IEEE Open Journal of the Solid-State Circuits Society最新文献

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IEEE Open Journal of the Solid-State Circuits Society Special Section on Data Converters IEEE固态电路学会开放期刊:数据转换器专题
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-06-18 DOI: 10.1109/OJSSCS.2025.3561812
Youngcheol Chae;Mike Shuo-Wei Chen
{"title":"IEEE Open Journal of the Solid-State Circuits Society Special Section on Data Converters","authors":"Youngcheol Chae;Mike Shuo-Wei Chen","doi":"10.1109/OJSSCS.2025.3561812","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3561812","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"144-144"},"PeriodicalIF":0.0,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11039224","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144314856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems 用于三维空间计算系统的人工智能硬件架构和硅概述
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-06-05 DOI: 10.1109/OJSSCS.2025.3577110
Dongseok Im;Gwangtae Park;Junha Ryu;Hoi-Jun Yoo
{"title":"An Overview of AI Hardware Architectures and Silicon for 3-D Spatial Computing Systems","authors":"Dongseok Im;Gwangtae Park;Junha Ryu;Hoi-Jun Yoo","doi":"10.1109/OJSSCS.2025.3577110","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3577110","url":null,"abstract":"As artificial intelligence (AI) advances, 3-D spatial computing has emerged as a key application in various fields. It interprets the 3-D space surrounding users and provides them with useful information. This article presents a survey of AI hardware architectures and silicon solutions for 3-D spatial computing systems. The survey categorizes five domains: 1) 3-D data capturing; 2) 3-D data analysis; 3) 3-D hand motion analysis; 4) simultaneous localization and mapping (SLAM); and 5) 3-D rendering. Each session analyzes design considerations for domain-specific accelerators. Finally, this article discusses a next-generation 3-D spatial computing platform that integrates various functions of 3-D spatial computing systems using AI technologies.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"212-228"},"PeriodicalIF":0.0,"publicationDate":"2025-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11026096","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144671236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Journal of the Solid-State Circuits Society IEEE固态电路学会开放期刊
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-04-18 DOI: 10.1109/OJSSCS.2025.3534449
{"title":"IEEE Open Journal of the Solid-State Circuits Society","authors":"","doi":"10.1109/OJSSCS.2025.3534449","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3534449","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2025-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10970245","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143848774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
LTPO-TFT-Based Pixel Circuit With TFT, OLED, and Supply Voltage Compensation for Enhanced Luminance Uniformity in Variable-Frame-Rate AMOLED Smartwatch Displays 基于ltpo -TFT的像素电路与TFT、OLED和电源电压补偿在可变帧率AMOLED智能手表显示中增强亮度均匀性
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-04-11 DOI: 10.1109/OJSSCS.2025.3560242
Jui-Hung Chang;Cheng-Han Ke;Chia-Lun Lee;Po-Cheng Lai;Chi-Hsuan Huang;Li-Wei Shih;Chih-Lung Lin
{"title":"LTPO-TFT-Based Pixel Circuit With TFT, OLED, and Supply Voltage Compensation for Enhanced Luminance Uniformity in Variable-Frame-Rate AMOLED Smartwatch Displays","authors":"Jui-Hung Chang;Cheng-Han Ke;Chia-Lun Lee;Po-Cheng Lai;Chi-Hsuan Huang;Li-Wei Shih;Chih-Lung Lin","doi":"10.1109/OJSSCS.2025.3560242","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3560242","url":null,"abstract":"This work proposes a new pixel circuit using low-temperature polycrystalline silicon and oxide (LTPO) thin-film transistors (TFTs) for use in variable-frame-rate active-matrix organic light-emitting diode (AMOLED) smartwatch displays. The proposed circuit, including seven TFTs and two capacitors, can compensate for threshold voltage (<inline-formula> <tex-math>$V_{mathrm { TH}}$ </tex-math></inline-formula>) variations of the driving TFTs (DTFTs), the turn-on voltages of the OLEDs (<inline-formula> <tex-math>$V_{mathrm { OLED}}$ </tex-math></inline-formula>), and <inline-formula> <tex-math>$V_{mathrm { SS}}$ </tex-math></inline-formula> IR rises; it is immune to <inline-formula> <tex-math>$V_{mathrm { DD}}$ </tex-math></inline-formula> IR drops. It employs amorphous-indium-gallium-zinc-oxide (a-IGZO) TFTs, which exhibit low leakage currents, suppressing distortion in the gate voltage of the DTFT at low frame rates and enabling a stable OLED current (<inline-formula> <tex-math>$I_{mathrm { OLED}}$ </tex-math></inline-formula>) to maintain consistent display luminance. A 1.28-In LTPO AMOLED panel with a <inline-formula> <tex-math>$416times 416$ </tex-math></inline-formula> resolution and the proposed pixel circuit are fabricated to verify the circuit’s performance. The experimental results thus obtained confirm that red, green, blue, and white images at frame rates from 45 to 1 Hz exhibit uniformity without visible spot or line defects and a luminance error rate below 2.34%. Measured luminance values remain stable at gray levels of 32, 64, 128, and 255 during an extended emission period of 1 s, revealing no perceived image flicker at 1 Hz (with a Japan Electronics and Information Technology Industries Association flicker value below −54.747 dB). Therefore, the proposed circuit, with its highly uniform and stable currents at various frame rates, is promising for use in AMOLED smartwatch displays.