A single-chip oscillator based on a deep-submicron gap CMOS-MEMS resonator array with a high-stiffness driving scheme

Huan-Chun Su, Ming-Huang Li, Chao-Yu Chen, Sheng-Shian Li
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引用次数: 8

Abstract

This work reports the design of a monolithic oscillator based on a low motional impedance (Rm) CMOS-MEMS resonator array with a high-stiffness driving scheme in a standard 0.35 μm CMOS. Combined with the previously developed polysilicon release process and the proposed “contact-array-assisted” transducer design, a tiny equivalent transducer's gap (deff) of only 190 nm is successfully attained. Based on this feature, a low Rm of 10 kΩ is achieved under a medium bias voltage (VP) of 36 V for a 4.22-MHz resonator, which demonstrates the lowest Rm among its CMOS-MEMS counterparts to date. The combination of the mechanically coupled array and high-stiffness driving scheme significantly enhances oscillator performance in terms of far-from-carrier phase noise. The 4.22-MHz single-chip CMOS-MEMS oscillator exhibits the phase noise of -90 dBc/Hz at 1-kHz offset and -121 dBc/Hz at 1-MHz offset, respectively.
基于深亚微米间隙CMOS-MEMS谐振器阵列的高刚度驱动单片振荡器
本文报道了一种基于低运动阻抗(Rm) CMOS- mems谐振器阵列的单片振荡器的设计,该谐振器阵列具有标准0.35 μm CMOS的高刚度驱动方案。结合先前开发的多晶硅释放工艺和提出的“接触阵列辅助”换能器设计,成功地获得了仅190 nm的微小等效换能器间隙(deff)。基于这一特性,4.22 mhz谐振器在36 V的中偏置电压(VP)下实现了10 kΩ的低Rm,这是迄今为止CMOS-MEMS谐振器中最低的Rm。机械耦合阵列和高刚度驱动方案的结合显著提高了振荡器的远载波相位噪声性能。4.22 mhz单片CMOS-MEMS振荡器在1 khz偏置和1 mhz偏置时的相位噪声分别为-90 dBc/Hz和-121 dBc/Hz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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