大型互连负载的有效门延迟建模

A. Kahng, S. Muddu
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引用次数: 42

摘要

随着开关速度的加快和互连树(mcm)的增大,互连的电阻和电感对逻辑门延迟有主要影响。在本文中,我们提出了一个新的/spl Pi/模型用于分布式RC和RLC互连,以估计CMOS栅极输出端的驱动点导纳。使用该模型,我们能够有效地计算栅极延迟,在spice计算延迟的25%以内。我们的参数仅依赖于栅极输出的总互连树电阻和电容,以前的“有效负载电容”方法仅适用于分布式RC互连,是基于通过递归导纳矩计算获得的/spl Pi/模型参数。我们的模型应该对性能驱动路由的迭代优化或高级综合中门延迟和上升时间的估计有用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Efficient gate delay modeling for large interconnect loads
With fast switching speeds and large interconnect trees (MCMs), the resistance and inductance of interconnect has a dominant impact on logic gate delay. In this paper, we propose a new /spl Pi/ model for distributed RC and RLC interconnects to estimate the driving point admittance at the output of a CMOS gate. Using this model we are able to compute the gate delay efficiently, within 25% of SPICE-computed delays. Our parameters depend only on total interconnect tree resistance and capacitance at the output of the gate, Previous "effective load capacitance" methods, applicable only for distributed RC interconnects, are based on /spl Pi/ model parameters obtained via a recursive admittance moment computation. Our model should be useful for iterative optimization of performance-driven routing or for estimation of gate delay and rise times in high-level synthesis.
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