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2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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2D-FDFD with integrated via model for accurate simulation of PCBs and packages 2D-FDFD集成通孔模型，用于pcb和封装的精确仿真
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2016-12-01 DOI: 10.1109/EDAPS.2016.7874423
S. Muller, M. Swaminathan
{"title":"2D-FDFD with integrated via model for accurate simulation of PCBs and packages","authors":"S. Muller, M. Swaminathan","doi":"10.1109/EDAPS.2016.7874423","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7874423","url":null,"abstract":"This paper proposes a novel approach to directly integrate equivalent circuit models of vias in a 2D finite-differences frequency-domain method for the simulation of PCB and package structures. The via model serves two main purposes. First, it improves the accuracy of simulation results by modeling the modification of the local electric field in the vicinity of the via barrel. Second, it provides the coupling between different cavities, thus allowing to represent and solve a multilayer structure in a single 2D-FDFD system. In comparison to a related approach recently suggested in the literature, the procedure in this paper has two main advantages: First, it allows taking into account via barrel-to-plane capacitances at the proper positions in the equivalent circuit model, thus providing modeling accuracy. Second, its application to arbitrary numbers of cavities is straightforward. Both points are demonstrated with examples, showing good agreement to full-wave results up to 25 GHz.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133732995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The effect of temperature on performance of a RF CMOS power amplifer and bond wires 温度对射频CMOS功率放大器和键合线性能的影响
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2016-12-01 DOI: 10.1109/EDAPS.2016.7874410
T. Kang, Donghwan Seo
{"title":"The effect of temperature on performance of a RF CMOS power amplifer and bond wires","authors":"T. Kang, Donghwan Seo","doi":"10.1109/EDAPS.2016.7874410","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7874410","url":null,"abstract":"In this work, low and high temperature environmental tests were conducted on a switching mode RF CMOS power amplifier according to the MIL-STD-810G standard. The efficiency of the power amplifier was increased by 5% at -32 °C while it was decreased by 4% at 63 °C. In order to determine the influence of interconnects on the performance, the effect of temperature on single bond wires of different lengths was investigated. In results, the S21 parameter (dB) of the bond wires showed a linear and inverse relationship with varying temperature. Compared with the S21 parameter obtained at the standard ambient condition, it was varied by ±7.5 % in the temperature range from -60 °C to 120 °C, which cannot be neglected. Furthermore, it is shown that the electrical loss of interconnects increases with rising temperature because of the thermal expansion and increase in the resistivity.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129956965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
New broadband equalizer optimization technique for digital system designs 数字系统设计中的宽带均衡器优化新技术
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347134
Shaowu Huang, Beomtaek Lee
{"title":"New broadband equalizer optimization technique for digital system designs","authors":"Shaowu Huang, Beomtaek Lee","doi":"10.1109/EPEPS.2015.7347134","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347134","url":null,"abstract":"In this paper, a novel broadband equalizer optimization technique is introduced for digital system designs. Through effectively compensating both conductor loss and dielectric loss, this technique provides a new solution to find optimal equalizer for high speed signaling over printed circuit board (PCB) with continuous time linear equalizer (CTLE) as an application. Simulation results are presented to validate the technique.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129769891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Stability preserving algorithm for model order reduction of active networks 有源网络模型降阶的保持稳定性算法
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347157
X. Deng, B. Nouri, M. Nakhla
{"title":"Stability preserving algorithm for model order reduction of active networks","authors":"X. Deng, B. Nouri, M. Nakhla","doi":"10.1109/EPEPS.2015.7347157","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347157","url":null,"abstract":"A novel projection framework is presented for constructing stable reduced macromodels for stable active linear circuits. Stability preservation is a necessary property for time-domain simulation. The proposed method is based on an efficient algorithm for computing the projection matrices. The validity of the proposed method is demonstrated using numerical example.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130483317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
PEEC macromodels for above plane decoupling capacitors 平面以上去耦电容器的PEEC宏观模型
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347145
X. Fang, T. Makharashvili, A. Ruehli, J. Fan, J. Drewniak, B. Archambeault, M. Cocchini
{"title":"PEEC macromodels for above plane decoupling capacitors","authors":"X. Fang, T. Makharashvili, A. Ruehli, J. Fan, J. Drewniak, B. Archambeault, M. Cocchini","doi":"10.1109/EPEPS.2015.7347145","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347145","url":null,"abstract":"Decoupling capacitors perform an important function in the impedance reduction of power distribution systems. Hence, they are a key part of an electrical model required for the design of such systems. In this paper, we construct circuit models for the capacitors which include the local environment such that the overall PDN model is simplified and it can be considered as decoupled macromodels.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125946226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Automated frequency selection for machine-learning based EH/EW prediction from S-Parameters 基于s参数的机器学习EH/EW预测的自动频率选择
