微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.19020409
Litho World
{"title":"Current Status of the Integrated Circuit Industry in China ― Packaging and Testing Industry Review","authors":"Litho World","doi":"10.33079/jomm.19020409","DOIUrl":"https://doi.org/10.33079/jomm.19020409","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.20030102
Wei Zhang, Jun Xu, Sicong Wang, Yi Zhou, J. Mi
{"title":"Metrology Challenges in 3D NAND Flash Technical Development and Manufacturing","authors":"Wei Zhang, Jun Xu, Sicong Wang, Yi Zhou, J. Mi","doi":"10.33079/jomm.20030102","DOIUrl":"https://doi.org/10.33079/jomm.20030102","url":null,"abstract":": 3D NAND technical development and manufacturing face many challenges to scale down their devices, and metrology stands out as much more difficult at each turn. Unlike planar NAND, 3D NAND has a three-dimensional vertical structure with high-aspect ratio. Obviously top-down images is not enough for process control, instead inner structure control becomes much more important than before, e.g. channel hole profiles. Besides, multi-layers, special materials and YMTC unique X-Tacking technology also bring other metrology challenges: high wafer bow, stress induced overlay, opaque film measurement. Technical development can adopt some destructive methodology (TEM, etch-back SEM), while manufacturing can only use non-destructive method. These drive some new metrology development, including X-Ray, mass measure and Mid-IR spectroscopy. As 3D NAND suppliers move to >150 layers devices, the existing metrology tools will be pushed to the limits. Still, the metrology must innovate.","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Recognition and Visualization of Lithography Defects based on Transfer Learning","authors":"Bo Liu, Pengzheng Gao, Libin Zhang, Jiajin Zhang, Yuhong Zhao, Yayi Wei","doi":"10.33079/jomm.20030302","DOIUrl":"https://doi.org/10.33079/jomm.20030302","url":null,"abstract":": Yield control in the integrated circuit manufacturing process is very important, and defects are one of the main factors affecting chip yield. As the process control becomes more and more critical and the critical dimension becomes smaller and smaller, the identification and location of defects is particularly important. This paper uses a machine learning algorithm based on transfer learning and two fine-tuned neural network models to realize the autonomous recognition and classification of defects even the data set is small, which achieves 94.6% and 91.7% classification accuracy. The influence of network complexity on classification result is studied at the same time. This paper also establishes a visual display algorithm of defects, shows the process of extracting the deep-level features of the defective image by the network, and then analyze the defect features. Finally, the Gradient-weighted Class Activation Mapping technology is used to generate defect heat maps, which locate the defect positions and probability intensity effects. This paper greatly expands the application of transfer learning in the field of integrated circuit lithography defect recognition, and greatly improves the friendliness of defect display.","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.19020101
Qiang Wu
{"title":"The Variables and Invariants in the Evolution of Logic Optical Lithography Process","authors":"Qiang Wu","doi":"10.33079/jomm.19020101","DOIUrl":"https://doi.org/10.33079/jomm.19020101","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.19020102
Chenghao Xiang, Xusheng Zhou
{"title":"Hamamatsu’s Products for Optical Inspection, Metrology and Monitoring to Improve Yield and Accuracy for Semiconductor Processes","authors":"Chenghao Xiang, Xusheng Zhou","doi":"10.33079/jomm.19020102","DOIUrl":"https://doi.org/10.33079/jomm.19020102","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.19020406
Yanli Li, Qiang Wu, Shoumian Chen
{"title":"A Simulation Study for Typical Design Rule Patterns in 5 nm Logic Process with EUV Photolithographic Process","authors":"Yanli Li, Qiang Wu, Shoumian Chen","doi":"10.33079/jomm.19020406","DOIUrl":"https://doi.org/10.33079/jomm.19020406","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.20030104
Liang Zhu, Barry Ma, Lin Shen, Kevin A. Beaudette
{"title":"A Study of 2D Assist Feature Placement","authors":"Liang Zhu, Barry Ma, Lin Shen, Kevin A. Beaudette","doi":"10.33079/jomm.20030104","DOIUrl":"https://doi.org/10.33079/jomm.20030104","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
微电子制造学报Pub Date : 2019-01-01DOI: 10.33079/jomm.20030106
Litho World
{"title":"Current Status of the Integrated Circuit Industry in China ― Overview of Semiconductor Materials Industry","authors":"Litho World","doi":"10.33079/jomm.20030106","DOIUrl":"https://doi.org/10.33079/jomm.20030106","url":null,"abstract":"","PeriodicalId":66020,"journal":{"name":"微电子制造学报","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"69492560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}