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"130-143"},"PeriodicalIF":0.0,"publicationDate":"2025-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10963900","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143925088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Radiation-Hard 8-Channel 15-Bit 40-MSPS ADC for the ATLAS Liquid Argon Calorimeter Readout 用于ATLAS液氩量热计读出的抗辐射8通道15位40-MSPS ADC
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-03-28 DOI: 10.1109/OJSSCS.2025.3573904
Rui Xu;Jaroslav Bán;Sarthak Kalani;Chen-Kai Hsu;Subhajit Ray;Brian Kirby;Gabriel Matos;Julia Gonski;Andrew C. Smith;Daniel M. Williams;Kiley E. Kennedy;Alan Kahn;Michelle Contreras-Cossio;Lauren Larson;Michael Himmelsbach;Devanshu Panchal;Michael Unanian;Xiangxing Yang;Nan Sun;John Parsons;Timothy R. Andeen;Peter R. Kinget
{"title":"A Radiation-Hard 8-Channel 15-Bit 40-MSPS ADC for the ATLAS Liquid Argon Calorimeter Readout","authors":"Rui Xu;Jaroslav Bán;Sarthak Kalani;Chen-Kai Hsu;Subhajit Ray;Brian Kirby;Gabriel Matos;Julia Gonski;Andrew C. Smith;Daniel M. Williams;Kiley E. Kennedy;Alan Kahn;Michelle Contreras-Cossio;Lauren Larson;Michael Himmelsbach;Devanshu Panchal;Michael Unanian;Xiangxing Yang;Nan Sun;John Parsons;Timothy R. Andeen;Peter R. Kinget","doi":"10.1109/OJSSCS.2025.3573904","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3573904","url":null,"abstract":"The custom design of a radiation-hardened, 8-channel, 40-MSPS, 15-bit resolution, 14.2-bit dynamic range, 11.4-ENOB ADC data acquisition ASIC fabricated in a commercial 65-nm triple-well CMOS technology is presented. The ADC is developed for and integrates seamlessly into the readout system for the ATLAS liquid argon (LAr) calorimeter in the high-luminosity large hadron collider (HLLHC) upgrade at CERN, which will require a total of 364 936 ADC channels. A three-stage MDAC+SAR pipelined ADC architecture was designed to meet the physics requirements and scientific goals of the ATLAS experiment. The ADC is a fully self-contained data acquisition system that includes foreground calibration, digital data processing, digital control, and supporting circuitry. The measured performance shows the ADC achieves a competitive dynamic range and SNDR, and it meets or exceeds the ATLAS analog requirements. Radiation tolerance and scalability design considerations were implemented at the device-, circuit-, and system-level. Radiation-hardening-by-design techniques used include redundancy for digital circuits, the use of MiM capacitors, and a hybrid RC-DAC for the ADC core. The ADC ASIC was demonstrated to be robust against the effects of the intense radiation expected in the HL-LHC experimental environment.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"180-199"},"PeriodicalIF":0.0,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11017335","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144519403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Dual-SSHC Rectifier With Digital-DCB MPPT for Triboelectric Energy Harvesting 带数字dcb MPPT的双sshc摩擦电能采集整流器
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-03-27 DOI: 10.1109/OJSSCS.2025.3573905
Wenyu Peng;Xinling Yue;Willem D. van Driel;Guoqi Zhang;Sijun Du
{"title":"A Dual-SSHC Rectifier With Digital-DCB MPPT for Triboelectric Energy Harvesting","authors":"Wenyu Peng;Xinling Yue;Willem D. van Driel;Guoqi Zhang;Sijun Du","doi":"10.1109/OJSSCS.2025.3573905","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3573905","url":null,"abstract":"Triboelectric nanogenerator (TENG), advantageous in high energy density and flexibility, is promising as a sustainable energy source but can hardly be used to power edge devices directly due to its high-voltage ac output and varying capacitive impedance. To address it, this work proposes a power-conditioning interface with a fully integrated dual synchronous switch harvesting on capacitors (D-SSHC) rectifier for triboelectric energy extraction. Furthermore, a full digital duty-cycle-based (DCB) maximum power point tracking (MPPT) algorithm is developed to optimize the energy harvesting efficiency with simple implementation and continuous tracking. Designed and fabricated in a 0.18-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m BCD process, the proposed interface can extract energy at a maximum output voltage of 70 V. According to the measurement results, it achieves 99% MPPT efficiency and an energy extraction improvement of 598% compared to a full-bridge rectifier.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"200-211"},"PeriodicalIF":0.0,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11016074","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144550394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New Associate Editors 新副编辑
