[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium最新文献_第6页

New mode crack of LSI package in the solder reflow process 焊料回流过程中LSI封装的新模式裂纹

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279771

M. Adachi, S. Ohuchi, N. Totsuka

引用次数: 17

Guidelines for design of machining processes to eliminate solvent cleaning 消除溶剂清洗的机械加工工艺设计指南

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279801

R. Nagarajan

引用次数: 1

Concurrent engineering for consumer, industrial products, and government systems 用于消费者、工业产品和政府系统的并行工程

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279743

L. Keys, R. Rao, K. Balakrishnan

引用次数: 38

Development of anti-glare coating for high resolution color display tubes 高分辨率彩色显像管防眩光涂层的研制

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279817

Pan Yaohua, Sun Shenliang, Wang Suqing, Chen Shenglei

{"title":"Development of anti-glare coating for high resolution color display tubes","authors":"Pan Yaohua, Sun Shenliang, Wang Suqing, Chen Shenglei","doi":"10.1109/IEMT.1991.279817","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279817","url":null,"abstract":"Research on the development of anti-glare coating material for coating high-resolution display tubes is described. The coating solution that is considered is highly dispersed on the screen of display tubes, thus forming a special coating for anti-glare instead of forming an anti-reflection film. The degrees of hydrolysis and polycondensation of tetraethyl orthosilicate (TEOS) which forms the anti-glare coating on display tubes are closely related to the stability and technological characteristics of the coating solution and the quality of the coating produced. By determining the variations of conductivities, refractive indexes, and viscosities of the coating solution with time, the authors have studied the stability of the technological characteristics of domestic TEOS under various preparation conditions. In addition, by selecting and controlling the ratios of TEOS to acid, water, and alcohol, and selecting and controlling technological conditions, a coating solution with rapid maturity and long stability was produced. By using this coating solution and existing equipment and by inspecting and controlling the process with a convenient and easy-handling method, a high-quality anti-glare coating was achieved.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127479853","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Package warpage evaluation for multi-layer molded PQFP 多层成型PQFP的包装翘曲评估

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279753

B. Kiang, Janice Wittmershaus, R. Kar, N. Sugai

引用次数: 10

The effect of set management on just-in-time manufacturing 集管理对准时制生产的影响

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279762

J. Federico, C. Waddle

{"title":"The effect of set management on just-in-time manufacturing","authors":"J. Federico, C. Waddle","doi":"10.1109/IEMT.1991.279762","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279762","url":null,"abstract":"The authors describe the implementation of the set management concept at IBM in Hopewell Junction in 1990. Set management is designed to release a package of layers, which have been combined at the substock crib, into a substrate part number, significantly lowering material handling and inventory levels resulting in improved test yields. In the revolutionized set management approach, layer job release was triggered by a new software system which balanced sets. When completed each layer job was placed directly into the magazine from which it would be released into stocking, eliminating handling steps and kitting. Inventory reduction was immediately visible with inventory levels going from 30-40 days to less than 10 days. Implementation of set management led to a 7% improvement in yield, a 6* reduction in layer inventory, a 3* reduction in crib storage time, and multiple handling and inspection reductions. The savings to IBM amounted to over $12 million. Process change results are now seen on a real-time basis. Software was instituted to do daily inventory checks and ensure that the line is loaded with the correct mix of part numbers to meet the highest measure of serviceability possible.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130794897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Packaging trends in the 90's 90年代的包装趋势

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279807

R. Gedney, T. F. Kelley

引用次数: 0

Die and MCM test strategy: the key to MCM manufacturability 模具与MCM测试策略:MCM可制造性的关键

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279833

M. Salatino, R. Bracken

引用次数: 3

Modeling of performance-related design trade-offs in multi-chip assemblies 多芯片组件中与性能相关的设计权衡建模

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279808

O. Palusinski, J. H. Hohl

{"title":"Modeling of performance-related design trade-offs in multi-chip assemblies","authors":"O. Palusinski, J. H. Hohl","doi":"10.1109/IEMT.1991.279808","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279808","url":null,"abstract":"The authors discuss the need for development of global performance measures for multi-chip microelectronic assemblies and systems. In particular, electrical performance measures of memory assemblies and their dependence on design parameters were studied. Models of pertinent components of electronic systems, such as off-chip drivers and receivers, and chip-to-chip signal transmission lines were used to evaluate essential properties of memory modules. The read access time was selected as a measure of performance of those modules. Using simple modeling this measure is related to basic parameters such as conductor geometry, substrate material thickness and permittivity, I/O pitch in chip carriers and chip access time. The specific memory module considered shows strong dependence of performance measure on materials used in its construction. The relationships between systems performance, materials properties, and geometry are described by analytic approximations; however, more accurate modeling will use look-up tables and specialized computer programs. Development of suitable computer support for system design based on developed models of performance is discussed.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123651704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

TAB inner-lead bond process characterization for single-point laser bonding 单点激光键合的TAB内引线键合工艺表征

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279738

A. Emamjomeh, P. Wesling, J. Doong, A. Chi, K. Ling, S. Chiao

{"title":"TAB inner-lead bond process characterization for single-point laser bonding","authors":"A. Emamjomeh, P. Wesling, J. Doong, A. Chi, K. Ling, S. Chiao","doi":"10.1109/IEMT.1991.279738","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279738","url":null,"abstract":"Results are presented for a set of screening experiments used to characterize a process for performing inner-lead bonding (ILB) using a continuous-wave (CW) laser. Three key parameters were selected for initial analysis: the force exerted by the bonding stylus; the laser power; and the on-time of the laser. Using a Box-Behnken statistical design for the experiment, an efficient set of tests was derived. Four sets of experimental samples were fabricated, to be used for the as-fabricated testing, high-temperature aging, and thermal cycling. Only the as-fabricated results are reported here. Using a design-of-experiments software package for the PC, a quadratic equation was derived from the data explicitly defining the relationships among the three parameters and relating them to bond strength. Using the techniques of surface response methodology, a response surface was created, showing the optimum operating region for the ILB process based on the parameter range chosen. The initial screening experiments show that good bond strength occurs in a range of constant energy (power times on-time) for the CW laser bonder; in the range of the three parameters tested, bond strength was optimized at forces of 20 grams, a power of 4.3 W, and laser on-time of 150 ms.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124178757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9