A review on micro-electron beam welding with a modernized SEM: Process, applications, trends and future prospect

A. Kundu, D. K. Pratihar, A. Pal
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引用次数: 2

Abstract

Abstract Electron beam welding (EBW) is a well-established joining method in the field of manufacturing. If this technology is downscaled to a micro-level (i.e., micro-EBW (µ-EBW)), it will be able to solve a variety of problems. The necessity of adopting µ-EBW technology lies with the fact that it can be used from micro-mechanical fabrication to micro-electronics components joining, micro-electro-mechanical system (MEMS), medical instrument, etc. µ-EBW has some special properties like the possibility of obtaining exact focussing of the beam and conducting measurement up to micrometer level, accurate control of energy input, inertia-free manipulation, high-frequency oscillation movement and ability to work under high vacuum chamber. µ-EBW has several important applications like micro-joining and micro-fabrication, which is welding of dissimilar materials. This article deals with a review of the recent developments, significant applications, and advantages of µ-EBW, multiple modes of joining and also some new technologies such as scanning electron microscope, function generator, control software, etc. Finally, the current challenges of this emerging technology and the scopes for future studies have been presented in this article.
现代扫描电子显微镜下微细电子束焊接的研究进展:工艺、应用、发展趋势及展望
电子束焊接(EBW)是制造领域一种成熟的连接方法。如果这项技术缩小到微观水平(即微ebw(µ-EBW)),它将能够解决各种问题。采用µ-EBW技术的必要性在于,它可以应用于从微机械制造到微电子元件连接、微机电系统(MEMS)、医疗仪器等领域。µ-EBW具有一些特殊的特性,如可以获得光束的精确聚焦并进行微米级的测量、精确控制能量输入、无惯性操作、高频振荡运动,能在高真空环境下工作。µ-EBW有几个重要的应用,如微连接和微制造,这是焊接不同材料。本文综述了微ebw的最新发展、重要应用、优点、多种连接方式以及扫描电镜、函数发生器、控制软件等新技术。最后,本文提出了该新兴技术当前面临的挑战以及未来研究的范围。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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