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2021 IEEE Sensors最新文献

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An Untethered Multimodal Haptic Hand Wearable 一种非系绳多模态触觉手穿戴设备
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639526
Alexander C. Abad, Manex Ormazabal, David Reid, Anuradha Ranasinghe
{"title":"An Untethered Multimodal Haptic Hand Wearable","authors":"Alexander C. Abad, Manex Ormazabal, David Reid, Anuradha Ranasinghe","doi":"10.1109/SENSORS47087.2021.9639526","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639526","url":null,"abstract":"Haptic primary colors correspond to temperature, vibration, and force. Previous studies combined these three haptic primary colors to produce different types of cutaneous sensations without the need to touch a real object. This study presents a low-cost untethered hand wearable with temperature, vibration, and force feedback. It is made from low-cost and commercial off-the-shelf components. A 26 mm annular Peltier element with a 10 mm hole is coupled to an 8 mm mini disc vibration motor, forming vibro-thermal tactile feedback for the user. All the other fingertips have an 8 mm disc vibration motor strapped on them using Velcro. Moreover, kinesthetic feedback extracted from a retractable ID badge holder with a small solenoid stopper is used as force feedback that restricts the fingers’ movement. Hand and finger tracking is done using Leap Motion Controller interfaced to a virtual setup with different geometric figures developed using Unity software. Therefore, we argue this prototype as a whole actuates cutaneous and kinesthetic feedback that would be useful in many virtual applications such as Virtual Reality (VR), teleoperated surgeries, and teleoperated farming and agriculture.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"28 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84872574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Ultrasensitive strain sensor enhanced by Bonded Light Emitting Diodes 键合发光二极管增强的超灵敏应变传感器
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639603
T. Nguyen, T. Dinh, V. Dau, A. Foisal, Hung Nguyen, Hieu Vu, T. Pham, C. Tran, Tuan‐Khoa Nguyen, Hoang‐Phuong Phan, N. Nguyen, D. Dao
{"title":"Ultrasensitive strain sensor enhanced by Bonded Light Emitting Diodes","authors":"T. Nguyen, T. Dinh, V. Dau, A. Foisal, Hung Nguyen, Hieu Vu, T. Pham, C. Tran, Tuan‐Khoa Nguyen, Hoang‐Phuong Phan, N. Nguyen, D. Dao","doi":"10.1109/SENSORS47087.2021.9639603","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639603","url":null,"abstract":"Herein we report a strain sensor with SiC/Si heterostructure exhibiting performance enhanced toward ultra-sensitivity using a bonded pico-light-emitting-diode. First, a cantilever with SiC/Si heterostructure is fabricated, followed by bonding a pico-LED on the top of the cantilever. The lateral photovoltage and photocurrent, then, are investigated under different LED supply voltages. The lateral photovoltage and photocurrent are as high as 7.9 mV and 19.06 µA, respectively, as the bonded LED is powered by a supply voltage of 6V. Finally, the performance of the strain sensor was investigated. When the bonded LED is OFF, the gauge factor (GF) of the strain sensor is 20.5. This GF significantly increases to 18,000 when the bonded LED is ON, which is thousand-time modulation. In other word, the strain sensor with bonded LED has ultra-high sensitivity.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"7 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85494961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
[Copyright notice] (版权)
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/sensors47087.2021.9639737
{"title":"[Copyright notice]","authors":"","doi":"10.1109/sensors47087.2021.9639737","DOIUrl":"https://doi.org/10.1109/sensors47087.2021.9639737","url":null,"abstract":"","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"51 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83769932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Fringe Field Shaping CMOS Capacitive Imaging Array 一种条纹场整形CMOS电容成像阵列
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639495
Kangping Hu, Christopher E. Arcadia, J. Rosenstein
{"title":"A Fringe Field Shaping CMOS Capacitive Imaging Array","authors":"Kangping Hu, Christopher E. Arcadia, J. Rosenstein","doi":"10.1109/SENSORS47087.2021.9639495","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639495","url":null,"abstract":"While classical electrochemical impedance spectroscopy (EIS) focuses on measurements from a single working electrode, dense active microelectrode arrays offer opportunities for new modes of sensing. Here we present experimental results with an integrated sensor array for electrochemical imaging. The system uses a 100 × 100 custom CMOS electrode array with 10 µm × 10 µm pixels, which measures impedance at frequencies up to 100 MHz. The sensor chip is uniquely designed to take advantage of the electrostatic coupling between groups of nearby pixels to re-shape the local electric field. Multiple bias voltages and clock phases create new types of signal diversity that will enable enhanced sensing modes for computational imaging and impedance tomography.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"27 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80244152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
On the Influence of Home Appliances on the Smartphone’s Inertial Sensors 家用电器对智能手机惯性传感器的影响
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639739
Shunit Truzman, Guy Revach, I. Klein
{"title":"On the Influence of Home Appliances on the Smartphone’s Inertial Sensors","authors":"Shunit Truzman, Guy Revach, I. Klein","doi":"10.1109/SENSORS47087.2021.9639739","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639739","url":null,"abstract":"Accelerometers and gyroscopes are used in many applications such as navigation, attitude determination, and Internet of Things. This paper aims to demonstrate that low-cost accelerometers and gyroscopes suffer from external interference when operating near home appliances. As a consequence, the performance of their downstream task may degrade. To cope with such situations, interference sources are mapped using a smartphone in stationary conditions. Anomaly detection using the multivariate Gaussian distribution is applied to detect and remove interference in the inertial data. The influence of inertial data with and without interference is analyzed on a typical attitude and heading reference system algorithm.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"9 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80841821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Diamond-like carbon based micro-pressure sensor with ultra-thin sensitive membrane 具有超薄敏感膜的类金刚石碳基微压力传感器
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639481
