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2019 Symposium on VLSI Technology最新文献

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Economics of semiconductor scaling - a cost analysis for advanced technology node 半导体缩尺经济学——先进技术节点的成本分析
2019 Symposium on VLSI Technology Pub Date : 2019-06-09 DOI: 10.23919/VLSIT.2019.8776521
A. Mallik, J. Ryckaert, R. Kim, P. Debacker, S. Decoster, F. Lazzarino, R. Ritzenthaler, N. Horiguchi, D. Verkest, A. Mocuta
{"title":"Economics of semiconductor scaling - a cost analysis for advanced technology node","authors":"A. Mallik, J. Ryckaert, R. Kim, P. Debacker, S. Decoster, F. Lazzarino, R. Ritzenthaler, N. Horiguchi, D. Verkest, A. Mocuta","doi":"10.23919/VLSIT.2019.8776521","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776521","url":null,"abstract":"Moore's law, the principle that has powered semiconductor scaling for the past 50 years is nearing its end. However, the industry would like to pursue a dimensional scaling roadmap to reap the full benefit of technology innovation. Results shown on this paper demonstrate traditional dimensional scaling approaches involving multi-patterned lithography would skyrocket the manufacturing cost. Design level techniques collectively known as scaling boosters, and innovative Complementary FET (CFET) devices would help to reduce the cost of the technology nodes. To the best of our knowledge, this is the first approach where semiconductor node transitions are benchmarked based on their economic feasibility. To summarize, we have formulated a cost-driven approach that can guide the industry to continue semiconductor scaling.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"24 2","pages":"T202-T203"},"PeriodicalIF":0.0,"publicationDate":"2019-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72554162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Bio-Inspired Neurons Based on Novel Leaky-FeFET with Ultra-Low Hardware Cost and Advanced Functionality for All-Ferroelectric Neural Network 全铁电神经网络中基于新型漏场效应晶体管的超低硬件成本和先进功能的仿生神经元
2019 Symposium on VLSI Technology Pub Date : 2019-06-09 DOI: 10.23919/VLSIT.2019.8776495
C. Chen, M. Yang, S. Liu, T. Liu, K. Zhu, Y. Zhao, H. Wang, Q. Huang, R. Huang
{"title":"Bio-Inspired Neurons Based on Novel Leaky-FeFET with Ultra-Low Hardware Cost and Advanced Functionality for All-Ferroelectric Neural Network","authors":"C. Chen, M. Yang, S. Liu, T. Liu, K. Zhu, Y. Zhao, H. Wang, Q. Huang, R. Huang","doi":"10.23919/VLSIT.2019.8776495","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776495","url":null,"abstract":"For the brain-inspired neuromorphic computing, various emerging memory devices, including FeFET, have been applied to develop the artificial synapses, while the artificial neurons are still mostly CMOS-implemented and suffer from high-hardware-cost issue, especially when expanding advanced functions. In this work, a novel leaky-FeFET (L-FeFET) based on partially crystallized $text{Hf}_{05}text{z}_{text{r}05}text{O}_{2}$ layer is designed to mimic biological neurons. For the first time, we propose and experimentally demonstrate a capacitor-less L-FeFET neuron for basic leaky-integrate-and-fire function with ultra-low hardware cost of only one transistor and one resistor. Furthermore, a new hybrid L-FeFET-CMOS neuron is implemented to expand advanced spike-frequency adaption with almost half of hardware cost compared with CMOS neuron. This work provides a highly-integrated and inherently-low-energy implementation for neuron and the possibility for all-ferroelectric neural networks.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"136 1","pages":"T136-T137"},"PeriodicalIF":0.0,"publicationDate":"2019-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79619391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 30
Modeling of Charge Loss Mechanisms during the Short Term Retention Operation in 3-D NAND Flash Memories 三维NAND闪存短期保持过程中电荷损失机制的建模
2019 Symposium on VLSI Technology Pub Date : 2019-06-09 DOI: 10.23919/VLSIT.2019.8776579
Changbeom Woo, Myeongwon Lee, Shinkeun Kim, Jaeyeol Park, Gil-Bok Choi, M. Seo, K. Noh, Myounggon Kang, Hyungcheol Shin
{"title":"Modeling of Charge Loss Mechanisms during the Short Term Retention Operation in 3-D NAND Flash Memories","authors":"Changbeom Woo, Myeongwon Lee, Shinkeun Kim, Jaeyeol Park, Gil-Bok Choi, M. Seo, K. Noh, Myounggon Kang, Hyungcheol Shin","doi":"10.23919/VLSIT.2019.8776579","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776579","url":null,"abstract":"Right after program, stored electrons in the shallow nitride trap level can be released less than a few seconds. By setting the delay between program and reading phase to as small as 10μs, we found that several mechanisms are mixed when stored electrons are emitted during short term retention of 3-D NAND Flash. For the first time, we have confirmed that the charge loss mechanisms consist of three mechanisms and have separated each mechanism. In particular, the vertical redistribution of electrons in the charge trap layer, observed only during short term, was analyzed for the first time. Short term retention data measured at various temperatures (25-115°C) and at several program verify levels (PV3, PV5, PV7) in solid (S/P) and checker-board patterns (C/P) were analyzed using our model. Finally, the activation energy (Ea) of each mechanism was extracted by the Arrhenius law and the magnitudes of $E_{text{a}}$ were compared.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"3 1","pages":"T214-T215"},"PeriodicalIF":0.0,"publicationDate":"2019-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82500303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
Energy-Efficient Edge Inference on Multi-Channel Streaming Data in 28nm HKMG FeFET Technology 28nm HKMG ffet技术中多通道流数据的高能效边缘推断
2019 Symposium on VLSI Technology Pub Date : 2019-06-09 DOI: 10.23919/VLSIT.2019.8776525
S. Dutta, W. Chakraborty, J. Gomez, K. Ni, S. Joshi, S. Datta
{"title":"Energy-Efficient Edge Inference on Multi-Channel Streaming Data in 28nm HKMG FeFET Technology","authors":"S. Dutta, W. Chakraborty, J. Gomez, K. Ni, S. Joshi, S. Datta","doi":"10.23919/VLSIT.2019.8776525","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776525","url":null,"abstract":"We present a system implementing extremely energy-efficient inference on multi-channel biomedical-sensor data. We leverage Ferroelectric FET (FeFET) to perform classification directly on analog sensor signals. We demonstrate: (i) voltage-controlled multi-domain ferroelectric polarization switching to obtain 8 distinct transconductance $(text{g}_{text{m}})$ states in a 28nm HKMG FeFET technology [1], (ii) 30x tunable range in $text{g}_{text{m}}$ over the bandwidth of interest, (iii) successful implementation of artifact removal, feature extraction and classification for seizure detection from CHB-MIT EEG dataset with 98.46% accuracy and $< 0.375/text{hr}$. false alarm rate for two patients, (iv) ultra-low energy of 47 fJ/MAC with 1,000x improvement in area compared to alternative mixed-signal MAC.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"12 1","pages":"T38-T39"},"PeriodicalIF":0.0,"publicationDate":"2019-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88362483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Towards scalable quantum computing based on silicon spin 迈向基于硅自旋的可扩展量子计算
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776562
T. Meunier, L. Hutin, B. Bertrand, Y. Thonnart, G. Pillonnet, G. Billiot, H. Jacquinot, M. Cassé, S. Barraud, Y.-J. Kim, V. Mazzocchi, A. Amisse, H. Bohuslavskyi, L. Bourdet, A. Crippa, X. Jehl, R. Maurand, Y. Niquet, M. Sanquer, B. Venitucci, B. Jadot, E. Chanrion, P. Mortemousque, C. Spence, M. Urdampilleta, S. de Franceschi, M. Vinet
