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IEEE Transactions on Circuits and Systems I: Regular Papers最新文献

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IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors IEEE电路与系统学报-I：作者的常规论文信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-08-28 DOI: 10.1109/TCSI.2025.3599057
{"title":"IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors","authors":"","doi":"10.1109/TCSI.2025.3599057","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3599057","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 9","pages":"5299-5299"},"PeriodicalIF":5.2,"publicationDate":"2025-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11143802","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144914346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial TCAS-I Special Issue on the ESSERC 2024 Conference ESSERC 2024会议特刊特刊特刊特刊
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-08-28 DOI: 10.1109/TCSI.2025.3589034
Georges Gielen;Jan Craninckx;Hongyang Jia
{"title":"Guest Editorial TCAS-I Special Issue on the ESSERC 2024 Conference","authors":"Georges Gielen;Jan Craninckx;Hongyang Jia","doi":"10.1109/TCSI.2025.3589034","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3589034","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 9","pages":"4406-4407"},"PeriodicalIF":5.2,"publicationDate":"2025-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11143804","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144914205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Circuits and Systems--I: Regular Papers Publication Information IEEE电路与系统汇刊-I：常规论文出版信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-08-28 DOI: 10.1109/TCSI.2025.3599059
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引用次数: 0
Achieving < ±25 ppb Frequency Stability With a ±0.125 °C Oven Control on a Si Interposer for an AlScN-on-Si Shear-BAW Resonator 在用于AlScN-on-Si剪切- baw谐振器的Si中间体上，在±0.125°C的烤箱控制下实现<±25 ppb的频率稳定性
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-08-04 DOI: 10.1109/TCSI.2025.3590669
Everestus Ezike;Ratul Kundu;Shaurya Dabas;Banafsheh Jabbari;Shruti Mishra;Dicheng Mo;Honggyu Kim;Zetian Mi;Roozbeh Tabrizian;Baibhab Chatterjee
{"title":"Achieving < ±25 ppb Frequency Stability With a ±0.125 °C Oven Control on a Si Interposer for an AlScN-on-Si Shear-BAW Resonator","authors":"Everestus Ezike;Ratul Kundu;Shaurya Dabas;Banafsheh Jabbari;Shruti Mishra;Dicheng Mo;Honggyu Kim;Zetian Mi;Roozbeh Tabrizian;Baibhab Chatterjee","doi":"10.1109/TCSI.2025.3590669","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3590669","url":null,"abstract":"A major challenge of long-term clock stability is frequency drift due to temperature variations. This paper describes the design of a proportional, integral, derivative (PID) control system for external ovenization of an AlScN-on-Si Shear-BAW Resonator (S<sup>3</sup>R), which has a fixed turnover temperature where the <inline-formula> <tex-math>$1{^{text {st}}}$ </tex-math></inline-formula> order temperature coefficient of frequency is <inline-formula> <tex-math>$approx 0$ </tex-math></inline-formula> ppm/°C. The control system provides <inline-formula> <tex-math>$pm ~0.125^{circ }$ </tex-math></inline-formula>C temperature stability and assists in achieving better than <inline-formula> <tex-math>$pm ~25$ </tex-math></inline-formula>ppb frequency stability over a temperature range of 15-40°C by maintaining resonator operation near the turnover temperature, where the <inline-formula> <tex-math>$2{^{text {nd}}}$ </tex-math></inline-formula> order temperature coefficient of frequency drift is -62.71ppb/°C<sup>2</sup>. The robust and adaptive PID algorithm (programmed on an external microcontroller unit connected to the interposer) ensures continuous ovenization by configuring the duty cycle of a compact heat actuator (powerMOS) that is placed in <3.5mm> <tex-math>$times 2$ </tex-math></inline-formula>mm resonator and a complementary to absolute temperature sensor (implemented as a 1mm<inline-formula> <tex-math>$times 1$ </tex-math></inline-formula>mm, 65nm integrated circuit), that are all held on a thermally conductive 7mm<inline-formula> <tex-math>$times$ </tex-math></inline-formula>7mm Si interposer.","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 9","pages":"4455-4468"},"PeriodicalIF":5.2,"publicationDate":"2025-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144918190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Circuits and Systems Society Information IEEE电路与系统学会信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-29 DOI: 10.1109/TCSI.2025.3588373
{"title":"IEEE Circuits and Systems Society Information","authors":"","doi":"10.1109/TCSI.2025.3588373","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3588373","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 8","pages":"C3-C3"},"PeriodicalIF":5.2,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11099064","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144725318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
MWSCAS Guest Editorial Special Issue Based on the 67th International Midwest Symposium on Circuits and Systems 基于第67届国际中西部电路与系统研讨会的MWSCAS特刊
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-29 DOI: 10.1109/TCSI.2025.3579508
Marvin Onabajo;Susana Patón;Bibhu Datta Sahoo;Hanjun Jiang
{"title":"MWSCAS Guest Editorial Special Issue Based on the 67th International Midwest Symposium on Circuits and Systems","authors":"Marvin Onabajo;Susana Patón;Bibhu Datta Sahoo;Hanjun Jiang","doi":"10.1109/TCSI.2025.3579508","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3579508","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 8","pages":"3731-3732"},"PeriodicalIF":5.2,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11099040","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144725292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Circuits and Systems--I: Regular Papers Publication Information IEEE电路与系统汇刊-I：常规论文出版信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-29 DOI: 10.1109/TCSI.2025.3588369
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引用次数: 0
IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors IEEE电路与系统学报-I：作者的常规论文信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-29 DOI: 10.1109/TCSI.2025.3588371
{"title":"IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors","authors":"","doi":"10.1109/TCSI.2025.3588371","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3588371","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 8","pages":"4403-4403"},"PeriodicalIF":5.2,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11099067","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144725268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Circuits and Systems Society Information IEEE电路与系统学会信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-01 DOI: 10.1109/TCSI.2025.3580927
{"title":"IEEE Circuits and Systems Society Information","authors":"","doi":"10.1109/TCSI.2025.3580927","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3580927","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 7","pages":"C3-C3"},"PeriodicalIF":5.2,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11061260","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144557860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors IEEE电路与系统学报-I：作者的常规论文信息
IF 5.2 1区 工程技术
IEEE Transactions on Circuits and Systems I: Regular Papers Pub Date : 2025-07-01 DOI: 10.1109/TCSI.2025.3580925
{"title":"IEEE Transactions on Circuits and Systems--I: Regular Papers Information for Authors","authors":"","doi":"10.1109/TCSI.2025.3580925","DOIUrl":"https://doi.org/10.1109/TCSI.2025.3580925","url":null,"abstract":"","PeriodicalId":13039,"journal":{"name":"IEEE Transactions on Circuits and Systems I: Regular Papers","volume":"72 7","pages":"3729-3729"},"PeriodicalIF":5.2,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11061258","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144557769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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