用于测试目的的沉积mcm活性基板的成本分析研究

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI:10.1109/MCMC.1996.510773

J. Oliver, H. Kerkhoff

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引用次数: 1

摘要

多芯片模块(mcm)被视为未来系统制造的强大集成方法。然而，MCM测试已成为我们在未来几年将不得不面对的最具挑战性的问题之一。为了找到具有成本效益的mcm测试解决方案，必须考虑有源衬底上的测试结构。通过这种方式，本文给出了基于放置在活性基板上的测试结构的良率计算的成本分析结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A cost analysis study of deposited-MCM active substrates for testability purposes

MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.

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Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)

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