{"title":"Towards scalable quantum computing based on silicon spin","authors":"T. Meunier, L. Hutin, B. Bertrand, Y. Thonnart, G. Pillonnet, G. Billiot, H. Jacquinot, M. Cassé, S. Barraud, Y.-J. Kim, V. Mazzocchi, A. Amisse, H. Bohuslavskyi, L. Bourdet, A. Crippa, X. Jehl, R. Maurand, Y. Niquet, M. Sanquer, B. Venitucci, B. Jadot, E. Chanrion, P. Mortemousque, C. Spence, M. Urdampilleta, S. de Franceschi, M. Vinet","doi":"10.23919/VLSIT.2019.8776562","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776562","url":null,"abstract":"Quantum computing (QC) is expected to extend the high performance computing roadmap [1]–[2] at the condition to be able to run a large number of errorless quantum operations, typically. over a billion. It is out of reach in actual physical systems because of the quantum decoherence. As a consequence, quantum error correction techniques, which utilize the idea of redundant encoding, have been introduced to cure for the errors [3]–[5]. In state-of-the-art codes, with error thresholds or fidelities around 10−2 in Si spin qubits, it is expected that logical qubits will be made out of a few thousands or more of physical qubits [6], bringing the number of required physical qubits to perform relevant quantum calculations to at least a million.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"89 1","pages":"T30-T31"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78703202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Short Course 短期课程
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776574
{"title":"Short Course","authors":"","doi":"10.23919/VLSIT.2019.8776574","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776574","url":null,"abstract":"Short Course","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"3 1","pages":"xiv-xvi"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77656162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ultra-thin <10nm) Dual-oxide (Al2O3/TiO2) Hybrid Device (Memory/Selector) with Extremely Low Ioff <1nA) and Ireset <1nA) for 3D Storage Class Memory 超薄<10nm)双氧化物(Al2O3/TiO2)混合器件(存储器/选择器)具有极低的Ioff <1nA)和Ireset <1nA)，用于3D存储级存储器
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776527
Changhyuck Sung, Jeonghwan Song, Donguk Lee, Seokjae Lim, Myounghun Kwak, H. Hwang
{"title":"Ultra-thin <10nm) Dual-oxide (Al2O3/TiO2) Hybrid Device (Memory/Selector) with Extremely Low Ioff <1nA) and Ireset <1nA) for 3D Storage Class Memory","authors":"Changhyuck Sung, Jeonghwan Song, Donguk Lee, Seokjae Lim, Myounghun Kwak, H. Hwang","doi":"10.23919/VLSIT.2019.8776527","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776527","url":null,"abstract":"We demonstrate ultra-thin ALD-processed dual-oxide (Al<inf>2</inf>O<inf>3</inf>/TiO<inf>2</inf>) hybrid device with memory and selector characteristics by engineering the stability of metal filament in Al<inf>2</inf>O<inf>3</inf> and TiO<inf>2</inf> layer. The optimized hybrid memory device shows outstanding performances such as low off current <tex>$(< 1text{nA})$</tex>, low reset current <tex>$(< 1text{nA})$</tex>, and high on/off ratio <tex>$(> 10^{4})$</tex>. Inserting a Ti buffer layer which has a low electrode potential value, we observed excellent uniformity and retention property. Finally, an outstanding read/write margins and ultra-low power consumption are confirmed through array simulations of the proposed hybrid memory device.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"108 1","pages":"T62-T63"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81412667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Considerations of Integrating Computing-In-Memory and Processing-In-Sensor into Convolutional Neural Network Accelerators for Low-Power Edge Devices 低功耗边缘器件卷积神经网络加速器中内存计算和传感器处理集成的思考
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776560
K. Tang, Wei-Chen Wei, Zuo-Wei Yeh, Tzu-Hsiang Hsu, Yen-Cheng Chiu, Cheng-Xin Xue, Yu-Chun Kuo, Tai-Hsing We, M. Ho, C. Lo, Ren-Shuo Liu, C. Hsieh, Meng-Fan Chang
