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IEEE Open Journal of the Solid-State Circuits Society最新文献

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Broadband, High-Linearity Switches for Millimeter-Wave Mixers Using Scaled SOI CMOS 使用缩放SOI CMOS的毫米波混频器的宽带高线性开关
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-08-11 DOI: 10.1109/OJSSCS.2022.3198040
Cameron Hill;James F. Buckwalter
{"title":"Broadband, High-Linearity Switches for Millimeter-Wave Mixers Using Scaled SOI CMOS","authors":"Cameron Hill;James F. Buckwalter","doi":"10.1109/OJSSCS.2022.3198040","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3198040","url":null,"abstract":"This work demonstrates new circuit techniques in distributed-stacked-complimentary (DiSCo) switches that enable picosecond switching speed in RF CMOS SOI switches. By using seriesstacked devices with optimized gate impedance and voltage swing, both high linearity and fast switching are possible. A theoretical analysis and design framework has been developed and verified through simulation and measurement through two broadband, high-linearity passive mixer designs, one optimized for linearity and the other for bandwidth, using a 45-nm SOI CMOS process. The mixers achieve \u0000<inline-formula> <tex-math>$P_{1dB}{s}$ </tex-math></inline-formula>\u0000 of 16-22 dBm with \u0000<inline-formula> <tex-math>$IIP3s$ </tex-math></inline-formula>\u0000 of 25-34 dBm across a bandwidth from 1 GHz up to 30 GHz. This performance exceeds prior SOI RF and microwave mixer performance by more than an order of magnitude and is comparable to III-V device technologies. The mixers include integrated local oscillator (LO) driving amplifiers for high efficiency operation and low total power consumption. DC power consumption ranges from 250 mW to 1 W for the LO driver. The integrated LO drivers demonstrate a pathway to on-chip LO generation with simplified matching to maximize LO power delivered to the input of the switch.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"61-72"},"PeriodicalIF":0.0,"publicationDate":"2022-08-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/09854919.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
IEEE Open Journal of the Solid-State Circuits Society Special Section on Imagers for 3D Vision IEEE固态电路学会开放期刊3D视觉成像器专刊
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-03-17 DOI: 10.1109/OJSSCS.2022.3154425
Edoardo Charbon
{"title":"IEEE Open Journal of the Solid-State Circuits Society Special Section on Imagers for 3D Vision","authors":"Edoardo Charbon","doi":"10.1109/OJSSCS.2022.3154425","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3154425","url":null,"abstract":"Depth perception has been and continues to be one of the fastest growing fields of research and development both in academia and industry. There is an abundance of applications requiring 3D vision, from automotive safety and self-driving vehicles to virtual/augmented reality (VR/AR), from high-end imaging to proximity sensing. With the explosion of automated package handling, semi-robotic delivery, and advanced driver-assistance systems (ADAS), the need to safely and accurately reconstruct the environment in 3D is also exploding, along with more demanding requirements for 3D vision cameras in terms of resolution, precision, and speed.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2022-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/09737148.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 50-GBaud QPSK Optical Receiver With a Phase/Frequency Detector for Energy-Efficient Intra-Data Center Interconnects 用于节能数据中心内部互连的带相位/频率检测器的50GBaud QPSK光接收机
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-02-09 DOI: 10.1109/OJSSCS.2022.3150291
Luis A. Valenzuela;Yujie Xia;Aaron Maharry;Hector Andrade;Clint L. Schow;James F. Buckwalter
{"title":"A 50-GBaud QPSK Optical Receiver With a Phase/Frequency Detector for Energy-Efficient Intra-Data Center Interconnects","authors":"Luis A. Valenzuela;Yujie Xia;Aaron Maharry;Hector Andrade;Clint L. Schow;James F. Buckwalter","doi":"10.1109/OJSSCS.2022.3150291","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3150291","url":null,"abstract":"This paper describes the energy-efficient realization of a QPSK optical receiver (CoRX) for short-reach intra-datacenter interconnects based on analog coherent detection. The CoRX comprises inphase and quadrature channels for each polarization and a high-speed phase-frequency detector (PFD) that provides feedback to stabilize an optical local oscillator (LO) and maintain coherence with the received optical signal. Each receive (RX) channel consists of a transimpedance amplifier (TIA) based on a Cherry-Hooper emitter follower (CHEF). The electronic RX is implemented in a 130-nm SiGe HBT technology (\u0000<inline-formula> <tex-math>$f_{T} = 300$ </tex-math></inline-formula>\u0000 GHz), consumes 534 mW of DC power for a total electrical RX energy efficiency of 5.34 pJ/bit, and occupies 2.8 \u0000<inline-formula> <tex-math>$mm^{2}$ </tex-math></inline-formula>\u0000. Electrical characterization of the CoRX on an FR-4 PCB assembly demonstrates operation up to 60 GBaud with a bit error rate (BER) of less than 10\u0000<sup>−12</sup>\u0000. A co-packaged optical/electrical CoRX assembly with a silicon photonic receiver is characterized using a commercial-off-the-shelf quadrature phase-shift keying (QPSK) transmitter for constellations up to 50 GBaud (100 Gbps) at BER below KP4-FEC (\u0000<inline-formula> <tex-math>$2.2times 10^{-4}$ </tex-math></inline-formula>\u0000).","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"50-60"},"PeriodicalIF":0.0,"publicationDate":"2022-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/09708425.