{"title":"使用多频扫描阻抗显微镜表征3D打印薄片","authors":"Martijn Schouten, G. Krijnen","doi":"10.1109/SENSORS47087.2021.9639634","DOIUrl":null,"url":null,"abstract":"In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor.","PeriodicalId":6775,"journal":{"name":"2021 IEEE Sensors","volume":"64 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy\",\"authors\":\"Martijn Schouten, G. Krijnen\",\"doi\":\"10.1109/SENSORS47087.2021.9639634\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor.\",\"PeriodicalId\":6775,\"journal\":{\"name\":\"2021 IEEE Sensors\",\"volume\":\"64 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE Sensors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SENSORS47087.2021.9639634\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSORS47087.2021.9639634","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy
In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor.