A cost analysis study of deposited-MCM active substrates for testability purposes

Abstract

MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates.