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[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium最新文献

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Evaluating storage requirements for standard electronics assembly 评估标准电子组件的存储要求
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279765
W. Trybula
{"title":"Evaluating storage requirements for standard electronics assembly","authors":"W. Trybula","doi":"10.1109/IEMT.1991.279765","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279765","url":null,"abstract":"The development of an Integrated Facilities Plan has required evaluation of and assumptions about the manufacturing facility. The analysis of requirements for equipment has progressed from back-of-the-envelope-type calculations through spreadsheets to sophisticated computer simulations. This has resulted in excellent analysis of the equipment requirements for facility automation. However, the analysis of material storage requirements has not progressed as quickly. Most approaches have employed straight numerical averaging. The author explores the results of these simplifying assumptions and presents alternative considerations to be used in calculating storage requirements. An example of a typical electronics manufacturing facility is used to indicate the potential magnitude of error caused by straight numerical averaging.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115665254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Failure mechanisms in TAB inner lead bonding and the relationship between design and reliability TAB内引线连接失效机理及设计与可靠性的关系
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279735
J. Hayward, A. Mckenzie
{"title":"Failure mechanisms in TAB inner lead bonding and the relationship between design and reliability","authors":"J. Hayward, A. Mckenzie","doi":"10.1109/IEMT.1991.279735","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279735","url":null,"abstract":"Thermo-compression bonding as an inner lead bonding technique subjects the bonded device to severe temperature and pressure conditions. This is particularly true for the case where gold-plated tape is bonded to gold bumps. One of the principal failure mechanisms for gold-to-gold bonding is related to the development of cracks in the protective inorganic passivation layer propagating into the underlying pad structure. An investigation was undertaken in the AMD TAB (tape automated bonding) laboratory on the prevention of such cracking and of the consequent failure mechanisms. Three different silicon devices fabricated in bipolar and CMOS processes have been used to compare the effects on crack development of the variables of passivation type and geometric configuration of the bump and pad metallization. Cracking at the bump to device interface results in reduced bond strength and failure of the bond at that interface. The failure mechanism is destruction of the titanium/tungsten barrier metallization due to the influx of oxygen and moisture. The incidence of cracking can be reduced or eliminated by appropriate design of the bump-to-pad geometry.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115035875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Pull logic manufacturing based on CIM to approach JIT 将基于CIM的逻辑制造推向JIT
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279763
M. Mori, S. Kuriyama
{"title":"Pull logic manufacturing based on CIM to approach JIT","authors":"M. Mori, S. Kuriyama","doi":"10.1109/IEMT.1991.279763","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279763","url":null,"abstract":"The authors describe a pull logic approach to JIT (just-in-time) by an improvement of MRP (material requirement planning) which is integrated into CIM (computer integrated manufacturing). Latest sales information and production plan information are reflected by CIM in the production control system, in order to realize timely production. This approach changes pull manufacturing from push manufacturing. The production control system, which was able to respond to changes of the market promptly in the manufacturing industry, is considered.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124378508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimization of the gull wing lead 鸥翼引线的优化设计
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279754
W. Chen, G. Dody, W. Adamjee
{"title":"Optimization of the gull wing lead","authors":"W. Chen, G. Dody, W. Adamjee","doi":"10.1109/IEMT.1991.279754","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279754","url":null,"abstract":"Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two different foot angles, 2 degrees and 14 degrees ; two different lower bend radii, 14 mils and 21 mils; two different solder compositions, 63/37 Sn/Pb and 62/36/2 Sn/Pb/Ag; coplanarity for all leads of 1.4 mils or less; coplanarity of all eight corner leads deformed in the range of 1.5 to 2.9 mils; and coplanarity of all eight corner leads deformed in the range of 3.0 to 4.4 mils. A Taguchi experiment design with an L8 orthogonal array was employed in this investigation.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131354760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A process model of the infra-red reflow soldering of printed circuit board assemblies 印制板组件红外回流焊工艺模型
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279761
D. Whalley, A. Ogunjimi, P. Conway, D.J. Williams
{"title":"A process model of the infra-red reflow soldering of printed circuit board assemblies","authors":"D. Whalley, A. Ogunjimi, P. Conway, D.J. Williams","doi":"10.1109/IEMT.1991.279761","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279761","url":null,"abstract":"The authors present the latest results of an evolving model of the infra-red reflow soldering process. Recent additions to earlier models are the convective cooling of the PCB (printed circuit board) as it exits from the furnace muffle, and the addition of realistic component structures to the PCB assembly. The authors also present the initial results from a second model of a high production volume, high quality, mass manufacture oven. The output from all of these models is a time-temperature distribution for the assembly in question, allowing the identification of heating and cooling rates in the assembly, the peak temperatures of the individual components, and the time above reflow temperature for the solder joints.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115451267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
