Journal of Micromanufacturing最新文献_第10页

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview 用于微电子封装的倒装芯片微凸点的制造工艺:概述

Journal of Micromanufacturing Pub Date : 2020-05-01 DOI: 10.1177/2516598419880124

M. Datta

{"title":"Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview","authors":"M. Datta","doi":"10.1177/2516598419880124","DOIUrl":"https://doi.org/10.1177/2516598419880124","url":null,"abstract":"Abstract Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130263694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Effects of graphene layer and gold nanoparticles on sensitivity of humidity sensors 石墨烯层和金纳米颗粒对湿度传感器灵敏度的影响

Journal of Micromanufacturing Pub Date : 2020-03-25 DOI: 10.1177/2516598419896130

J. Bao, N. Hashemi, Jingshuai Guo, Nicole N. Hashemi

{"title":"Effects of graphene layer and gold nanoparticles on sensitivity of humidity sensors","authors":"J. Bao, N. Hashemi, Jingshuai Guo, Nicole N. Hashemi","doi":"10.1177/2516598419896130","DOIUrl":"https://doi.org/10.1177/2516598419896130","url":null,"abstract":"Abstract Humidity sensors can be used to monitor body sweat. Here, we studied a humidity sensor that comprised of a graphene layer between two electrodes. The operating principle is that the humidity sensor will respond when vapor reaches the graphene layer from the top. Based on the humidity diffusion, the sensor measures the relative humidity (RH) with different response times. Graphene is a material with high diffusivity and small thickness that can increase the sensitivity of a sensor. Based on the micro electro mechanical systems (MEMS) method, we modeled the humidity sensor using COMSOL Multiphysics® transport of diluted species software. Additionally, we used the concentration values from the simulations to determine the relationship between capacitance and relative humidity. The sensitivity was found to be 3.379 × 10−11 pF/%RH for the 4-layer graphene, 1.210 × 10−14 pF/%RH for the 8-layer graphene, and 3.597 × 10−11 pF/%RH for the 16-layer graphene sensor. The sensitivity of 4-layer graphene with gold sensor is 3.872 × 10−13 pF/%RH which is smaller than 4-layer graphene sensor, and graphene with gold nanoparticles shows better response time than 4-layer graphene sensor.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115653710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Magnetically levitated X–Y plane actuator for micromanufacturing 用于微制造的磁悬浮X-Y平面驱动器

Journal of Micromanufacturing Pub Date : 2020-03-17 DOI: 10.1177/2516598419896127

Rahul Seth, Saurav Halder, K. Chatterjee, S. Mandal, Nagahanumaiah

{"title":"Magnetically levitated X–Y plane actuator for micromanufacturing","authors":"Rahul Seth, Saurav Halder, K. Chatterjee, S. Mandal, Nagahanumaiah","doi":"10.1177/2516598419896127","DOIUrl":"https://doi.org/10.1177/2516598419896127","url":null,"abstract":"Abstract The paper presents design and development of a precision motion actuator, which can traverse required trajectory in the X–Y plane and can be used for micromachining applications using magnetic levitation based technology. A glass-reinforced epoxy laminate sheet with micromachined holes in the horizontal and vertical direction with copper wires placed vertically and horizontally was used for actuation of rare earth magnets wherein a pyrolytic graphite sheet was fixed over the copper wires. The diamagnetism of pyrolytic graphite sheet coupled with electromagnetic field generated because of the current passing through the copper wires led to levitation and actuation of the rare earth magnet over desired trajectory. COMSOL Multiphysics (COMSOL Inc., Burlington, Massachusetts, USA) simulation was conducted in order to simulate the forces generated by the developed actuator. Thereafter, the forces generated by the actuator with current flowing through the wires were measured using a dynamometer where the error was limited within 2%. An acrylic sheet was fixed over the actuator and laser micromachining was conducted with trajectories traversed by the actuator. Scanning electron microscope results of the machined samples confirmed that feature sizes in the range of 200–300 micron could be generated. This proves the potential of the developed actuator for micromachining applications.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"85 14","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113970418","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Microfriction stir welding of AA 6061-T6 thin sheets using in-house developed fixture 采用自行研制的夹具对AA 6061-T6薄板进行微摩擦搅拌焊接

Journal of Micromanufacturing Pub Date : 2020-03-17 DOI: 10.1177/2516598419895837

R. Nadda, M. Babal, Nikhil Jalan, C. K. Nirala

引用次数: 1

Micromachining: An overview (Part I) 微机械加工:概述(第一部分)

Journal of Micromanufacturing Pub Date : 2020-03-17 DOI: 10.1177/2516598419895828

V. Jain, R. Balasubramaniam, R. Mote, M. Das, Anuj Sharma, Abhinav Kumar, Vivek Garg, B. Kamaliya

引用次数: 11

Prediction of cutting force in micro-end-milling by a combination of analytical and FEM method 解析法与有限元法相结合的微端铣削切削力预测

Journal of Micromanufacturing Pub Date : 2020-01-21 DOI: 10.1177/2516598419876158

A. Roushan, U. S. Rao, L. Vijayaraghavan

引用次数: 3

A review on micro-electron beam welding with a modernized SEM: Process, applications, trends and future prospect 现代扫描电子显微镜下微细电子束焊接的研究进展:工艺、应用、发展趋势及展望