Xin Ma, Qi Zhang, Peng Guo, Yulong Zhao, Aiying Wang
{"title":"Diamond-like carbon based micro-pressure sensor with ultra-thin sensitive membrane","authors":"Xin Ma, Qi Zhang, Peng Guo, Yulong Zhao, Aiying Wang","doi":"10.1109/SENSORS47087.2021.9639481","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639481","url":null,"abstract":"in this study, diamond-like carbon (DLC) piezoresistive film and ultra-thin sensitive membrane structure (580 nm thick Si3N4/SiO2) were used for the micro-pressure sensors to improve the sensitivity. High power impulse magnetron sputtering (HiPIMS) process was used to deposit DLC film with high gauge factor (GF), and the wet-etching process was used to fabricate the ultra-thin sensitive structure. Based on Raman spectra, the size of sp2 clusters slightly increased after the release of the internal stress, which might reduce the GF of the DLC film. However, the DLC based sensor still showed high sensitivity of 3.2×10-4/kPa, good non-linearity of 2.4% FS and satisfied repeatability. This work showed an efficient and economical method to improve the performance of the micro-pressure sensors.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"34 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83205086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy 使用多频扫描阻抗显微镜表征3D打印薄片
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639634
Martijn Schouten, G. Krijnen
{"title":"Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy","authors":"Martijn Schouten, G. Krijnen","doi":"10.1109/SENSORS47087.2021.9639634","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639634","url":null,"abstract":"In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"64 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83370692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quality Control of Ultrasound Transducers using distribution-free Overlapping Coefficients 利用无分布重叠系数控制超声换能器的质量
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639520
M. Angerer, M. Zapf, M. Koch, N. Ruiter
{"title":"Quality Control of Ultrasound Transducers using distribution-free Overlapping Coefficients","authors":"M. Angerer, M. Zapf, M. Koch, N. Ruiter","doi":"10.1109/SENSORS47087.2021.9639520","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639520","url":null,"abstract":"Ultrasound tomography for breast cancer imaging relies on high quantities of transducers. These should exhibit reliable performance, low variability and high production yield. This work aims for finding a suitable quality control method to identify manufacturing errors of ultrasound transducer arrays. Electromechanical impedance measurements were performed at five states during the array manufacturing process. Ten parameter were derived from each measurement at each state. The relative change of these parameters allows to evaluate their suitability for quality control. Suitable parameters must exhibit high sensitivity to changes in manufacturing, but low sensitivity to parasitic circuit elements. To quantify the separability, overlapping coefficients were calculated for each parameter between the current and the preceding manufacturing state. These coefficients reflect the intersecting area of two probability density functions which were calculated using a normal kernel function to avoid distributional assumptions. The bandwidth of the electrical input power was found the most suitable parameter for quality control. Identification of manufacturing defects is possible with a probability of 0.006 for false negative decisions. Additionally, it shows high overlapping coefficients when adding parasitic circuit elements. These results encouraged us to use the derived classifiers from easy-to-perform electromechanical impedance measurements for quality control of our ultrasonic transducer arrays.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"10 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81300130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Capacitive Pressure Sensing Unit for Racket Sports 球拍运动电容式压力传感装置
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639249
Ye-Jin Zheng, Wei-Cheng Wang, Rongshun Chen, Wen-hsin Chiu, Yi-Yang Chen, C. Lo
{"title":"Capacitive Pressure Sensing Unit for Racket Sports","authors":"Ye-Jin Zheng, Wei-Cheng Wang, Rongshun Chen, Wen-hsin Chiu, Yi-Yang Chen, C. Lo","doi":"10.1109/SENSORS47087.2021.9639249","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639249","url":null,"abstract":"To sense the finger forces applied on a racket, a capacitive pressure-sensing unit is developed in this work, which is able to quantify the performance of local muscles. In addition, the dynamic window of the sensor is expanded, and the unit is designed in an ergonomic way. Not only the micro electro mechanical system process technology and practical integration are presented for implementation details, but also the force simulation, measurement calibration, and experimental results are provided to prove the feasibility of this work. Although badminton was demonstrated in this work as a proof-of-concept, this work can be beneficial for players of racket sports, in which sophisticated force changes on fingers is importantly linked to the performance.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"3 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82994267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SAW-RFID temperature and strain sensors on metallic substrates 金属基板上的SAW-RFID温度和应变传感器
2021 IEEE Sensors Pub Date : 2021-10-31 DOI: 10.1109/SENSORS47087.2021.9639571
P. Mengue, Baptiste Paulmier, S. Hage-Ali, Cécile Floer, H. M’Jahed, A. Shvetsov, S. Zhgoon, O. Elmazria
{"title":"SAW-RFID temperature and strain sensors on metallic substrates","authors":"P. Mengue, Baptiste Paulmier, S. Hage-Ali, Cécile Floer, H. M’Jahed, A. Shvetsov, S. Zhgoon, O. Elmazria","doi":"10.1109/SENSORS47087.2021.9639571","DOIUrl":"https://doi.org/10.1109/SENSORS47087.2021.9639571","url":null,"abstract":"Herein we present new surface acoustic wave (SAW) sensors integrating a radio-frequency identification code and directly fabricated on metal substrates with piezoelectric thin films. Those sensors overcome by construction the main weakness of strain sensors, namely the need of bonding with adhesives on the monitored equipment. The proof of concept was carried out using a SAW device based on a ZnO/Titanium multilayer structure. Sensors were characterized both in temperature (from 25 to 300 °C) and under strain (from 0 to 1800 µε). Results have shown a good linearity of the sensors’ responses, a good stability at high temperature and a good strain sensitivity.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"13 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90380134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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