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2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)最新文献

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A single-chip oscillator based on a deep-submicron gap CMOS-MEMS resonator array with a high-stiffness driving scheme 基于深亚微米间隙CMOS-MEMS谐振器阵列的高刚度驱动单片振荡器
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7180879
Huan-Chun Su, Ming-Huang Li, Chao-Yu Chen, Sheng-Shian Li
{"title":"A single-chip oscillator based on a deep-submicron gap CMOS-MEMS resonator array with a high-stiffness driving scheme","authors":"Huan-Chun Su, Ming-Huang Li, Chao-Yu Chen, Sheng-Shian Li","doi":"10.1109/TRANSDUCERS.2015.7180879","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7180879","url":null,"abstract":"This work reports the design of a monolithic oscillator based on a low motional impedance (Rm) CMOS-MEMS resonator array with a high-stiffness driving scheme in a standard 0.35 μm CMOS. Combined with the previously developed polysilicon release process and the proposed “contact-array-assisted” transducer design, a tiny equivalent transducer's gap (deff) of only 190 nm is successfully attained. Based on this feature, a low Rm of 10 kΩ is achieved under a medium bias voltage (VP) of 36 V for a 4.22-MHz resonator, which demonstrates the lowest Rm among its CMOS-MEMS counterparts to date. The combination of the mechanically coupled array and high-stiffness driving scheme significantly enhances oscillator performance in terms of far-from-carrier phase noise. The 4.22-MHz single-chip CMOS-MEMS oscillator exhibits the phase noise of -90 dBc/Hz at 1-kHz offset and -121 dBc/Hz at 1-MHz offset, respectively.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"30 1","pages":"133-136"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86235679","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Development of a sapphire optical wall shear stress sensor for high-temperature applications 用于高温应用的蓝宝石光学壁剪应力传感器的研制
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181168
D. Mills, D. Blood, M. Sheplak
{"title":"Development of a sapphire optical wall shear stress sensor for high-temperature applications","authors":"D. Mills, D. Blood, M. Sheplak","doi":"10.1109/TRANSDUCERS.2015.7181168","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181168","url":null,"abstract":"This paper presents the development of the first sapphire micromachined wall shear stress sensor for high-temperature applications utilizing geometric moiré optical transduction. A folded tether floating element structure is employed to extend the linear operating range of the sensor. Picosecond pulsed laser micro-machining processes are developed for patterning of mechanical structures in sapphire, and a four-channel alumina fiber array with sapphire optical fibers is used to interrogate the moiré fringe. Platinum thin-film gratings and a stainless steel package enable a theoretical maximum operating temperature in excess of 800°C, and initial dynamic calibration in differential mode demonstrates a shear stress sensitivity of 76.8 μV/Pa at 1.128 kHz.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"139 1","pages":"1295-1298"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86548434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Flexible composite thermal energy harvester using piezoelectric PVDF polymer and shape memory alloy 采用压电PVDF聚合物和形状记忆合金的柔性复合热能采集器
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181025
B. Gusarov, L. Gimeno, E. Gusarova, B. Viala, Sébastien Boisseau, O. Cugat
{"title":"Flexible composite thermal energy harvester using piezoelectric PVDF polymer and shape memory alloy","authors":"B. Gusarov, L. Gimeno, E. Gusarova, B. Viala, Sébastien Boisseau, O. Cugat","doi":"10.1109/TRANSDUCERS.2015.7181025","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181025","url":null,"abstract":"A novel flexible composite thermal energy harvester is presented, which couples pyroelectric and piezoelectric effects of polyvinylidene fluoride (PVDF) with shape memory effect of a TiNiCu alloy. The harvester combines superior flexibility of PVDF with large temperature-induced strain of the shape memory alloy (SMA) to harvest small and quasi-static temperature variations. The composite with a volume of 27.5 mm3 (post-stamp size) can harvest an energy density of 0.41 mJ/cm3 per event, i.e. a temperature variation of 20°C. The harvester can directly power a light-emitting diode (LED) without any storage unit. The use of PVDF quadruples the energy, compared to previously reported harvesters based on PZT-fiber composites.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"80 1","pages":"722-725"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83856898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A parametric array PMUT loudspeaker with high efficiency and wide flat bandwidth 一种高效率、宽平坦带宽的参数化阵列PMUT扬声器
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181371
K. Been, Y. Je, H. S. Lee, W. Moon
