Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)最新文献_第4页

A cost analysis study of deposited-MCM active substrates for testability purposes 用于测试目的的沉积mcm活性基板的成本分析研究

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510773

J. Oliver, H. Kerkhoff

引用次数: 1

Early cost/performance cache analysis of a split MCM-based MicroSparc CPU 基于拆分mcm的MicroSparc CPU的早期成本/性能缓存分析

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510786

P. Dehkordi, K. Ramamurthi, D. Bouldin, M. Davidson

引用次数: 13

The application of silicon-on-silicon MCMs to advanced analog power controllers 硅对硅mcm在高级模拟功率控制器中的应用

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510769

D. Dromgoole, Ahmad Lotfi, A. Feygenson, R. Frye, B. J. Han, K. Tai

引用次数: 4

Fluxless flip-chip for multichip modules 用于多芯片模块的无磁倒装芯片

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510766

J. Goldstein, E. A. Logan, B.S. Femandez

引用次数: 0

MCM-D switching units for interconnection technology validation MCM-D开关单元互连技术验证

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510783

C. Truzzi, E. Beyne, E. Ringoot

引用次数: 2

Micro-machined heat pipes in silicon MCM substrates 硅MCM衬底的微机械热管

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1995-12-31 DOI: 10.1109/MCMC.1996.510782

D. Benson, R. Mitchell, M. Tuck, D. Adkins, D. Palmer

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引用次数: 28