Journal of Micromanufacturing最新文献

Additive manufacturing in the COVID-19 pandemic: Equipment and challenges? COVID-19 大流行中的快速成型制造：设备与挑战？

Journal of Micromanufacturing Pub Date : 2024-02-25 DOI: 10.1177/25165984241228083

Abhishek Sharma, Vishal S. Sharma, Shaman Gupta, Rakesh Chandmal Sharma, S. Palli, Neeraj Sharma

引用次数: 0

Strain softening observed during nanoindentation of equimolar-ratio Co–Mn– Fe–Cr–Ni high entropy alloy 等摩尔比 Co-Mn- Fe-Cr-Ni 高熵合金纳米压痕过程中观察到的应变软化现象

Journal of Micromanufacturing Pub Date : 2024-02-23 DOI: 10.1177/25165984241228094

Ayush Owhal, Vinod Belwanshi, Tribeni Roy, Saurav Goel

{"title":"Strain softening observed during nanoindentation of equimolar-ratio Co–Mn– Fe–Cr–Ni high entropy alloy","authors":"Ayush Owhal, Vinod Belwanshi, Tribeni Roy, Saurav Goel","doi":"10.1177/25165984241228094","DOIUrl":"https://doi.org/10.1177/25165984241228094","url":null,"abstract":"This research article presents an atomistic study on the cyclic nanoindentation of an equimolar-ratio Co–Mn–Fe–Cr–Ni high-entropy alloy (HEA) using molecular dynamics simulation. The study investigated the effects of indentation depth on the cyclic load versus the indentation depth of the HEA. The results showed that the cyclic response exhibits a pronounced shift towards plasticity with pile-up formation instead of sinking behavior at higher indentation depths. Within the realm of molecular dynamics simulations, the simulated hardness value reached up to 16 GPa for the initial indentation cycle. A steep drop in the load–displacement curve was observed during the elastic–plastic transition, signifying substantial strain softening of the substrate. It was found that the densely clustered stacking faults undergo a reverse transition during cyclic loading, contributing to the backpropagation phase responsible for elastic recovery despite subsequent strain hardening. The study provides important insights into the underlying mechanisms governing the cyclic mechanical behavior of HEAs to guide their improved micromanufacturing.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"29 9","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140437268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Surface modification using nanostructures and nanocoating to combat the spread of bacteria and viruses: Recent development and challenges 利用纳米结构和纳米涂层进行表面改性，以防止细菌和病毒传播：最新发展与挑战

Journal of Micromanufacturing Pub Date : 2024-02-22 DOI: 10.1177/25165984241228087

D. Patil

{"title":"Surface modification using nanostructures and nanocoating to combat the spread of bacteria and viruses: Recent development\u2028and challenges","authors":"D. Patil","doi":"10.1177/25165984241228087","DOIUrl":"https://doi.org/10.1177/25165984241228087","url":null,"abstract":"Apart from transmission through the respiratory droplet, the surface contact route is another major mode of viral transmission. The recent pandemic is neither the first nor the last; hence, it is a big challenge for a surface engineer to combat the transmission of microbes and viruses through the contact route. In this topical review, we have comprehensively summarized the possible techniques of surface modification for making surfaces antiviral and the respective antiviral mechanisms. Will the anti-biofouling, superhydrophobic, structured surfaces be enough to roll down viruses with water droplets? If so, there could be critical dimensions of nanostructures that need to be fabricated using a precise micro-nano manufacturing method, and the same has been discussed in this review. The surface structuring using functional nanomaterials (copper and copper alloy, gold nanoparticles, silver nanoparticles, titanium dioxide, zinc dioxide, etc.) against different types of viruses and viruses belonging to the coronavirus family has been compared in detail with their merits and demerits. Finally, we foresee that among these surface modification techniques, the nanospike structures combined with an antiviral coating could be the most effective way to combat the transmission of viruses (e.g., COVID-19) through the contact route.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"54 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140439448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A review on applications of molecular dynamics in additive manufacturing 分子动力学在增材制造中的应用综述

Journal of Micromanufacturing Pub Date : 2024-02-12 DOI: 10.1177/25165984241228414

Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma

{"title":"A review on applications of molecular dynamics in additive manufacturing","authors":"Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma","doi":"10.1177/25165984241228414","DOIUrl":"https://doi.org/10.1177/25165984241228414","url":null,"abstract":"Additive manufacturing (AM) is an emerging technology that has significant geometric and material capabilities, because of which it is being used in different fields such as aerospace, healthcare, automotive, architecture, and construction. This process takes the digital data for the three-dimensional model to be made and adds materials accordingly in a layer-by-layer manner. Therefore, the understanding of materials at the atomic level may help in getting optimized output in the AM process, and it can have a significant impact on the final products. Molecular dynamics (MD) studies the dynamic behavior of molecules and materials at the atomic and molecular scales. The main objective of this review article is to briefly discuss how MD simulations may be utilized to examine AM processes. This review also covers the potential benefits of using MD to characterize AM processes, the current literature on using MD to simulate AM processes, the primary obstacles and limitations of MD simulations, and the methodologies utilized in AM simulations using MD. Finally, this article concludes with an in-depth discussion and outlines future research potentials.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"65 14","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139783741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A review on applications of molecular dynamics in additive manufacturing 分子动力学在增材制造中的应用综述

