微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/JOMM.19020204

Lei Qu, Rui Chen, Xiaoting Li, Jing Zhang, Yanrong Wang, Shuhua Wei, Jiang Yan, Yayi Wei

引用次数: 2

Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review 中国集成电路产业发展现状-封装与测试产业综述

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.19020409

Litho World

引用次数: 0

Metrology Challenges in 3D NAND Flash Technical Development and Manufacturing 3D NAND闪存技术开发和制造中的计量挑战

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.20030102

Wei Zhang, Jun Xu, Sicong Wang, Yi Zhou, J. Mi

引用次数: 8

Recognition and Visualization of Lithography Defects based on Transfer Learning 基于迁移学习的光刻缺陷识别与可视化

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.20030302

Bo Liu, Pengzheng Gao, Libin Zhang, Jiajin Zhang, Yuhong Zhao, Yayi Wei

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引用次数: 0

The Variables and Invariants in the Evolution of Logic Optical Lithography Process 逻辑光刻工艺演变中的变量与不变量

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.19020101

Qiang Wu

引用次数: 3

Hamamatsu’s Products for Optical Inspection, Metrology and Monitoring to Improve Yield and Accuracy for Semiconductor Processes 滨松的产品用于光学检测，计量和监测，以提高半导体工艺的良率和精度

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.19020102

Chenghao Xiang, Xusheng Zhou

引用次数: 0

The Effect of Fin Structure in 5 nm FinFET Technology 翅片结构对5nm FinFET技术的影响

微电子制造学报 Pub Date : 2019-01-01 DOI: 10.33079/jomm.19020405

Enming Shang, Yu Ding, Wenqiao Chen, ShaoJian Hu, Shoumian Chen