IEEE Journal on Flexible Electronics最新文献

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IEEE Journal on Flexible Electronics Publication Information IEEE柔性电子出版信息杂志
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-10-09 DOI: 10.1109/JFLEX.2026.3737556
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引用次数: 0
Printed Multilayer Liquid Metal Stretchable Fine Pitch Circuits and Sensors With Direct Component Attachment 印刷多层液态金属可拉伸细间距电路和传感器与直接元件连接
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-07-09 DOI: 10.1109/JFLEX.2026.3710443
Ritwik Pandey;Nicholas Pratt;Jorge Saa;Milica Miladinovic;Joseph Adegite;Markus P. Nemitz;Pratap M. Rao
{"title":"Printed Multilayer Liquid Metal Stretchable Fine Pitch Circuits and Sensors With Direct Component Attachment","authors":"Ritwik Pandey;Nicholas Pratt;Jorge Saa;Milica Miladinovic;Joseph Adegite;Markus P. Nemitz;Pratap M. Rao","doi":"10.1109/JFLEX.2026.3710443","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3710443","url":null,"abstract":"This article demonstrates a method for the additive manufacturing of multilayer stretchable soft electronic circuits and sensors composed of printed liquid metal (LM) conductors and embedded surface-mount components on each layer. Such stretchable devices are envisioned to find applications in wearable devices and soft robotics. The manufacturing method uses digital nozzle-based direct ink writing (DIW) or stencil printing to print a stretchable circuit and sensors composed of commercially available LM conductive ink onto a stretchable thermoplastic polyurethane (TPU) sheet, followed by the placement of components onto the LM circuit, and encapsulation. Printing, placement, and encapsulation are then repeated to build up multiple circuits and sensor layers, each layer with its own placed components. LM test traces and circuits were printed with widths and spacings down to <inline-formula> <tex-math>$250;mu mathrm {m}$ </tex-math></inline-formula>. Lamination of TPU sheets by hot-pressing was found to be the most robust encapsulation method for the LM circuits, compared to the use of adhesive bond tape and casting silicone. Interlayer vias were created by laser-cutting via holes in the TPU encapsulant sheets before lamination, and filling these with LM printed in the next circuit layer. Passive components (1608- and 1005-m size) and packaged integrated circuits (ICs)-X2QFN-10 (eXtremely thin quad flat no (QFN)-leads) were placed directly onto the LM circuits with no additional adhesive or solder and were successfully encapsulated by conformally laminating a TPU sheet on top to form a robust assembly. The stretchable circuits were consistently able to withstand over 1000 cycles of stretching with up to 225% strain (the maximum tested) with average baseline resistance increasing from <inline-formula> <tex-math>$0.58~Omega $ </tex-math></inline-formula> to <inline-formula> <tex-math>$1.20~Omega $ </tex-math></inline-formula> for 5-cm-long 2-mm-wide traces and from <inline-formula> <tex-math>$2.17~Omega $ </tex-math></inline-formula> to <inline-formula> <tex-math>$2.79~Omega $ </tex-math></inline-formula> for 3-cm-long 250-<inline-formula> <tex-math>$mu mathrm {m}$ </tex-math></inline-formula>-wide traces. Circuits with vias and placed components had similar cyclic stretching performance with only modest additional resistances. Demonstrator circuits included a two-layer circuit consisting of LEDs in both layers and a two-layer circuit in which a packaged analog-to-digital converter IC reads out a resistive strain sensor that is monolithically printed on the same TPU substrate. While the demonstrated DIW and stencil printing processes are suitable for prototyping stretchable circuits, the overall process is also compatible with other printing methods, including screen printing, which can be used for higher throughput production.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"364-376"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149131045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Securing Low-Cost Flexible Devices Using the TinyJAMBU Cipher for Authenticated Encryption 使用TinyJAMBU密码保护低成本的灵活设备进行身份验证加密
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-07-06 DOI: 10.1109/JFLEX.2026.3710447
Jelle Biesmans;Wim Dehaene;Kris Myny;Nele Mentens
{"title":"Securing Low-Cost Flexible Devices Using the TinyJAMBU Cipher for Authenticated Encryption","authors":"Jelle Biesmans;Wim Dehaene;Kris Myny;Nele Mentens","doi":"10.1109/JFLEX.2026.3710447","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3710447","url":null,"abstract":"This work presents the first complete solution for authenticating and encrypting the communication of flexible devices. Whereas existing work only covers the encryption of transmitted data, authenticated encryption is critical in most real-world applications. The goal of providing flexible IoT devices with authenticated encryption is to not only ensure the confidentiality of the transmitted data (like previous solutions do), but also to enable the verification of the integrity and authenticity of the transmitted data. First, this work discusses why flexible applications require security, and then provides an overview of the options available to make these applications more secure. Based on this overview, we select the TinyJAMBU cryptographic algorithm as a good candidate for our technology. Subsequently, we propose a digital hardware architecture for TinyJAMBU and we fabricate a chip that implements that architecture. Our lightweight cryptography block based on the TinyJAMBU algorithm is manufactured in a 600-nm indium gallium zinc oxide (IGZO) transistor technology on a flexible substrate. The device reaches a maximum throughput of 21.5 kbit/s, while the power can drop to 311 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>W. The chip measures 13.2 mm<sup>2</sup> in total area. Our work is the first to demonstrate that the communication of flexible thin-film-transistor-based RFID tags, healthcare patches, and IoT devices can be protected through authenticated encryption at a reasonable cost in terms of throughput, power consumption and area.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"356-363"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11595592","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149133750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: Special Issue on Selected Papers from the 8th IEEE International Flexible Electronics Technology Conference (IFETC) 2026 论文征集:第8届IEEE国际柔性电子技术会议(IFETC) 2026论文特刊
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-10-09 DOI: 10.1109/JFLEX.2026.3737597
{"title":"Call for Papers: Special Issue on Selected Papers from the 8th IEEE International Flexible Electronics Technology Conference (IFETC) 2026","authors":"","doi":"10.1109/JFLEX.2026.3737597","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3737597","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"395-395"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11732267","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149131529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Cost-Effective Flexible Sensor for Physical Activity and Resting Respiration Monitoring 一种用于身体活动和静息呼吸监测的具有成本效益的柔性传感器
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-07-09 DOI: 10.1109/JFLEX.2026.3711570
Sabiha Sharmin;Tasnim Z. Adry;Mohammad Rafiqul Haider
{"title":"A Cost-Effective Flexible Sensor for Physical Activity and Resting Respiration Monitoring","authors":"Sabiha Sharmin;Tasnim Z. Adry;Mohammad Rafiqul Haider","doi":"10.1109/JFLEX.2026.3711570","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3711570","url":null,"abstract":"The shift toward remote, data-centric healthcare has accelerated the demand for wearable technologies capable of continuously monitoring vital physiological signals in everyday life, particularly motion and respiration, to assess health status. Conventional respiration monitors and motion-tracking devices are expensive and rely on rigid structures, frequent calibration, and complex fabrication, limiting their practicality for daily use. This work presents a flexible, cost-effective sensor capable of supporting both motion sensing and respiration monitoring within the same device architecture, fabricated using direct ink writing (DIW) of silver nanoparticle ink on polyethylene terephthalate substrates, followed by low-temperature curing for rapid, low-cost production, with an estimated material cost of <inline-formula> <tex-math>${$}2.25$ </tex-math></inline-formula> per sensor. Two configurations were investigated, including an initial meander-shaped design for capacitive characterization under mechanical vibrations and physical activities, and an improved interdigitated electrode (IDE) layout with a hexagonal boron nitride (hBN) layer to improve electric field confinement and humidity sensitivity. Using capacitive and resistive properties, the sensor enables activity monitoring through capacitance variations and resting respiration sensing through humidity-induced resistivity changes. Motion sensing demonstrated a wide operational span across activity intensities, characterized by a detection limit (DL) of 36.1 pA and a dynamic sensitivity (DS) of <inline-formula> <tex-math>$1.94 times 10^{3}$ </tex-math></inline-formula>, enabling reliable discrimination of activities such as clapping, running, and walking with repeatability errors (REs) of 16.6%–34.8% across activity classes while maintaining ultralow power consumption below <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>W. The respiration sensor achieved an average peak-to-peak amplitude of <inline-formula> <tex-math>$4.75~mu $ </tex-math></inline-formula>A and a signal-to-noise ratio (SNR) of 12.95 dB, confirming excellent sensitivity and signal clarity. This approach combines high performance with structural simplicity and cost-effectiveness, establishing a scalable foundation for next-generation wearable health monitoring systems.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"377-386"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149131224","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Amplifier With Programmable Gain Using a-IGZO TFTs on Flexible Substrate 基于柔性衬底的a-IGZO TFTs可编程增益放大器
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-07-27 DOI: 10.1109/JFLEX.2026.3717588
Mayana Yousuf Ali Khan;Pydi Ganga Bahubalindruni
{"title":"Amplifier With Programmable Gain Using a-IGZO TFTs on Flexible Substrate","authors":"Mayana Yousuf Ali Khan;Pydi Ganga Bahubalindruni","doi":"10.1109/JFLEX.2026.3717588","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3717588","url":null,"abstract":"This article presents an amplifier with programmable gain using indium–gallium–zinc-oxide (a-IGZO) single-gate unipolar (n-type) oxide thin-film transistors on a 27-<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m thick polyimide substrate for the first time. The circuit employs a double-bootstrap load and a binary-weighted switching technique to control the gain. From experimental characterization under normal ambient conditions, the amplifier shows a gain ranging from 3.20 to 20.09 dB with a four-bit digital control word at a <inline-formula> <tex-math>$mathbf {V_{DD}}$ </tex-math></inline-formula> of 5 V and a load of ~8 pF<inline-formula> <tex-math>$parallel$ </tex-math></inline-formula><inline-formula> <tex-math>$10~mathbf {MOmega }$ </tex-math></inline-formula>. Under these conditions, the amplifier shows a maximum power consumption of ~<inline-formula> <tex-math>$615.15~boldsymbol {mu }$ </tex-math></inline-formula>W, a 3-dB bandwidth of ~1.16 MHz, a unity gain frequency of ~9 MHz, CMRR of 26.48 dB, PSRR of 11.56 dB at 1 kHz, slew rate of 0.20 V/<inline-formula> <tex-math>$boldsymbol {mu }$ </tex-math></inline-formula>s, and figure of merit (FOM) of 117 kHz.pF/<inline-formula> <tex-math>$boldsymbol {mu }$ </tex-math></inline-formula>W, with digital control bits of “1111.” The proposed amplifier finds potential applications in the analog front-end to process signals generated from various sensors to implement smart sensing applications, including surface electromyography (sEMG) monitoring.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"387-394"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149131512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for IEEE Journal on Flexible Electronics (J-FLEX) Editor-in-Chief Position 诚聘IEEE柔性电子期刊(J-FLEX)主编
IEEE Journal on Flexible Electronics Pub Date : 2026-10-01 Epub Date: 2026-10-09 DOI: 10.1109/JFLEX.2026.3741442
{"title":"Call for Nominations for IEEE Journal on Flexible Electronics (J-FLEX) Editor-in-Chief Position","authors":"","doi":"10.1109/JFLEX.2026.3741442","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3741442","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 10","pages":"396-396"},"PeriodicalIF":0.0,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11732255","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149131515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Flexible Electronics Publication Information IEEE柔性电子出版信息杂志
IEEE Journal on Flexible Electronics Pub Date : 2026-09-01 Epub Date: 2026-09-07 DOI: 10.1109/JFLEX.2026.3727742
{"title":"IEEE Journal on Flexible Electronics Publication Information","authors":"","doi":"10.1109/JFLEX.2026.3727742","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3727742","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 9","pages":"C2-C2"},"PeriodicalIF":0.0,"publicationDate":"2026-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11682955","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148902644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Flexible β-Phase PVDF–Cu–MAA Self-Powered Nanofiber Nanogenerator for Energy Harvesting Applications 用于能量收集的柔性β相PVDF-Cu-MAA自供电纳米纤维纳米发电机
