Journal of Micromanufacturing最新文献_第9页

Advanced machining of miniature unmanned aircraft vehicle components using nanostructured cutting tools 基于纳米结构刀具的微型无人机部件先进加工

Journal of Micromanufacturing Pub Date : 2020-09-30 DOI: 10.1177/2516598420931023

M. Jackson, J. Burgess, M. Whitfield, M. Whitt, R. Da-Silva, M. DaSilva, A. Machado, R. Davis

引用次数: 3

Investigations on flexible pad polishing for nano-finishing of freeform optics mold 自由曲面光学模具纳米精加工柔性垫抛光研究

Journal of Micromanufacturing Pub Date : 2020-09-30 DOI: 10.1177/2516598420939740

V. Mishra, D. Burada, V. Karar, A. Manna, S. Jha, G. Khan

{"title":"Investigations on flexible pad polishing for nano-finishing of freeform optics mold","authors":"V. Mishra, D. Burada, V. Karar, A. Manna, S. Jha, G. Khan","doi":"10.1177/2516598420939740","DOIUrl":"https://doi.org/10.1177/2516598420939740","url":null,"abstract":"The need for freeform surfaces are widely recognized in the optical, aerospace, biomedical, and automotive industries. However, the fabrication of freeform surfaces is very difficult and expensive because of the involvement of advanced, multi-axis, dedicated machining processes. In many applications, the machining surface needs further polishing to reduce the surface roughness. The main aim of this work is to investigate the flexible pad polishing process for the finishing of the freeform surface. To achieve this, a flexible pad polishing setup is developed in two-axis configuration that can be integrated with a diamond turning machine or any other computer numerical control (CNC) machine and capable to polish the conventional rotationally symmetric surfaces as well as freeform surfaces. The polishing parameters for the developed polishing head are optimized for the nano-finishing of the freeform mold surface of Stavax ESR steel. The effectiveness of the current polishing setup is demonstrated by measuring the improvement in surface roughness height and profile. Test results reveal that the improvement on the freeform surface is significant, that is, surface roughness (Ra) reduces from 220 nm to 25 nm while keeping the profile within the desired tolerance.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124524196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Geometry and thickness dependant anomalous mechanical behavior of fabricated SU-8 thin film micro-cantilevers SU-8薄膜微悬臂梁的几何和厚度依赖性异常力学行为

Journal of Micromanufacturing Pub Date : 2020-09-10 DOI: 10.1177/2516598420930988

A. Basu, Anup Basak, S. Bhattacharya

{"title":"Geometry and thickness dependant anomalous mechanical behavior of fabricated SU-8 thin film micro-cantilevers","authors":"A. Basu, Anup Basak, S. Bhattacharya","doi":"10.1177/2516598420930988","DOIUrl":"https://doi.org/10.1177/2516598420930988","url":null,"abstract":"SU-8 micro-cantilever arrays consisting of V- and M-shaped structures fabricated using a simplified single hard mask step. Bending tests were performed under similar peak loads (ranging 2–10 µN), with thickness ranging between micron (3.5 µm) and sub-micron (0.2 µm) scales. Various mechanical properties such as stiffness and hysteresis are determined from the load versus deflection curves. When the thickness of the V-shaped beam is decreased from 2 µm to 0.2 µm, the stiffness increases by a factor of 2.7, which is in contradiction with the classical beam theory according to which the stiffness for 0.2 µm beam should be three orders of magnitude less than that of 2 µm beam. Micropolar elasticity theory with a variable-intrinsic length scale (thickness dependant) is used to explain such an anomalous response. Experimentally obtained stiffness of two M-shaped beams of thickness 2 µm and 0.2 µm are almost identical. Reason behind this contradictory result is that the thicker beam has a residual strain with a large plastic deformation which usually increases the cross-linking network density, leading to increase in elastic modulus, hardness and thus stiffness of polymers. But the thinner beam has undergone an elastic deformation. The size effect of V- and M-shaped cantilever beams is discussed.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125186053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach 未切削切屑厚度与边缘半径比对单晶铜纳米级切削行为影响的研究:MD模拟方法

Journal of Micromanufacturing Pub Date : 2020-09-10 DOI: 10.1177/2516598420937638

A. Sharma, Prabhat Ranjan, R. Balasubramaniam

{"title":"Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach","authors":"A. Sharma, Prabhat Ranjan, R. Balasubramaniam","doi":"10.1177/2516598420937638","DOIUrl":"https://doi.org/10.1177/2516598420937638","url":null,"abstract":"Extremely small cutting depths in nanoscale cutting makes it very difficult to measure the thermodynamic properties and understand the underlying mechanism and behavior of workpiece material. Highly precise single-crystal Cu is popularly employed in optical and electronics industries. This study, therefore, implements the molecular dynamics technique to analyze the cutting behavior and surface and subsurface phenomenon in the nanoscale cutting of copper workpieces with a diamond tool. Molecular dynamics simulation is carried out for different ratios of uncut chip thickness (a) to cutting edge radius (r) to investigate material removal mechanism, cutting forces, surface and subsurface defects, material removal rate (MRR), and stresses involved during the nanoscale cutting process. Calculation of forces and amount of plowing indicate that a/r = 0.5 is the critical ratio for which the average values of both increase to maximum. Material deformation mechanism changes from shear slip to shear zone deformation and then to plowing and elastic rubbing as the cutting depth/uncut chip thickness is reduced. The deformation during nano-cutting in terms of dislocation density changes with respect to cutting time. During the cutting process, it is observed that various subsurface defects like point defects, dislocations and dislocation loops, stacking faults, and stair-rod dislocation take place.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114273189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Prediction of tool wear constants for diamond turn machining of CuBe 立方体金刚石车削刀具磨损常数的预测