{"title":"Considerations of Integrating Computing-In-Memory and Processing-In-Sensor into Convolutional Neural Network Accelerators for Low-Power Edge Devices","authors":"K. Tang, Wei-Chen Wei, Zuo-Wei Yeh, Tzu-Hsiang Hsu, Yen-Cheng Chiu, Cheng-Xin Xue, Yu-Chun Kuo, Tai-Hsing We, M. Ho, C. Lo, Ren-Shuo Liu, C. Hsieh, Meng-Fan Chang","doi":"10.23919/VLSIT.2019.8776560","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776560","url":null,"abstract":"In quest to execute emerging deep learning algorithms at edge devices, developing low-power and low-latency deep learning accelerators (DLAs) have become top priority. To achieve this goal, data processing techniques in sensor and memory utilizing the array structure have drawn much attention. Processing-in-sensor (PIS) solutions could reduce data transfer; computing-in-memory (CIM) macros could reduce memory access and intermediate data movement. We propose a new architecture to integrate PIS and CIM to realize low-power DLA. The advantages of using these techniques and the challenges from system point-of-view are discussed.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"33 1","pages":"T166-T167"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76094639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Integrated Power Management and Microcontroller for Ultra-Wide Power Adaptation down to nW 集成电源管理和微控制器的超宽功率自适应低至西北
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776545
Longyang Lin, Saurabh Jain, M. Alioto
{"title":"Integrated Power Management and Microcontroller for Ultra-Wide Power Adaptation down to nW","authors":"Longyang Lin, Saurabh Jain, M. Alioto","doi":"10.23919/VLSIT.2019.8776545","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776545","url":null,"abstract":"This paper presents a power management unit (PMU) driving a microcontroller, and controlling a power knob that enables adaptation to the sensed power availability over an ultra-wide range, well beyond voltage scaling. Conventional battery-powered operation is augmented with pure harvesting. Wide power adaptation is enabled by comparator delay self-biasing and zero-current switching scheme shared among all power modes with single-cycle convergence.","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"12 1","pages":"C178-C179"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88299191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A 40nm 2Mb ReRAM Macro with 85% Reduction in FORMING Time and 99% Reduction in Page-Write Time Using Auto-FORMING and Auto-Write Schemes 40nm 2Mb ReRAM宏，使用自动成形和自动写入方案，成形时间减少85%，页面写入时间减少99%
2019 Symposium on VLSI Technology Pub Date : 2019-06-01 DOI: 10.23919/VLSIT.2019.8776540
Yen-Cheng Chiu, Han-Wen Hu, Li-Ya Lai, Tsung-Yuan Huang, Hui-Yao Kao, K. Chang, M. Ho, Chung-Cheng Chou, Y. Chih, T. Chang, Meng-Fan Chang
{"title":"A 40nm 2Mb ReRAM Macro with 85% Reduction in FORMING Time and 99% Reduction in Page-Write Time Using Auto-FORMING and Auto-Write Schemes","authors":"Yen-Cheng Chiu, Han-Wen Hu, Li-Ya Lai, Tsung-Yuan Huang, Hui-Yao Kao, K. Chang, M. Ho, Chung-Cheng Chou, Y. Chih, T. Chang, Meng-Fan Chang","doi":"10.23919/VLSIT.2019.8776540","DOIUrl":"https://doi.org/10.23919/VLSIT.2019.8776540","url":null,"abstract":"This work proposes (1) an auto-forming (AF) scheme to shorten the macro forming time $(text{T}_{text{FM}-text{M}})$ and testing costs; (2) an auto-RESET (ARST) scheme to shorten page-RESET time $(text{T}_{text{W}-text{PAGE}-text{RST}})$ for expanding the applications of hidden-RESET operation in standby mode, and (3) an auto-SET (ASET) scheme to shorten page-write time $(text{T}_{text{W}-text{PAGE}})$ combined with hidden-RESET scheme. A fabricated 40nm 2Mb ReRAM macro achieved 85+% reduction in TFM-M, and $99+%$ reduction in $text{T}_{text{W}}-text{PAGE}$ for a page. For the first time, AF, ARST, and ASET schemes are demonstrated in silicon for ReRAM. Keywords: ReRAM, forming, page-write","PeriodicalId":6752,"journal":{"name":"2019 Symposium on VLSI Technology","volume":"58 1","pages":"T232-T233"},"PeriodicalIF":0.0,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89165665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
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