共形屏蔽SiP近场屏蔽效能预测及磁探头测量

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI:10.1109/EDAPS.2016.7874412

Ching-Huei Chen, Ying-Cheng Tseng, Tzong-Lin Wu, I. Lin, C. Fu, Kuo-Hsien Liao

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引用次数: 9

摘要

提出了一种评估共形屏蔽封装系统近场屏蔽效能的快速预测方法。通过对典型的电磁方法进行修正，使其满足SiP条件，可以快速估计出近场SE。设计了一个简单的保形屏蔽SiP模块。为了实验验证所提出的方法，将铜和镍两种金属屏蔽材料溅射在不同涂层厚度的模块上。在近场测量中，4 μm铜涂层的SE可达52 dB, 15 μm镍涂层的SE可达54 dB。预测结果与0.01 GHz和1 GHz的模拟和测量结果非常吻合。

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Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe

This paper presents a fast prediction method to evaluate the near-field shielding effectiveness (SE) for conformal-shielded System-in-Packages (SiP). By revising the typical EM method to meet SiP circumstances, the near-field SE can be quickly estimated. A simple conformal-shielded SiP module is designed. To experimentally verify the proposed method, two kinds of metallic shielding materials, copper and nickel, are sputtered on the module with different coating thicknesses. In the near-field, the measured SE reaches up to 52 dB for 4-μm copper coating as well as 54 dB for 15-μm nickel coating. The predicted results are closely agreed with simulations and measurements from 0.01 and 1 GHz.

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2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

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