Journal of Micromanufacturing Pub Date : 2020-07-30 DOI: 10.1177/2516598420930992

A. Sharma, D. Datta, R. Balasubramaniam

{"title":"Prediction of tool wear constants for diamond turn machining of CuBe","authors":"A. Sharma, D. Datta, R. Balasubramaniam","doi":"10.1177/2516598420930992","DOIUrl":"https://doi.org/10.1177/2516598420930992","url":null,"abstract":"While several studies in diamond turning of homogeneous materials like Cu, Al, and Si are well published, there is a lack of understanding about tool wear in case of heterogeneous materials like CuBe. Severity of the tool wear can be understood from the magnitude of the wear coefficients, and the magnitude of these coefficients is influenced by the wear mechanism. Hence, this study is aimed to calculate the wear coefficients from a known tool wear model in diamond turn machining of CuBe. Molecular dynamics simulation (MDS) results show that stress and temperature are responsible for increasing rate of tool wear. From the experimental results, change in the tool cutting edge radius due to wear was obtained and the temperature and stress for various a/r were found out using MDS. With these data, the wear coefficients, A & B, from a wear model for diamond turning were calculated. This methodology of using MDS to obtain stress and temperature for various a/r wherein, values of r are obtained from a single machining trial on actual material, will be useful for calculating the wear coefficients for the combination of single crystal diamond tool with various work piece materials and their activation energies.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116142677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Laser-assisted grinding of reaction-bonded SiC 反应键合SiC的激光辅助磨削

Journal of Micromanufacturing Pub Date : 2020-07-18 DOI: 10.1177/2516598420965342

Xichun Luo, Zhipeng Li, Wenlong Chang, Yukui Cai, Jining Sun, Fei Ding, Fei-hu Zhang, Haitao Liu, Yazhou Sun

引用次数: 5

The importance of wavelength for tight temperature control during μ-laser-assisted machining 在μ激光辅助加工过程中，波长对于严格控制温度的重要性

Journal of Micromanufacturing Pub Date : 2020-05-22 DOI: 10.1177/2516598420917866

A. Dennis, S. Goel, Rajab Al-Sayegh, W. O'Neill

引用次数: 1

Nano-finishing of MEMS-based platforms for optimum optical sensing 基于mems的光学传感平台的纳米精加工

Journal of Micromanufacturing Pub Date : 2020-05-01 DOI: 10.1177/2516598419862676

Ankur Gupta, Poonam Sundriyal, A. Basu, Kapil Manoharan, R. Kant, S. Bhattacharya

{"title":"Nano-finishing of MEMS-based platforms for optimum optical sensing","authors":"Ankur Gupta, Poonam Sundriyal, A. Basu, Kapil Manoharan, R. Kant, S. Bhattacharya","doi":"10.1177/2516598419862676","DOIUrl":"https://doi.org/10.1177/2516598419862676","url":null,"abstract":"Abstract The surface finish of the microelectromechanical systems substrate, particularly the ones that are deployed in chip-based optofluidic systems, is of utmost importance, and the overall surface finish helps in preventing light scattering and associated losses. The proposed system is made up of a microchannel with a coating on its interior which acts as a cladding layer and possesses an air-like refractive index. The water-based solutions with refractive indices higher than the coating, when confined within such channels, act as waveguides with a refractive index difference which would allow grazing incidence at the solution film interface. The microchannel is fabricated over a piece of Si along <100> direction with the help of lithography and wet etching technique. After wet chemical etching of silicon, multiple pyramidal hillocks with overall large surface roughness is observed which are not appropriate for loss-free light transmission and cause various optical losses. So the overall optimization of surface roughness created by the etching processes is critical from an optical standpoint. Roughness in the microchannel surface mainly arises due to wet etching through tetra methyl alcohol, potassium hydroxide, potassium ferricyanide and isopropyl alcohol. In this work, we have obtained surface finish upto ~1.33 nm at an etch rate of 141 nm/min which is obtained by tweaking the composition of the participating reagents in the etchants and also the etching temperature. The surface roughness obtained is quite small in comparison to the wavelength range of the visible spectrum and thus losses were greatly avoided. The low refractive index films over silicon substrate were characterized by field emission scanning electron microscopy, energy dispersive analysis of X-ray, atomic force microscopy, 3D optical profilometry and ellipsometry. The transmission results show that transmission loss was reduced by 27.42% for the coated samples with 33 nm surface roughness as compared to surface with 250 nm roughness.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125984922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Microelectro Discharge Machining: Principles and Applications, by Ajay M. Sidpara and Ganesh Malayath 微电火花加工:原理与应用，Ajay M. Sidpara和Ganesh Malayath著

Journal of Micromanufacturing Pub Date : 2020-05-01 DOI: 10.1177/2516598420917871

M. K. Pradhan, R. Patel

引用次数: 0

Finite element simulations of conventional and ultrasonically assisted turning processes with plane and textured cutting inserts 平面和纹理切削齿的常规和超声辅助车削加工的有限元模拟

Journal of Micromanufacturing Pub Date : 2020-05-01 DOI: 10.1177/2516598419878022

Varun Sharma, P. M. Pandey, U. S. Dixit, A. Roy, V. Silberschmidt

引用次数: 2