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-03-21 DOI: 10.1109/OJSSCS.2025.3540393
Woogeun Rhee
{"title":"New Associate Editors","authors":"Woogeun Rhee","doi":"10.1109/OJSSCS.2025.3540393","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3540393","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"101-103"},"PeriodicalIF":0.0,"publicationDate":"2025-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10936518","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143667625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
R-STELLAR: A Resilient Synthesizable Signature Attenuation SCA Protection on AES-256 With Built-In Attack-on-Countermeasure Detection R-STELLAR:一种基于AES-256的可复原综合签名衰减SCA保护,内置攻击对抗检测
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-03-19 DOI: 10.1109/OJSSCS.2025.3571334
Archisman Ghosh;Dong-Hyun Seo;Debayan Das;Santosh Ghosh;Shreyas Sen
{"title":"R-STELLAR: A Resilient Synthesizable Signature Attenuation SCA Protection on AES-256 With Built-In Attack-on-Countermeasure Detection","authors":"Archisman Ghosh;Dong-Hyun Seo;Debayan Das;Santosh Ghosh;Shreyas Sen","doi":"10.1109/OJSSCS.2025.3571334","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3571334","url":null,"abstract":"Side-channel attacks (SCAs) remain a significant threat to the security of cryptographic systems in modern embedded devices. Even mathematically secure cryptographic algorithms, when implemented in hardware, inadvertently leak information through physical side-channel signatures, such as power consumption, electromagnetic (EM) radiation, light emissions, and acoustic emanations. Exploiting these side channels significantly reduces the attacker’s search space. In recent years, physical countermeasures have significantly increased the minimum traces-to-disclosure (MTD) to 1 billion. Among them, signature attenuation is the first method to achieve this mark. Signature attenuation often relies on analog techniques, and digital signature attenuation reduces MTD to 20 million, requiring additional methods for high resilience. We focus on improving the digital signature attenuation by an order of magnitude (MTD 200M). Additionally, we explore possible attacks against signature attenuation countermeasure. We introduce a voltage-drop linear-region biasing (VLB) attack technique that reduces the MTD to over 2000 times less than the previous threshold. This is the first known attack against a physical SCA countermeasure. We have implemented an attack detector with a response time of 0.8 ms to detect such attacks, limiting the SCA leakage window to sub-ms, which is insufficient for a successful attack.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"167-179"},"PeriodicalIF":0.0,"publicationDate":"2025-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11006887","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144314721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Simultaneous Bidirectional Signaling for Die-to-Die Links: Signal Integrity Challenges and Hybrid Circuits 模对模链路的同步双向信令:信号完整性挑战和混合电路
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-02-27 DOI: 10.1109/OJSSCS.2025.3546889
Durand Jarrett-Amor;Tony Chan Carusone
{"title":"Simultaneous Bidirectional Signaling for Die-to-Die Links: Signal Integrity Challenges and Hybrid Circuits","authors":"Durand Jarrett-Amor;Tony Chan Carusone","doi":"10.1109/OJSSCS.2025.3546889","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3546889","url":null,"abstract":"This article reviews simultaneous bidirectional signaling and its unique signal integrity challenges for die-to-die links: the near-end echo signal and the hybrid circuit required to remove it, signal reflections, and the impact of timing. A few key works in the design of simultaneous bidirectional transceivers are covered, such as dynamic reference-switching, the replica driver, and the split-termination hybrid, followed by a survey of recent simultaneous bidirectional transceivers for die-to-die links. Finally, we present our own split-termination, passive hybrid simultaneous bidirectional transceiver as a low-power alternative for die-to-die links.","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"5 ","pages":"116-129"},"PeriodicalIF":0.0,"publicationDate":"2025-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10907904","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143845518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2024 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 4 IEEE固态电路学会开放杂志第4卷
IEEE Open Journal of the Solid-State Circuits Society Pub Date : 2025-02-25 DOI: 10.1109/OJSSCS.2025.3545275
{"title":"2024 Index IEEE Open Journal of the Solid-State Circuits Society Vol. 4","authors":"","doi":"10.1109/OJSSCS.2025.3545275","DOIUrl":"https://doi.org/10.1109/OJSSCS.2025.3545275","url":null,"abstract":"","PeriodicalId":100633,"journal":{"name":"IEEE Open Journal of the Solid-State Circuits Society","volume":"4 ","pages":"381-390"},"PeriodicalIF":0.0,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10903144","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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