IEEE Journal on Flexible Electronics最新文献_第7页

Design and Analysis of Enhanced Strain Tolerance in Organic Thin-Film Transistors With Hybrid Al2O3/PVP Dielectrics for Flexible Electronics 柔性电子用Al2O3/PVP混合介质有机薄膜晶体管应变容限的设计与分析

IEEE Journal on Flexible Electronics Pub Date : 2025-11-14 DOI: 10.1109/JFLEX.2025.3633230

Lingala Prasanthi;M. Durga Prakash

{"title":"Design and Analysis of Enhanced Strain Tolerance in Organic Thin-Film Transistors With Hybrid Al2O3/PVP Dielectrics for Flexible Electronics","authors":"Lingala Prasanthi;M. Durga Prakash","doi":"10.1109/JFLEX.2025.3633230","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3633230","url":null,"abstract":"Flexible and wearable electronics demand transistor technologies that can sustain stable performance under extreme mechanical deformation. In this work, we propose a quantitative benchmarking framework for strain resilience in organic thin-film transistors (OTFTs), introducing three normalized metrics: degradation factor (DF), quantifying drain-current loss under strain; the mobility factor (MF), representing the rate of charge-transport degradation per unit strain; and the strain-stability window (SSW), defining the maximum strain range within which devices remain in the safe operating zone (DF < 15%). Using Silvaco Victory TCAD, we systematically investigate the strain-dependent behavior of single-dielectric (Al2O3) and hybrid-dielectric (Al2O3/PVP) OTFTs under both compressive (concave) and tensile (convex) bending with radii from 8 to 1 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m. Results show that hybrid-dielectric OTFTs exhibit superior strain tolerance, with a DF of only 9% under 9.85% tensile strain, compared with 25% for single-dielectric devices. Furthermore, hybrid devices show a markedly lower MF (−3%/strain compressive and −1.9%/strain tensile) compared with single-dielectric OTFTs (−6%/strain compressive and −5%/strain tensile). Beyond confirming the mechanical advantages of hybrid dielectrics, our study demonstrates that strain-stability quantifiers provide a universal method to benchmark flexible OTFT reliability, bridging device physics with practical requirements of wearable bioelectronics. These findings establish hybrid Al2O3/PVP dielectrics not only as performance enhancers but also as reliable design enablers for next-generation strain-resilient organic electronics.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 1","pages":"26-35"},"PeriodicalIF":0.0,"publicationDate":"2025-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145963439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Desktop Inkjet Printing of Foldable Metasurface Antenna on Paper Substrates 纸张基板上可折叠超表面天线的桌面喷墨打印

IEEE Journal on Flexible Electronics Pub Date : 2025-11-06 DOI: 10.1109/JFLEX.2025.3630107

Rupesh Pawar;Soumya Chakravarty;Tapas Chakravarty;Venugopal Santhanam

{"title":"Desktop Inkjet Printing of Foldable Metasurface Antenna on Paper Substrates","authors":"Rupesh Pawar;Soumya Chakravarty;Tapas Chakravarty;Venugopal Santhanam","doi":"10.1109/JFLEX.2025.3630107","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3630107","url":null,"abstract":"Metasurfaces enable subwavelength electromagnetic control with transformative wavefront engineering potential. We demonstrate a scalable, cost-effective fabrication route for high-performance metasurface collimators by printing silver nanostructures onto paper using silver halide photochemistry, eliminating complex inks and post-processing whilst enabling roll-to-roll compatibility. A two-layer uniform periodic array excited by a single-patch antenna achieves 6.87 dB simulated gain improvement at 4 GHz. Experimentally, we observe 6.1-dB gain enhancement with 2.56-mg/cm<inline-formula> <tex-math>${}^{mathrm {^{2}}}$ </tex-math></inline-formula> silver loading, precisely controlled through print iterations and quantified via inductively coupled plasma optical emission spectroscopy (ICP-OES). The printed structures exhibit 40-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m dimensional accuracy (<inline-formula> <tex-math>$!lt !lambda $ </tex-math></inline-formula>/100 at 4 GHz) with uniform square elements yielding maximal collimator efficiency. The paper-based metasurface antenna displays high gain with exceptional polarization purity and can be considered for demanding applications, such as satellite, radar, and advanced wireless systems.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 1","pages":"14-25"},"PeriodicalIF":0.0,"publicationDate":"2025-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145963437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Journal on Flexible Electronics Publication Information IEEE柔性电子出版信息杂志

