利用电流体动力印刷技术制造具有导电银结构的可适形电子器件

Nadine Philippin;Ingo Kuehne;Gabriele Schrag
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摘要

近年来,柔性、可拉伸或具有印刷导电结构的保形电子器件的研究和制造取得了长足进步,并实现了广泛的应用。消费电子产品或用于健康监测的可穿戴设备等各个领域都受到了这些成果的影响。由于对此类电子产品的增强功能和优异变形能力的要求逐渐提高,因此必须对适当的超弹性材料和先进的制造技术进行研究。本文介绍了一种基于真空热成型和印刷微银结构的低成本、高效率的保形电子器件制造方法。导电线阵列和蜿蜒线形式的图案是通过新兴的电流体动力印刷(EHD)技术实现的,由于各种印刷介质的适用性及其材料的高兼容性,该技术有望替代现有的添加剂技术。此外,通过对比穆尼-里夫林(Mooney-Rivlin)、奥格登(Ogden)、新胡克恩(neo-Hookean)以及用于描述变形过程中可拉伸热塑性聚氨酯(TPU)的杨氏(Yeoh)模型等超弹性材料模型,并通过数值模拟推导出导电结构设计优化的一般能力。基于在热塑性聚氨酯上的超高压打印金属银图案,以及随后通过热成型将100- $\mu $ m厚的扁平基体转移到三维形状的电子设备上,实现了变形度高达57%的首批演示器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Conformable Electronics With Conductive Silver Structures by Electrohydrodynamic Printing
Recent advances in research and fabrication of flexible, stretchable, or rather conformable electronics with printed conductive structures have enabled a wide range of applications. Various fields such as consumer electronics or wearable devices for health monitoring are affected by these achievements. Owing to gradually increasing demands on enhanced functionalities and an excellent deformability of such electronics, an investigation of appropriate hyperelastic materials and progressive manufacturing techniques are mandatory. In this article, a cost-efficient approach for fabrication of conformable electronics based on vacuum thermoforming with printed microscaled silver structures is presented. The patterns in form of conductive line arrays and meanders are realized by the emerging electrohydrodynamic printing (EHD) technique which constitutes a promising alternative to established additive technologies due to the applicability of various printing media as well as its high material compatibility. Moreover, hyperelastic material models comprising the Mooney-Rivlin, Ogden, neo-Hookean as well as the Yeoh model for description of stretchable thermoplastic polyurethane (TPU) during deformation are contrasted and general capabilities for design optimization of conductive structures are derived by means of numerical simulations. Based on the EHD-printed metallic silver patterns on TPU with a subsequent transfer of the flat 100- $\mu $ m thick matrix toward a 3D-shaped electronic device by thermoforming, first demonstrators with a degree of deformation up to 57% are realized.
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