Journal of Micromanufacturing Pub Date : 2024-02-12 DOI: 10.1177/25165984241228414

Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma

{"title":"A review on applications of molecular dynamics in additive manufacturing","authors":"Debashish Gogoi, Amit Kumar, Sangjukta Devi, Manjesh Kumar, Anuj Sharma","doi":"10.1177/25165984241228414","DOIUrl":"https://doi.org/10.1177/25165984241228414","url":null,"abstract":"Additive manufacturing (AM) is an emerging technology that has significant geometric and material capabilities, because of which it is being used in different fields such as aerospace, healthcare, automotive, architecture, and construction. This process takes the digital data for the three-dimensional model to be made and adds materials accordingly in a layer-by-layer manner. Therefore, the understanding of materials at the atomic level may help in getting optimized output in the AM process, and it can have a significant impact on the final products. Molecular dynamics (MD) studies the dynamic behavior of molecules and materials at the atomic and molecular scales. The main objective of this review article is to briefly discuss how MD simulations may be utilized to examine AM processes. This review also covers the potential benefits of using MD to characterize AM processes, the current literature on using MD to simulate AM processes, the primary obstacles and limitations of MD simulations, and the methodologies utilized in AM simulations using MD. Finally, this article concludes with an in-depth discussion and outlines future research potentials.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"125 ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139843491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Experimental study and modeling of laser micro texturing of Nitinol 镍钛诺激光微纹理的实验研究与建模

Journal of Micromanufacturing Pub Date : 2024-02-07 DOI: 10.1177/25165984231215886

Prasenjit Sharma, S. Purushothaman, Meenu Sachdeva, M. S. Srinivas, N. Venkaiah, J. Ramkumar, Mamilla Ravi Shankar

引用次数: 0

Experimental study and modeling of laser micro texturing of Nitinol 镍钛诺激光微纹理的实验研究与建模

Journal of Micromanufacturing Pub Date : 2024-02-07 DOI: 10.1177/25165984231215886

Prasenjit Sharma, S. Purushothaman, Meenu Sachdeva, M. S. Srinivas, N. Venkaiah, J. Ramkumar, Mamilla Ravi Shankar

引用次数: 0

Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation 利用分子动力学模拟研究 Si-wafer 稳态纳米抛光过程中的侧毛刺形成

Journal of Micromanufacturing Pub Date : 2024-02-07 DOI: 10.1177/25165984231218836

Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy

{"title":"Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation","authors":"Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy","doi":"10.1177/25165984231218836","DOIUrl":"https://doi.org/10.1177/25165984231218836","url":null,"abstract":"With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"63 3-4","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139855428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation 利用分子动力学模拟研究 Si-wafer 稳态纳米抛光过程中的侧毛刺形成

Journal of Micromanufacturing Pub Date : 2024-02-07 DOI: 10.1177/25165984231218836

Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy

{"title":"Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation","authors":"Amit Dodmani, Ayush Owhal, Vinod Mishra, Tribeni Roy","doi":"10.1177/25165984231218836","DOIUrl":"https://doi.org/10.1177/25165984231218836","url":null,"abstract":"With advancements in the semiconductor industry, it is required to have angstrom level surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is formed due to material pile-up from material removal due to abrasive which becomes detrimental to achieving the high surface finish. This study employs molecular dynamics simulations to explore the mechanism underlying side burr formation during nano-polishing of mono-crystalline silicon (Si)-wafer. The study utilizes a diamond nano-abrasive grit to scratch the surface of the Si-wafer and investigates the formation of pile-ups during the steady-state process. It was observed that increasing the depth of cut by four times led to a 6.3-fold increase in the number of amorphous atoms, indicating greater bond breakage in the direction of scratching. As a result, the cutting force exceeds the thrust force at larger depths of the cut. The correlation between the side burr height and the depth of cut is also studied. Results show that the side burr height ratio increases with the depth of cut, indicating a higher sensitivity of side burr height to the depth of cut. The study suggests that to achieve a ductile mode of material removal and minimize the height of the side burr during nano-polishing of Si-wafers, it is crucial to maintain the depth of cut at or below half (≤0.5) of the abrasive radius and ensure an average friction coefficient below 0.6. The outcome of this study can be useful for the actual manufacturing of miniaturized sensors, actuators, and microsystems for microelectromechanical system devices where a high surface finish is crucial.","PeriodicalId":129806,"journal":{"name":"Journal of Micromanufacturing","volume":"25 10","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139795676","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Process parametric optimization of fused deposition modeling for manufacturing of acrylonitrile butadiene styrene parts 熔融沉积模型制造丙烯腈-丁二烯-苯乙烯部件的工艺参数优化

Journal of Micromanufacturing Pub Date : 2024-02-06 DOI: 10.1177/25165984241228088

Neel Kamal Gupta, P. K. Rakesh, Vikas Rastogi, Inderdeep Singh

引用次数: 0