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Sensor Interfaces Meeting 2022 2022年传感器接口会议
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3164490
{"title":"Sensor Interfaces Meeting 2022","authors":"","doi":"10.1109/OJSSCS.2022.3164490","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3164490","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"302-302"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094270.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Journal of the Solid-State Circuits Society Publication Information IEEE固态电路学会公开期刊出版信息
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3155919
{"title":"IEEE Open Journal of the Solid-State Circuits Society Publication Information","authors":"","doi":"10.1109/OJSSCS.2022.3155919","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3155919","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094267.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67868221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
BioCas 2021 BioCas 2021
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2021.3136369
{"title":"BioCas 2021","authors":"","doi":"10.1109/OJSSCS.2021.3136369","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3136369","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"301-301"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094287.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2022 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 2 2022年索引IEEE固态电路学会开放期刊第2卷
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2023.3265562
{"title":"2022 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 2","authors":"","doi":"10.1109/OJSSCS.2023.3265562","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3265562","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"305-312"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10097449.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50327144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: RFIC 2023 论文征集：RFIC 2023
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2022.3218838
{"title":"Call for Papers: RFIC 2023","authors":"","doi":"10.1109/OJSSCS.2022.3218838","DOIUrl":"https://doi.org/10.1109/OJSSCS.2022.3218838","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"303-304"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10094275.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Journal of the Solid-State Circuits Society Instructions for Authors IEEE固态电路学会开放期刊作者须知
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2022-01-01 DOI: 10.1109/OJSSCS.2023.3234383
{"title":"IEEE Open Journal of the Solid-State Circuits Society Instructions for Authors","authors":"","doi":"10.1109/OJSSCS.2023.3234383","DOIUrl":"https://doi.org/10.1109/OJSSCS.2023.3234383","url":null,"abstract":"These instructions give guidelines for preparing papers for this publication. Presents information for authors publishing in this journal.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"2 ","pages":"C3-C4"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/9733783/10006346.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50415868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC) 电子-光子集成电路（EPIC）客座编辑特刊
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2021-12-14 DOI: 10.1109/OJSSCS.2021.3130313
Firooz Aflatouni
{"title":"Guest Editorial Special Section on Electronic–Photonic Integrated Circuits (EPIC)","authors":"Firooz Aflatouni","doi":"10.1109/OJSSCS.2021.3130313","DOIUrl":"https://doi.org/10.1109/OJSSCS.2021.3130313","url":null,"abstract":"Electronic-photonic co-design, where the large bandwidth available around the optical carrier, high quality factor optical resonators, low-loss optical interconnects and signal distribution, and highly sensitive photonic sensors are concurrently utilized with sophisticated analog, radio frequency, digital, and mixed signal electronic circuits has improved the performance of many systems for applications ranging from sensing and imaging to communication and computation.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"1 ","pages":"196-197"},"PeriodicalIF":0.0,"publicationDate":"2021-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8782712/8816720/09650620.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"67861565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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