An integrated approach to process monitoring and data analysis 过程监控和数据分析的综合方法
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279822
K. Y. Wong, J.J. Daudenarde, C. Yeh, I. Cheung, E. Ruble, G. Rabier
{"title":"An integrated approach to process monitoring and data analysis","authors":"K. Y. Wong, J.J. Daudenarde, C. Yeh, I. Cheung, E. Ruble, G. Rabier","doi":"10.1109/IEMT.1991.279822","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279822","url":null,"abstract":"The authors describe two architectures: the Automated Process Monitoring (APROM) System, which examines a large combination of trend charts and shows the symptoms of problems to the engineers by sending a high level message and a chart when a process variable is out of control; and the Interactive Data Extraction and Analysis (IDEA) System, which provides a simple menu interface to get a block of data from a local, or remote host database. Once the user receives the right data block, the user can interactively exercise many options of plots and statistical data analysis functions. An application is described by a profile which can be modified easily by users.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115654809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A manufacturing vision for the year 2001 (what's new in CIM) 2001年的制造业远景(CIM的新特性)
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279745
S. Bansal
{"title":"A manufacturing vision for the year 2001 (what's new in CIM)","authors":"S. Bansal","doi":"10.1109/IEMT.1991.279745","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279745","url":null,"abstract":"An attempt is made to explore the state of the art in intelligent manufacturing systems and where the emerging research efforts are dedicated. What embodies the intelligence and with what embodiment intelligent manufacturing systems should be implemented are discussed. Examples of formative work in the computer integrated manufacturing (CIM) field are presented along with learning what has already taken place, as well as issues that both industry and academia have to address for success in the future.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128752105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Functional modeling of the cell controller in computer integrated manufacturing systems 计算机集成制造系统中单元控制器的功能建模
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279758
T. Odajima, T. Torii
{"title":"Functional modeling of the cell controller in computer integrated manufacturing systems","authors":"T. Odajima, T. Torii","doi":"10.1109/IEMT.1991.279758","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279758","url":null,"abstract":"The authors describe the functional model of the cell controller in computer-integrated manufacturing systems as the functional matrix. The functional matrix is composed of four basic functions and three external objects which have to be taken into account when designing a cell controller. The authors present an application example in which, by using the proposed functional model, the cell controller systems are developed and implemented in a printed wiring board assembly shop.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129299297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Defect inspection system for patterned wafers based on the spatial-frequency filtering 基于空频滤波的图案片缺陷检测系统
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279775
T. Ohshige, Hitoshi Tanaka, Y. Miyazaki, T. Kanda, H. Ichimura, Nobuyuki Kosaka, T. Tomoda
{"title":"Defect inspection system for patterned wafers based on the spatial-frequency filtering","authors":"T. Ohshige, Hitoshi Tanaka, Y. Miyazaki, T. Kanda, H. Ichimura, Nobuyuki Kosaka, T. Tomoda","doi":"10.1109/IEMT.1991.279775","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279775","url":null,"abstract":"A surface defect inspection system based on the spatial frequency filtering technique (SFFT) has been developed for patterned semiconductor wafers. The SFFT is very powerful in detecting tiny pattern defects and foreign particles on complex but periodic patterns, such as semiconductor memory wafers. In this application a spatial frequency filter, which has an opaque spotty pattern corresponding to the periodic pattern of the test object, is placed at the Fourier transform plane of the imaging lens and blocks the light diffracted by the regular periodic pattern. Thus, only random defects are projected on the image plane and not the regular periodic patterns, which makes the execution of defect detection very quick and easy. The developed system uses a photoplate as the filter, and takes in the filtered image directly by an ITV camera, detecting sub-micron defects in about 30 minutes for a 6-inch memory wafer.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131689828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Chip on board (COB) multichip modules design possibilities and manufacturing 板载芯片(COB)多芯片模块的设计可能性和制造
[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279811
P. Clot
{"title":"Chip on board (COB) multichip modules design possibilities and manufacturing","authors":"P. Clot","doi":"10.1109/IEMT.1991.279811","DOIUrl":"https://doi.org/10.1109/IEMT.1991.279811","url":null,"abstract":"The author describes multichip module applications using COB for low-cost assembly of many dice on the same substrate even on both sides, to achieve full electronic circuitry miniaturization. Multichip modules on the FR4 PWB (printed wiring board) substrate are shown as an alternative to silicon on silicon, with in and out interconnection possibilities of particular note. This original packaging authorizes different shapes for modules. Surface mounted devices as well as leaded components are also added. Heat management is considered and explained through environmental test organization. Also, multichip silicon on silicon can be assembled on the same substrate to increase module performance and solve in and out connections from the main silicon dice.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122347788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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