[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium最新文献_第5页

Cost saving opportunities with multi-chip modules 多芯片模块节省成本的机会

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279826

J. Mavroides

引用次数: 5

Effects of skewing CMOS output driver switching on the 'simultaneous' switching noise 偏置CMOS输出驱动开关对“同步”开关噪声的影响

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279810

R. Senthinathan, J. Prince, S. Nimmagadda

引用次数: 11

Recognition of pattern defects of printed circuit board using topological information 利用拓扑信息识别印刷电路板图案缺陷

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279777

M. Ito, Y. Nikaido

引用次数: 6

High density interconnect verification of unpopulated multichip modules 无人多芯片模块的高密度互连验证

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279832

O. Woodard

引用次数: 16

The latest molding technology for fine pitch P-QFP 最新的小间距P-QFP成型技术

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279752

Y. Noda

引用次数: 1

Introduction of BiCMOS into a production CMOS facility 将BiCMOS引入CMOS生产设施

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279746

R. Reuss, T. Sparks, S. Cosentino, J. Ford, T. Hulseweh, J. Hoskins, V. Lam, J. Barden, M. Granum

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引用次数: 3

High density interconnect verification using voltage contrast electron beam 使用电压对比电子束的高密度互连验证

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279793

A. W. Ross, R.R. Goruganthu, O.C. Woodard

引用次数: 6

Environmentally conscious products 环保产品

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279795

W.J. Brady

引用次数: 1

Ceramic packages and substrates prepared by electroless Ni-Au process 化学镍金工艺制备陶瓷封装及衬底

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279816

M. Nakazawa, S. Wakabayashi

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引用次数: 1

TARGET: thermal accelerated reliability go-no-go environmental testing dynamic board thermal shock using a single liquid fluorocarbon bath 目标:热加速可靠性-不-不-环境试验动态板热冲击使用单一液态氟碳浴

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1991-09-16 DOI: 10.1109/IEMT.1991.279779

B.P. Beaton

引用次数: 3