Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy

Abstract

In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor.