Electrodeposition and Surface Treatment最新文献_第4页

Conference announcements 会议公告

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90055-3

引用次数: 0

Organic additives in zinc electroplating 电镀锌中的有机添加剂

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90048-6

K. Boto

引用次数: 57

Texture and morphology of nickel coatings deposited in the presence of surfactants 表面活性剂作用下镍镀层的结构和形貌

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90050-4

St. Rashkov, N. Atanasov

{"title":"Texture and morphology of nickel coatings deposited in the presence of surfactants","authors":"St. Rashkov, N. Atanasov","doi":"10.1016/0300-9416(75)90050-4","DOIUrl":"10.1016/0300-9416(75)90050-4","url":null,"abstract":"<div>The morphology and orientation texture of nickel coatings obtained from a Watts electrolyte in the presence of iodine ions, butyne-2-diol 1,4, formalin and phthalic anhydride over a wide current density and temperature interval were investigated. Electron diffraction measurements made it possible to determine the orientation axis at small thicknesses (from 1000 to 10,000 Å).The 〈110〉 and 〈211〉 orientation axes observed in coatings obtained in the presence of iodine ions appear at a considerably later stage of the formation process of the coatings, whereas the addition of butyne-2-diol 1,4 leads to the formation of an oriented coating at a coating thickness of 1000 Å.The morphology of coatings with a 〈211〉 orientation in the presence of iodine ions and butyne-2-diol 1,4 is completely different owing to the different growth mechanisms in the presence of one or another of the additives.The presence or absence of the extra reflection on the electron diffraction patterns from coatings with a 〈211〉 orientation is thought to be connected with a different growth mechanism and therefore with a different morphology.In the presence of formalin or phthalic anhydride the morphology of the nickel coating closely resembles that observed in the presence of iodine ions in the electrolyte.</div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"3 2","pages":"Pages 105-120"},"PeriodicalIF":0.0,"publicationDate":"1975-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(75)90050-4","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80236279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Characterization of the corrosion or anodic oxidation products on zinc 锌表面腐蚀或阳极氧化产物的表征

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90052-8

G. Trabanelli, F. Zucchi, G. Brunoro, G. Gilli

引用次数: 11

X-ray line broadening in electrodeposited gold coatings 电沉积金镀层的x射线谱线展宽

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90053-X

L. Revay

引用次数: 6

A new method for the determination of stress-strain curves on thin electroplated layers 一种测定薄电镀层应力-应变曲线的新方法

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90054-1

Ch.J. Raub, J. Lendvay

引用次数: 0

Electrolytic aluminium-plating in fused salts based on chlorides 以氯化物为基础的熔盐中的电解镀铝

Electrodeposition and Surface Treatment Pub Date : 1975-03-01 DOI: 10.1016/0300-9416(75)90051-6

M. Paučírová, K. Matiašovský

引用次数: 12

Molten salts in metal treating: Present uses and future trends 熔盐在金属处理中的应用现状及未来趋势

Electrodeposition and Surface Treatment Pub Date : 1975-01-01 DOI: 10.1016/0300-9416(75)90008-5

M. Galopin, J.S. Daniel

引用次数: 15

Die elektrolytische abscheidung von Kupferüberzü gen aus pyrophosphatelektrolyten 电解质对黄铁矿进行的铜沉淀

Electrodeposition and Surface Treatment Pub Date : 1975-01-01 DOI: 10.1016/0300-9416(75)90009-7

B.A. Purin, E.A. Ozola

{"title":"Die elektrolytische abscheidung von Kupferüberzü gen aus pyrophosphatelektrolyten","authors":"B.A. Purin, E.A. Ozola","doi":"10.1016/0300-9416(75)90009-7","DOIUrl":"10.1016/0300-9416(75)90009-7","url":null,"abstract":"<div><ul><li>1.1. In copper pyrophosphate solutions in the range of pH 8 – 9, the copper electrode is reversible with respect to the free copper ions in the solution.</li><li>2.2. At the cathode, the formation of a passive layer and the stepwise-reduction of the anionic copper pyrophosphate complex are most important. These phenomena determine the high cathodic polarisation and the finegrained structure of electroplated copper.</li><li>3.3. The investigation of the electrochemical behaviour of an iron electrode in copper pyrophosphate plating solutions showed that the passive and active state of the electrode depends on the following: the concentrations of the principal components, the pH, and the presence of adducts in the solution. These factors must be taken into account for the production of adhering deposits in the electroplating of copper.</li><li>4.4. A copper pyrophosphate electrolyte for bright copper plating on steel is described.</li></ul></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"3 1","pages":"Pages 33-43"},"PeriodicalIF":0.0,"publicationDate":"1975-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(75)90009-7","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84933164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Electro-affinage du cuivre: Influence des ions chlorure sur la cinetique de la reaction anodique 铜的电精炼:氯离子对阳极反应动力学的影响

Electrodeposition and Surface Treatment Pub Date : 1975-01-01 DOI: 10.1016/0300-9416(75)90010-3

R Galecio , J Guitton

引用次数: 0