MCM-D switching units for interconnection technology validation

Abstract

Thin film Multichip Modules (MCM-D) provide a high packaging density. The short interconnection lengths on MCM-D enable high speed digital operations. The analysis of the limits of the high speed performance of such a technology is a challenging task. Individual nets on the substrate are difficult to contact during operation of the module and measuring nets using hf-probes may very well influence the operating conditions of the module. A possible solution to this problem, especially suited for digital applications, is presented here. It consists of a testing methodology focused on the characterization of the interconnection technology itself. This solution provides a way to analyze, in a real-world environment, the electrical performance of a module as a function of geometrical, technological and electrical quantities as well as circuit and system parameters. This solution can bring useful information to MCM manufacturers on the system performance and operation limits of their products, as it can be used as a benchmark to validate the interconnection technology.