更多论文

电流和电压组合谐波对配电变压器热行为的影响：一种非均匀磁-热耦合方法

由于绝缘状态和热点温度（HST）密切相关，因此监测配电变压器（dt）的热状态有助于防止故障的发生。配电变压器是电网中重要且昂贵的部件。本研究的重点是如何准确预测dt患者的HST。在温升测试中，光纤传感器（ofs）用于评估所提出的基于非均匀三维计算流体动力学（CFD）的模型。与OFS测量结果相比，新的基于三维cfd的热研究结果的误差百分比为0.11% ($0.1~^{\circ}$ C)，表明该模型具有较高的精度和效率。此外，利用热成像技术对顶油温度和底油温度进行了非均匀三维cfd热评价。误差百分比分别为$3.3~^{\circ}$ C、$7.1~^{\circ}$ C和$10.3~^{\circ}$ C。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程：电子与电气

CiteScore

6.00

自引率

22.60%

发文量

309

审稿时长

5.2 months

期刊介绍： Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.