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347128
N. Ambasana, D. Gope, B. Mutnury, G. Anand
{"title":"Automated frequency selection for machine-learning based EH/EW prediction from S-Parameters","authors":"N. Ambasana, D. Gope, B. Mutnury, G. Anand","doi":"10.1109/EPEPS.2015.7347128","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347128","url":null,"abstract":"In the field of High Speed SerDes (HSS) channel analysis and design, the most widely accepted metrics for gauging signal integrity are Time Domain (TD) metrics: Bit Error Rate (BER), Eye-Height (EH) and Eye-Width (EW). With increasing bit-rates, TD simulations are getting compute-time intensive especially as the BER criterion is getting lower. Learning based mapping of Frequency Domain (FD) S-Parameter data to EH/EW in TD provides a fast alternative solution for thorough design-space exploration. A key challenge in this mapping procedure is the identification of the optimal frequency points in the S-Parameter data that are used for training the learning network. This paper outlines a methodology to identify the minimal set of critical frequency points using a Fast Correlation Based Feature (FCBF) selection algorithm. This technique is applied for prediction of EH/EW for a PCIe Gen 3 interface and the prediction accuracy is quantified.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134400033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe 共形屏蔽SiP近场屏蔽效能预测及磁探头测量
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EDAPS.2016.7874412
Ching-Huei Chen, Ying-Cheng Tseng, Tzong-Lin Wu, I. Lin, C. Fu, Kuo-Hsien Liao
{"title":"Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe","authors":"Ching-Huei Chen, Ying-Cheng Tseng, Tzong-Lin Wu, I. Lin, C. Fu, Kuo-Hsien Liao","doi":"10.1109/EDAPS.2016.7874412","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7874412","url":null,"abstract":"This paper presents a fast prediction method to evaluate the near-field shielding effectiveness (SE) for conformal-shielded System-in-Packages (SiP). By revising the typical EM method to meet SiP circumstances, the near-field SE can be quickly estimated. A simple conformal-shielded SiP module is designed. To experimentally verify the proposed method, two kinds of metallic shielding materials, copper and nickel, are sputtered on the module with different coating thicknesses. In the near-field, the measured SE reaches up to 52 dB for 4-μm copper coating as well as 54 dB for 15-μm nickel coating. The predicted results are closely agreed with simulations and measurements from 0.01 and 1 GHz.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129977253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Intelligent rapid investigation of S-parameters (IRIS) s参数智能快速检测(IRIS)
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347130
N. Ambasana, B. Mutnury, D. Gope
{"title":"Intelligent rapid investigation of S-parameters (IRIS)","authors":"N. Ambasana, B. Mutnury, D. Gope","doi":"10.1109/EPEPS.2015.7347130","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347130","url":null,"abstract":"IRIS is a consolidated platform to analyse bulk S-Parameter data, perform operations like termination/renormalization of port impedances, conversion from single-ended to mixed mode, evaluate complex equations in S-Parameters, plug-in, view and record violation of envelopes as defined by SATA, SAS, PCIe & USB spec sheets. It also implements a novel machine-learning based methodology [1] to efficiently bridge Frequency Domain (FD) and Time Domain (TD) by predicting Eye-Height (EH) and Eye-Widths (EW) from S-Parameters.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121040887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Timing skew enabler induced by fiber weave effect in high speed HDMI channel by angle routing technique in 3DFEM 基于角度布线技术的高速HDMI信道中光纤编织效应引起的时序偏差使能器
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347153
Surender Singh, T. Kukal
{"title":"Timing skew enabler induced by fiber weave effect in high speed HDMI channel by angle routing technique in 3DFEM","authors":"Surender Singh, T. Kukal","doi":"10.1109/EPEPS.2015.7347153","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347153","url":null,"abstract":"Fiber skew is one of the most difficult problems to debug. This paper investigates the timing skew problem on high speed, high-definition multimedia interface (HDMI) channel due to the fiber weave effect of Printed circuit board (PCB). This skew causes an asymmetry between the signals in the two lines and converts some of the differential signal into common signal, thereby, distorting the rise time of the differential signal, causing ISI, resulting in the collapse of the eye, and leading to deterministic jitter. In this paper, a method is proposed to minimize intra pair skew and jitter induced by the fiber weave effect. It is a geometry based method to understand the physical degradations in the PCB. The proposed method verified by using the 3DFEM technique in the differential line.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131815214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Statistical analysis via generalized decoupled polynomial chaos 基于广义解耦多项式混沌的统计分析
2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI: 10.1109/EPEPS.2015.7347120
Xiaochen Liu, E. Gad
{"title":"Statistical analysis via generalized decoupled polynomial chaos","authors":"Xiaochen Liu, E. Gad","doi":"10.1109/EPEPS.2015.7347120","DOIUrl":"https://doi.org/10.1109/EPEPS.2015.7347120","url":null,"abstract":"This paper describes a new approach to the statistical characterization of high-speed interconnect circuits. The proposed approach is based on the idea of polynomial chaos and works by decoupling the matrices that arise from the Galerkin projection. The new approach is general in the sense that it can handle any polynomial system used in the generalized polynomial chaos(gPC) framework.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116368156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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