{"title":"Optimization of the gull wing lead","authors":"W. Chen, G. Dody, W. Adamjee","doi":"10.1109/IEMT.1991.279754","DOIUrl":null,"url":null,"abstract":"Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two different foot angles, 2 degrees and 14 degrees ; two different lower bend radii, 14 mils and 21 mils; two different solder compositions, 63/37 Sn/Pb and 62/36/2 Sn/Pb/Ag; coplanarity for all leads of 1.4 mils or less; coplanarity of all eight corner leads deformed in the range of 1.5 to 2.9 mils; and coplanarity of all eight corner leads deformed in the range of 3.0 to 4.4 mils. A Taguchi experiment design with an L8 orthogonal array was employed in this investigation.<<ETX>>","PeriodicalId":127257,"journal":{"name":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1991.279754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two different foot angles, 2 degrees and 14 degrees ; two different lower bend radii, 14 mils and 21 mils; two different solder compositions, 63/37 Sn/Pb and 62/36/2 Sn/Pb/Ag; coplanarity for all leads of 1.4 mils or less; coplanarity of all eight corner leads deformed in the range of 1.5 to 2.9 mils; and coplanarity of all eight corner leads deformed in the range of 3.0 to 4.4 mils. A Taguchi experiment design with an L8 orthogonal array was employed in this investigation.<>