IEEE Journal on Flexible Electronics Pub Date : 2026-09-01 Epub Date: 2026-06-01 DOI: 10.1109/JFLEX.2026.3698890
Sachin;Sumit Choudhary;Satinder K. Sharma
{"title":"Flexible β-Phase PVDF–Cu–MAA Self-Powered Nanofiber Nanogenerator for Energy Harvesting Applications","authors":"Sachin;Sumit Choudhary;Satinder K. Sharma","doi":"10.1109/JFLEX.2026.3698890","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3698890","url":null,"abstract":"This work reports the efficient development of polyvinylidene fluoride (PVDF) nanofibers doped with copper methacrylate (Cu–MAA) to form metal-organic clusters (MOCs), demonstrating notable energy generation and harvesting capabilities, and having strong potential for flexible electronics applications. A flexible piezoelectric nanogenerator (PENG) device was fabricated using electrospun PVDF–Cu–MAA nanofibers. These nanofibers form a matrix embedded between two flexible electrodes to fabricate device structures capable of converting mechanical force into electrical energy, and thereby enabling self-powered sensing. The pristine PVDF-based PENG devices and PVDF–Cu–MAA hybrid PENG devices produced peak-to-peak output voltages of approximately 2.14 and 6.14 V under mechanical tapping, respectively. The incorporation of 5-w/v% Cu–MAA significantly improved the piezoelectric response without compromising the flexibility of the polymer mat. These enhancements are primarily attributed to the increased formation of the polar <inline-formula> <tex-math>$beta $ </tex-math></inline-formula>-phase in the hybrid nanofibers. Furthermore, the PENG devices were integrated with a DHT11 sensor and EPS-32 microcontroller, enabling real-time temperature and humidity sensing. These findings demonstrate the high potential of Cu–MAA-doped PVDF hybrid nanofibers PENG device for use in self-powered energy harvesting systems and sustainable sensing applications.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 9","pages":"332-339"},"PeriodicalIF":0.0,"publicationDate":"2026-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148902771","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Flexible-Compatible ZnO/rGO Heterostructure Ammonia Sensors With Schottky Barrier Modulation and Neural Network Prediction 具有肖特基势垒调制和神经网络预测的柔性兼容ZnO/rGO异质结构氨传感器
IEEE Journal on Flexible Electronics Pub Date : 2026-09-01 Epub Date: 2026-06-08 DOI: 10.1109/JFLEX.2026.3701325
Gulshan Kumar;Deepak Punetha;Sanjay Kumar;Saurabh Kumar Pandey
{"title":"Flexible-Compatible ZnO/rGO Heterostructure Ammonia Sensors With Schottky Barrier Modulation and Neural Network Prediction","authors":"Gulshan Kumar;Deepak Punetha;Sanjay Kumar;Saurabh Kumar Pandey","doi":"10.1109/JFLEX.2026.3701325","DOIUrl":"https://doi.org/10.1109/JFLEX.2026.3701325","url":null,"abstract":"A highly sensitive ammonia (NH<sub>3</sub>) gas sensor based on zinc oxide/reduced graphene oxide (ZnO/rGO) heterostructure thin film is presented, demonstrating enhanced interfacial charge transfer and improved sensing performance at room temperature (RT). Microscopic and spectroscopic analysis confirm the coverage of rGO sheets over ZnO nanoparticles, increased defect density (<inline-formula> <tex-math>$I_{D}/I_{G} approx 1.3$ </tex-math></inline-formula>), a 0.35 eV shift in Zn 2p binding energy, and approximately ~72% enhancement in lattice oxygen contribution, indicating strong electronic coupling at the interface. Electrical characterization reveals an 18.4% reduction in Schottky barrier height and a 26.7% decrease in ideality factor, facilitating efficient carrier transport. The sensor operates over an NH<sub>3</sub> concentration range of 0.5–50 ppm NH<sub>3</sub> at RT, achieving a 75.02% response at 50 ppm (<inline-formula> <tex-math>$1.6times $ </tex-math></inline-formula> higher than that of ZnO). Fast response and recovery times of 18 and 12 s, respectively, along with theoretical detection limit of 2.14 ppm, were achieved. The device exhibits good selectivity, repeatability, and stability with less than <3%> <tex-math>$R^{2}$ </tex-math></inline-formula>) close to <inline-formula> <tex-math>$approx 0.99$ </tex-math></inline-formula>. The results demonstrate a combined heterostructure-engineering and data-driven strategy for advanced gas sensing applications.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"5 9","pages":"323-331"},"PeriodicalIF":0.0,"publicationDate":"2026-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148902689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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