Packaging trends in the 90's

Abstract

It is pointed out that, as the level of integration increases and system performance rapidly approaches cycle times where packaging delays become important gates, multi-chip modules (MCMs) will become the necessary packaging solution for a growing number of manufacturers. The authors address the need for multi-chip modules, volume projections, and a categorization proposal that can be used to help set the packaging manufacturers' strategic direction that will be consistent with their customers' future direction. It is concluded that, for moderately complex systems, MCMs can provide the manufacturer with a substantial improvement in package density and alleviate complexity at the second level package. MCMs can be divided into categories that define module complexity and I/O density for PCs, workstations and intermediate level computer systems. This should allow the manufacturer to plan for the type of module that best suits the manufacturer's needs.<>