{"title":"A parametric array PMUT loudspeaker with high efficiency and wide flat bandwidth","authors":"K. Been, Y. Je, H. S. Lee, W. Moon","doi":"10.1109/TRANSDUCERS.2015.7181371","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181371","url":null,"abstract":"A previous study demonstrated that a piezoelectric micromachined ultrasonic transducer (PMUT) could be used to construct a PA loudspeaker, and developed a prototype. In this paper, we describe the performance of a PA loudspeaker fabricated using a more developed package. Our PA loudspeaker consists of an array of PMUTs with two resonance frequencies and uses an `out-of-phase' driving technique, resulting in high power efficiency (up to 71%) and a wide flat radiation bandwidth. We also describe the characteristics of the PA sound, which depend on the method used to modulate the audible signal.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"33 1","pages":"2097-2100"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84004129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Recoverable/stretchable polymer spring with embedded CNTs electrical routing for large-area electronic applications 可回收/可拉伸聚合物弹簧，嵌入式碳纳米管电气布线，用于大面积电子应用
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181181
W. Sung, Chao-Lin Cheng, C. Hong, W. Fang
{"title":"Recoverable/stretchable polymer spring with embedded CNTs electrical routing for large-area electronic applications","authors":"W. Sung, Chao-Lin Cheng, C. Hong, W. Fang","doi":"10.1109/TRANSDUCERS.2015.7181181","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181181","url":null,"abstract":"This study presents a large-area chip-network using polymer stretchable spring with embedded carbon nanotubes (CNTs). The CNTs as piezo-resistive sensing element and metal routing was located on the node and spring to achieve functional device. The mechanical and electrical connections of surrounding devices were linked by CNTs-polymer stretchable spring. The polymer spring stretches and expands the device nodes by several times of magnitude area to establish a 2D chip-network system. Merits of this approach: (1) polymer stretchable spring with large fracture strain acts as mechanical connection; (2) the polymer spring has better recoverability after stretching; (3) vertically-aligned CNTs are exploited as electrical routing and promising sensing material for different stress state; (4) the chip-network with flexibility can apply to curved surfaces.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"2003 1","pages":"1346-1349"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82898951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
How microtechnologies enable organs-on-a-chip 微技术如何实现器官芯片
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7180902
E. Verpoorte, P. Oomen, M. Skolimowski, P. Mulder, P. V. van Midwoud, V. Starokozhko, M. Merema, G. Molema, G. Groothuis
{"title":"How microtechnologies enable organs-on-a-chip","authors":"E. Verpoorte, P. Oomen, M. Skolimowski, P. Mulder, P. V. van Midwoud, V. Starokozhko, M. Merema, G. Molema, G. Groothuis","doi":"10.1109/TRANSDUCERS.2015.7180902","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7180902","url":null,"abstract":"Engineering cellular microenvironments that more accurately reflect the in vivo situation is now recognized as being crucial for the improvement of the in vitro viability and in vivo-like function of cells or tissues. Microfluidic technologies have been increasingly applied since the late 1990's for this purpose, with a growing number of examples of perfused cell and tissue cultures in microfluidic chambers and channels. More recently, additional microfabricated features have been implemented in microfluidic structures to achieve 3-D cell culture systems which mimic not only in vivo fluid flows, but also the structure, transport, and mechanical properties of tissue in, for example, the lung or the intestine. The ultimate challenge becomes the combination of different organ functions into single, linked-compartment devices - the body-on-the-chip.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"63 1","pages":"224-227"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88983571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Precision protein assays on compartmentalized biosensor arrays 区隔化生物传感器阵列的精确蛋白质测定
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181255
D. Bechstein, Jr Lee, E. Ng, S. X. Wang