Journal of Micromanufacturing Pub Date : 2019-08-26 DOI: 10.1177/2516598419855186

A. Kundu, D. K. Pratihar, A. Pal

{"title":"A review on micro-electron beam welding with a modernized SEM: Process, applications, trends and future prospect","authors":"A. Kundu, D. K. Pratihar, A. Pal","doi":"10.1177/2516598419855186","DOIUrl":"https://doi.org/10.1177/2516598419855186","url":null,"abstract":"Abstract Electron beam welding (EBW) is a well-established joining method in the field of manufacturing. If this technology is downscaled to a micro-level (i.e., micro-EBW (µ-EBW)), it will be able to solve a variety of problems. The necessity of adopting µ-EBW technology lies with the fact that it can be used from micro-mechanical fabrication to micro-electronics components joining, micro-electro-mechanical system (MEMS), medical instrument, etc. µ-EBW has some special properties like the possibility of obtaining exact focussing of the beam and conducting measurement up to micrometer level, accurate control of energy input, inertia-free manipulation, high-frequency oscillation movement and ability to work under high vacuum chamber. µ-EBW has several important applications like micro-joining and micro-fabrication, which is welding of dissimilar materials. This article deals with a review of the recent developments, significant applications, and advantages of µ-EBW, multiple modes of joining and also some new technologies such as scanning electron microscope, function generator, control software, etc. Finally, the current challenges of this emerging technology and the scopes for future studies have been presented in this article.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132226335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Numerical modelling of ECMM of micro-dimples considering the effect of 3-phase electrolyte 考虑三相电解液影响的微凹窝ECMM数值模拟

Journal of Micromanufacturing Pub Date : 2019-08-06 DOI: 10.1177/2516598419852208

K. Prashanth, D. Patel, V. Jain, J. Ramkumar

引用次数: 5

Fabrication of micro-mixer on printed circuit board using electrochemical micromachining 利用电化学微加工技术在印刷电路板上制造微型混频器

Journal of Micromanufacturing Pub Date : 2019-07-10 DOI: 10.1177/2516598419838660

J. Singh, S. Bhattacharya

{"title":"Fabrication of micro-mixer on printed circuit board using electrochemical micromachining","authors":"J. Singh, S. Bhattacharya","doi":"10.1177/2516598419838660","DOIUrl":"https://doi.org/10.1177/2516598419838660","url":null,"abstract":"Abstract Electrochemical micromachining (ECMM) has been mostly carried out in situations demanding precision, complexity in the shapes of final components and in case the surface integrity and performance are independent of the machining process. In this work, the following have been demonstrated: The first part of the work demonstrates the experimental setup for ECMM that is used to fabricate a micro-mixer on a printed circuit board (PCB) substrate by using a single point electrochemical machining tool with a tip diameter—150 µm. The method is able to show a promising route of fabrication where the circuit lines on a PCB substrate can be printed with high yield and processing speeds. The second part of the article points out that machining can be carried out on PCB substrates through electrochemical processes using a single point tool and a minimum feature size of 243 µm can be machined with a fine tolerance of 0.025 µm and roughness = 3.0459 µm~7.2404 µm. The third part of the article reports the geometrical parameters of a relatively complex geometry of a micro-mixer which is arrived at through a COMSOL based simulation platform that is fabricated using the mentioned manufacturing process. The process is further validated through the design of experiments, and fluid flow and mixing behaviour on the fabricated structure is evaluated through an epifluorescence microscope. The advantages that this technique may offer is in terms of achieving an overall low feature size in comparison to micro-milling and avoiding the complexities of lithography-driven processes to produce a process which has a much lower equipment dependency, is environmentally benign in comparison to the lithography driven techniques and is overall low in cost.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127603479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Additive manufacturing as an emerging technology for fabrication of microelectromechanical systems (MEMS) 增材制造作为微机电系统(MEMS)制造的新兴技术

Journal of Micromanufacturing Pub Date : 2019-06-17 DOI: 10.1177/2516598419843688

Sanjay Kumar, Pulak Bhushan, Mohit Pandey, S. Bhattacharya

{"title":"Additive manufacturing as an emerging technology for fabrication of microelectromechanical systems (MEMS)","authors":"Sanjay Kumar, Pulak Bhushan, Mohit Pandey, S. Bhattacharya","doi":"10.1177/2516598419843688","DOIUrl":"https://doi.org/10.1177/2516598419843688","url":null,"abstract":"Abstract The recent success of additive manufacturing processes (also called, 3D printing) in the manufacturing sector has led to a shift in the focus from simple prototyping to real production-grade technology. The enhanced capabilities of 3D printing processes to build intricate geometric shapes with high precision and resolution have led to their increased use in fabrication of microelectromechanical systems (MEMS). The 3D printing technology has offered tremendous flexibility to users for fabricating custom-built components. Over the past few decades, different types of 3D printing technologies have been developed. This article provides a comprehensive review of the recent developments and significant achievements in most widely used 3D printing technologies for MEMS fabrication, their working methodology, advantages, limitations, and potential applications. Furthermore, some of the emerging hybrid 3D printing technologies are discussed, and the current challenges associated with the 3D printing processes are addressed. Finally, future directions for process improvements in 3D printing techniques are presented.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123909061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25