{"title":"铜的电精炼:氯离子对阳极反应动力学的影响","authors":"R Galecio , J Guitton","doi":"10.1016/0300-9416(75)90010-3","DOIUrl":null,"url":null,"abstract":"<div><p>The anodic dissolution of copper was studied in acid sulfate solution with concentrations and temperature as in the industry of electrolytic refining of copper. The effect of chloride ions in the phenomenon was studied, by using anodic and cathodic voltametry and potentiostatic methods. The results show that the mechanism of copper dissolution is not radically altered by the presence of chloride ions in the range of chloride concentrations and tension studied, but a cuprous chloride layer formed at the anode surface is confirmed causing a general decrease of anodic current density in voltametry. The observed phenomenon suggests a mechanism of copper oxidation via adsorbed phase.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"3 1","pages":"Pages 45-53"},"PeriodicalIF":0.0000,"publicationDate":"1975-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(75)90010-3","citationCount":"0","resultStr":"{\"title\":\"Electro-affinage du cuivre: Influence des ions chlorure sur la cinetique de la reaction anodique\",\"authors\":\"R Galecio , J Guitton\",\"doi\":\"10.1016/0300-9416(75)90010-3\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The anodic dissolution of copper was studied in acid sulfate solution with concentrations and temperature as in the industry of electrolytic refining of copper. The effect of chloride ions in the phenomenon was studied, by using anodic and cathodic voltametry and potentiostatic methods. The results show that the mechanism of copper dissolution is not radically altered by the presence of chloride ions in the range of chloride concentrations and tension studied, but a cuprous chloride layer formed at the anode surface is confirmed causing a general decrease of anodic current density in voltametry. The observed phenomenon suggests a mechanism of copper oxidation via adsorbed phase.</p></div>\",\"PeriodicalId\":100399,\"journal\":{\"name\":\"Electrodeposition and Surface Treatment\",\"volume\":\"3 1\",\"pages\":\"Pages 45-53\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1975-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0300-9416(75)90010-3\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrodeposition and Surface Treatment\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0300941675900103\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrodeposition and Surface Treatment","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0300941675900103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electro-affinage du cuivre: Influence des ions chlorure sur la cinetique de la reaction anodique
The anodic dissolution of copper was studied in acid sulfate solution with concentrations and temperature as in the industry of electrolytic refining of copper. The effect of chloride ions in the phenomenon was studied, by using anodic and cathodic voltametry and potentiostatic methods. The results show that the mechanism of copper dissolution is not radically altered by the presence of chloride ions in the range of chloride concentrations and tension studied, but a cuprous chloride layer formed at the anode surface is confirmed causing a general decrease of anodic current density in voltametry. The observed phenomenon suggests a mechanism of copper oxidation via adsorbed phase.
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