{"title":"Precision protein assays on compartmentalized biosensor arrays","authors":"D. Bechstein, Jr Lee, E. Ng, S. X. Wang","doi":"10.1109/TRANSDUCERS.2015.7181255","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181255","url":null,"abstract":"A biological measurement microsystem enables precision protein assays by compartmentalization of biosensors in a sensor array. Using a PDMS microfluidic interface on an 8 by 8 Giant Magnetoresistive sensor array, this compartmentalization technique performs all required measurements, including biological references, on a single sensor chip alongside the actual sample(s) to be measured. All data is acquired simultaneously on a single chip, circumventing a range of possible errors currently present in sequential biosensor measurement approaches. With our approach, we achieve a low concentration estimation error of 11%. Additionally this compartmentalization technique enables high throughput measurements using multiple samples on a single chip with a large-scale array of solid-state sensors.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"62 1","pages":"1637-1640"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90243251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Selective assembly of DNA nanostructure bridging onto a trenched silicon substrate DNA纳米结构桥接在沟槽硅衬底上的选择性组装
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181192
Y. Mori, Z. Ma, S. Park, Y. Hirai, T. Tsuchiya, O. Tabata
{"title":"Selective assembly of DNA nanostructure bridging onto a trenched silicon substrate","authors":"Y. Mori, Z. Ma, S. Park, Y. Hirai, T. Tsuchiya, O. Tabata","doi":"10.1109/TRANSDUCERS.2015.7181192","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181192","url":null,"abstract":"We demonstrated for the first time the versatility of the previously proposed concept of DNA nanostructure integration on MEMS [1] by selectively assembling DNA nanostructures to form a bridge over a trenched silicon. A DNA origami (30 × 150 nm) was fixed to bridge a trenches (100 nm width, 200 nm depth) utilizing the hybridization between ssDNA on the DNA origami and selectively immobilized complementary ssDNA-pattern at the edges of the etched trench. An octadecylsilane self-assembled monolayer (ODS SAM) was utilized as a masking layer for a scanning probe lithography (SPL) with better process stability than a trimethylsilyl (TMS) SAM. This result opens a way to integrate the nanomaterial components on a structured device such as MEMS by using DNA origami.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"37 1","pages":"1389-1392"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90374598","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Ring-shape SMA micro actuator with parylene retention spring for low power consumption, large displacement linear actuation 环形SMA微动器，采用聚对二甲苯保持弹簧，低功耗，大位移线性驱动
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7181384
T. D. O. Moura, T. Tsukamoto, D. W. de Lima Monteiro, S. Tanaka
{"title":"Ring-shape SMA micro actuator with parylene retention spring for low power consumption, large displacement linear actuation","authors":"T. D. O. Moura, T. Tsukamoto, D. W. de Lima Monteiro, S. Tanaka","doi":"10.1109/TRANSDUCERS.2015.7181384","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7181384","url":null,"abstract":"This paper reports a novel ring-shape micro actuator for a latching mechanism used in a low power consumption and large displacement micro linear actuation. The proposed actuator consists of a shape memory alloy (SMA) ring, parylene spring and shoes. The parylene spring was carefully designed for independent control of radial and axial stiffness, which can be realized by a high aspect ratio cross section and a meander structure. The maximum force generated by the parylene spring was about 40 mN. Two types of SMA actuator was examined for the actuation: simple wire and micro spring types. The maximum displacement as high as 300 μm was obtained by using the SMA micro spring.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"75 S109","pages":"2148-2151"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91419865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A new three axis low power MEMS gyroscope for consumer and industrial applications 用于消费和工业应用的新型三轴低功耗MEMS陀螺仪
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI: 10.1109/TRANSDUCERS.2015.7180853
A. Oliver, Y. L. Teo, A. Geisberger, R. Steimle, T. Cassagnes, K. Adhikari, D. Sadler, A. McNeil
{"title":"A new three axis low power MEMS gyroscope for consumer and industrial applications","authors":"A. Oliver, Y. L. Teo, A. Geisberger, R. Steimle, T. Cassagnes, K. Adhikari, D. Sadler, A. McNeil","doi":"10.1109/TRANSDUCERS.2015.7180853","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2015.7180853","url":null,"abstract":"The manuscript reports a new commercially available three axis gyroscope, the Freescale® FXAS21002C. The 6.8 mW power consumption is 20% less than the nearest competitor's three axis device while meeting standard consumer device parameters. The three axis gyroscope has two proof masses and an open loop control scheme. The open loop architecture and the discontinuous control scheme contribute to this differentiated power consumption.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":"2 1","pages":"31-34"},"PeriodicalIF":0.0,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83686150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
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