Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)最新文献

An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements 基于高频s参数测量的芯片上损耗线特性阻抗的精确测定

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510793

Thomas-Michael Winkel, L. S. Dutta, Hartmut Grabinski

引用次数: 30

Chip and package co-design technique for clock networks 时钟网络的芯片与封装协同设计技术

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510788

Qing K. Zhu, W. Dai

引用次数: 8

A sensitivity-based wiresizing approach to interconnect optimization of lossy transmission line topologies 损耗传输线拓扑互连优化中基于灵敏度的布线方法

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510780

T. Xue, E. Kuh, Qingjian Yu

引用次数: 38

Space-cube: a flexible computer architecture based on stacked modules 空间立方体:一种基于堆叠模块的灵活计算机体系结构

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510763

G. Bolotin

引用次数: 4

Development of a DSP/MCM subsystem assessing low-volume, low-cost MCM prototyping for universities 开发DSP/MCM子系统，为大学评估小批量、低成本的MCM原型

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510775

P. Dehkordi, T. Powell, D. Bouldin

引用次数: 10

Efficient gate delay modeling for large interconnect loads 大型互连负载的有效门延迟建模

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510795

A. Kahng, S. Muddu

引用次数: 42

Flexible access to MCM technology via the multichip module designers' access service (MIDAS) 通过多芯片模块设计人员访问服务(MIDAS)灵活访问MCM技术

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510774

J. Peltier, W. Hansford

{"title":"Flexible access to MCM technology via the multichip module designers' access service (MIDAS)","authors":"J. Peltier, W. Hansford","doi":"10.1109/MCMC.1996.510774","DOIUrl":"https://doi.org/10.1109/MCMC.1996.510774","url":null,"abstract":"The MCM Designers' Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nChip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface \"transparent\" to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121762379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Mixed signal digital sub-band tuner multichip module 混合信号数字子带调谐器多芯片模块

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510768

K. Sienski, C. Field, C. Schreiner, M. Chivers

引用次数: 4

Advanced interconnected mesh power system (IMPS) MCM topologies 先进的互联网格电力系统(IMPS) MCM拓扑

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510781

J. Parkerson, L. Schaper

引用次数: 1

Fast parameters extraction of multilayer and multiconductor interconnects using geometry independent measured equation of invariance 利用几何无关不变性测量方程快速提取多层和多导体互连参数

Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Pub Date : 1996-02-06 DOI: 10.1109/MCMC.1996.510778

W. Hong, W. Sun, W. Wei-Ming Dai

{"title":"Fast parameters extraction of multilayer and multiconductor interconnects using geometry independent measured equation of invariance","authors":"W. Hong, W. Sun, W. Wei-Ming Dai","doi":"10.1109/MCMC.1996.510778","DOIUrl":"https://doi.org/10.1109/MCMC.1996.510778","url":null,"abstract":"Measured Equation of Invariance (MEI) is a new concept in computational electromagnetics. It has been demonstrated that the MEI is such an efficient boundary truncation technique that the meshes can be terminated very close to the object and still strictly preserves the sparsity of the FD equations. Therefore, the final system matrix encountered by MEI is a sparse matrix with size similar to that of integral equation methods. However, complicated Green's function and disagreeable Sommerfeld integrals make the traditional MEI very difficult, if not impossible, to be applied to analyze multilayer and multiconductor interconnects. In this paper, we propose the Geometry Independent MEI (GIMEI) which substantially improved the original MEI method. We use GIMEI for capacitance extraction of general two-dimension VLSI multilayer and multiconductor interconnect. Numerical results are in good agreement with various published data. We also include a simple three-dimensional example and compared GIMEI with FASTCAP from MIT. The accuracy is maintained while GIMEI care generally an order of magnitude faster than FASTCAP with much less memory usage.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125770214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 23