IEEE Journal on Flexible Electronics Pub Date : 2025-11-05 DOI: 10.1109/JFLEX.2025.3627367

引用次数: 0

Enhancing Screen-Printed Electrode Performance Through Simulation-Driven Design Optimization for Wearable Applications 通过模拟驱动的可穿戴应用设计优化提高丝网印刷电极性能

IEEE Journal on Flexible Electronics Pub Date : 2025-11-03 DOI: 10.1109/JFLEX.2025.3628346

Moritz Ploner;Lara Franchin;Antonio Altana;Bajramshahe Shkodra;Mattia Petrelli;Martina Aurora Costa Angeli;Michele Pompilio;Giulia Elli;Franco Cacialli;Alessandro Paccagnella;Daniele Resnati;Paolo Lugli;Stefano Bonaldo;Luisa Petti

{"title":"Enhancing Screen-Printed Electrode Performance Through Simulation-Driven Design Optimization for Wearable Applications","authors":"Moritz Ploner;Lara Franchin;Antonio Altana;Bajramshahe Shkodra;Mattia Petrelli;Martina Aurora Costa Angeli;Michele Pompilio;Giulia Elli;Franco Cacialli;Alessandro Paccagnella;Daniele Resnati;Paolo Lugli;Stefano Bonaldo;Luisa Petti","doi":"10.1109/JFLEX.2025.3628346","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3628346","url":null,"abstract":"Wearable biosensors are transforming remote health monitoring with noninvasive sweat biomarker detection. Nevertheless, achieving reliable sensing requires miniaturized, flexible platforms capable of detecting, with ultrahigh sensitivity, biomarker levels down to pg/mL scale. Electrochemical platforms, especially those using three-electrode platforms, hold significant promise but require careful geometric optimization to meet these needs. To address this, we evaluated four geometric layouts of screen-printed carbon three-electrode platforms on flexible polyethylene terephthalate (PET) substrates. Our investigation comprises experimental evaluations by means of cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS), supported by simulations through a novel 3-D COMSOL Multiphysics model. The results reveal that a fourfold increase in the active area leads to a twofold increase in the CV peak currents, while reduced electrode spacing enhances current density and minimizes diffusion effects. Comparisons of experimental and simulated CV currents show that larger areas may be more prone to surface disuniformities, making performance more dependent on material properties than on area optimization. The EIS analysis reveals that a fourfold increase in the active area reduces charge transfer resistance (<inline-formula> <tex-math>$R_{text {CT}}$ </tex-math></inline-formula>) by 45%, while doubling the electrode distance results in a 29% increase in <inline-formula> <tex-math>$R_{text {CT}}$ </tex-math></inline-formula>, indicating inefficient charge transfer due to weakened electric fields and reduced charge carrier concentration. Our findings highlight the need for compact designs and simulation-guided geometric optimization for enhanced performance.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 1","pages":"3-13"},"PeriodicalIF":0.0,"publicationDate":"2025-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145963436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

On the Development of Pressure, Temperature, and Humidity Sensors for Electronic Skins 电子皮肤用压力、温度和湿度传感器的研制

IEEE Journal on Flexible Electronics Pub Date : 2025-10-30 DOI: 10.1109/JFLEX.2025.3627533

Cláudia S. Buga;Júlio C. Viana

{"title":"On the Development of Pressure, Temperature, and Humidity Sensors for Electronic Skins","authors":"Cláudia S. Buga;Júlio C. Viana","doi":"10.1109/JFLEX.2025.3627533","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3627533","url":null,"abstract":"Technological advancements in flexible electronics and smart sensing are enabling the development of electronic skins that mimic their biological counterpart more closely. Achieving this requires the use of flexible materials, additive manufacturing processes, and reliable multimodal sensor architectures. This work presents a flexible multisensor platform integrating resistive pressure, temperature, and humidity sensors. Individual sensors were first characterized, then integrated and encapsulated with a polydimethylsiloxane (PDMS) layer for protection and mechanical robustness. Temperature sensors exhibited a linear thermal response, with a slight reduction in sensitivity after encapsulation. Humidity sensors, selectively left unencapsulated, maintained stable performance. Pressure sensors preserved their sensitivity profile, with enhanced low-pressure sensitivity (<10 kPa) but reduced high-pressure response due to PDMS compression limits. Cross-sensitivity tests under varying environmental conditions revealed minimal interference, although digital filtering reduces baseline noise in idle pressure sensors. The proposed platform demonstrates the feasibility of scalable, multimodal e-skins for wearable electronics, soft robotics, and human–machine interfaces.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 12","pages":"460-467"},"PeriodicalIF":0.0,"publicationDate":"2025-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145674878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

IEEE Journal on Flexible Electronics Publication Information IEEE柔性电子出版信息杂志

IEEE Journal on Flexible Electronics Pub Date : 2025-10-28 DOI: 10.1109/JFLEX.2025.3622857

引用次数: 0

IEEE Journal on Flexible Electronics Publication Information IEEE柔性电子出版信息杂志

IEEE Journal on Flexible Electronics Pub Date : 2025-10-16 DOI: 10.1109/JFLEX.2025.3619288

引用次数: 0

Electrical Reliability of Conductor Printed on Stretchable Substrate Under Biaxial Fatigue Loading 可拉伸基板上印刷导体在双轴疲劳载荷下的电气可靠性

IEEE Journal on Flexible Electronics Pub Date : 2025-10-13 DOI: 10.1109/JFLEX.2025.3620764

Kaushik U. Godbole;Rui Chen;Suresh K. Sitaraman

{"title":"Electrical Reliability of Conductor Printed on Stretchable Substrate Under Biaxial Fatigue Loading","authors":"Kaushik U. Godbole;Rui Chen;Suresh K. Sitaraman","doi":"10.1109/JFLEX.2025.3620764","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3620764","url":null,"abstract":"Existing literature has mostly focused on assessing the reliability of flexible and stretchable materials under monotonic uniaxial stretching. Although most wearable patches and smart textiles undergo biaxial stretching, there is limited literature that examines the performance and reliability of these materials under biaxial stretching. The existing literature on biaxial stretching has also confined itself to monotonic stretching and does not discuss fatigue biaxial stretching. Thus, this work aims to illustrate the electrical performance and the reliability of flexible materials under fatigue biaxial stretching. This article outlines an approach to perform fatigue biaxial stretching experiments to test the performance and reliability of stretchable materials before deployment. In this work, the fatigue biaxial stretching parameters, such as the mean strain and the strain amplitude, have been selected as a function of the monotonic failure strain. By conducting tests on stretchable thermoset substrate samples that were screen-printed with a silver micro-flake conductor ink, this work has developed a unique predictive model that relates the fatigue-life of the printed conductor as a function of the applied mean strain and the applied strain amplitude. In addition, this work has also examined the average rate of resistance increase and how it is related to the applied mean strain and the applied strain amplitude. In this work, it is found that the failure of the samples under biaxial fatigue loading is dependent on both the mean strain and strain amplitude. However, it is also found in this work that the number of cycles to fatigue failure has a much higher sensitivity to the strain amplitude than to the mean strain. It is further seen that when the strain amplitude is kept constant, the rate of increase in the conductor resistance per cycle is higher when the mean strain is increased.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 12","pages":"446-459"},"PeriodicalIF":0.0,"publicationDate":"2025-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145674836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Editorial for the 2024 International Flexible Electronics Technology Conference (IFETC) held in Bologna, Italy 在意大利博洛尼亚举行的2024年国际柔性电子技术会议（IFETC）的社论

IEEE Journal on Flexible Electronics Pub Date : 2025-10-07 DOI: 10.1109/JFLEX.2025.3609434

Jasmin Aghassi-Hagmann;Niels Benson;Riccardo Colella;Luisa Petti;Almudena Rivadeneyra;Dimitra G. Georgiadou

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IEEE Journal on Flexible Electronics Call for Papers: Cross Society Special Issue (ISCAS 2025 and IFETC 2025) on Flexible Hybrid Electronics: Next-Generation Circuits and Systems for Wearable Intelligence IEEE柔性电子期刊征文：柔性混合电子：下一代可穿戴智能电路和系统的跨社会特刊（ISCAS 2025和IFETC 2025）

IEEE Journal on Flexible Electronics Pub Date : 2025-10-07 DOI: 10.1109/JFLEX.2025.3612599

引用次数: 0