2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference最新文献_第7页

The introduction of high heat dissipation material 采用高散热材料

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382129

G. Lee, J. Lin

引用次数: 3

Advanced integrated passive device (IPD) low pass filter designs on WLCSP 基于WLCSP的先进集成无源器件(IPD)低通滤波器设计

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382162

Po-Hao Chang, K. Chiang, J. Lai, Yu-Po Wang

引用次数: 1

Optimization of copper pillar bump design for fine pitch flip-chip packages 小间距倒装封装铜柱凸点设计优化

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382161

Meng Tsung Lee, Jung-Pang Huang, G. Lin, Y. Lin, Y. Jiang, S. Chiu, C. Huang

引用次数: 4

Development of Thermal spreading technology nowadays 热扩散技术的发展现状

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382184

Shung-Wen Kang, Meng-chang Tsai, M. Weng, Chao-Hsiang Hsu

引用次数: 2

Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser CO2激光回流Au/Ni(P)/Cu衬底的sac405与SACNG无铅焊料的界面反应及机理

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382136

Shao-cheng Lo, Yu-Ping Hsieh, Y. Yen

{"title":"Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser","authors":"Shao-cheng Lo, Yu-Ping Hsieh, Y. Yen","doi":"10.1109/IMPACT.2009.5382136","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382136","url":null,"abstract":"This study investigate the interfacial reactions and mechanical property between Sn-4.0Ag-0.5Cu (SAC, in wt%) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG, in wt%) lead free solders with Au/Ni(P)/Cu substrate by CO<inf>2</inf> laser reflow. These results compare with the same systems under a conventional hot-air reflowing method in the oven. After reflowing, all samples were then taken heat-treatment at 150°C for 1000 hours. Under CO<inf>2</inf> laser reflowing, mixtures of the (Cu,Ni)<inf>6</inf>Sn<inf>5</inf> and (Ni,Cu)<inf>3</inf>Sn<inf>4</inf> phases and (Ni,P,Cu) solid solution were formed at the interface. After taking a long period of heat-treatment, the (Cu,Ni)<inf>6</inf>Sn<inf>5</inf>+(Ni,Cu)<inf>3</inf>Sn<inf>4</inf> were still observed at the interface. But, the Ni(P)+Cu solid solution disappeared as increasing reaction times. The experimental results compared with the same couples by conventional hot-air reflowing at 240°C, three layer structures, (Cu,Ni)<inf>6</inf>Sn<inf>5</inf>, (Ni,Cu)<inf>3</inf>Sn<inf>4</inf> and Ni<inf>3</inf>P phases, were formed at the interface. The spalling intermetallic compounds could be observed in the SACNG/Au/Ni/Cu couple. The mechanical strength of solder joints by the laser reflowing technique is very similar to that by the hot-air reflowing method.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"54 1","pages":"224-226"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88301788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The stratified thermal modules for the LCD TV with LED backlight LED背光液晶电视的分层散热模块

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382140

S. Chiang

{"title":"The stratified thermal modules for the LCD TV with LED backlight","authors":"S. Chiang","doi":"10.1109/IMPACT.2009.5382140","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382140","url":null,"abstract":"There are 180 LED lamps located at the LED panel for 85W power consumption for the LED backlight. The LED lamps dissipate 68W for heat. The 32” LCD TV geometry is 800 mm(L) * 500 mm(W) * 90 mm(H). There are six light-bars on the LED panel and 30 LEDs per bar. The single LED package emits red, green and blue. For fitting the LCD TV package case, the overall thermal module size is 700 mm(L)* 400 mm(W). In order to thin the LCD TV, the fins height is designed from 20 mm to 70 mm per 10 mm. Moreover, the fins length is set as 10 mm to 25 mm by every 5 mm. The thermal modules combine several types of fin under the natural convection. The thermal module multiplies the several fins types in one. Moreover, the stratified module is separated to upper and lower regions. The stratified thermal module provides higher fins for the upper region and induced supplied air-flow by the second opening. The results represent the upper region temperature is reduced from 68°C to 58°C obviously. The cold air-flow entrains the second opening and decreases the thermal and flow boundary effect. As the results, the temperature distribution of the whole thermal module obtains more uniform pattern by stratified design. So, the stratified thermal module enhances the temperature uniformity and increases that the air-flow passes through the tunnel of the fins.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"725 1","pages":"207-210"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74771411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A novel led driving circuits development for decorative lighting system energy saving 一种用于装饰照明系统节能的新型led驱动电路的研制

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382292

Liang-Cheng Chang, Da-Sheng Lee, Ping-Hei Chen

{"title":"A novel led driving circuits development for decorative lighting system energy saving","authors":"Liang-Cheng Chang, Da-Sheng Lee, Ping-Hei Chen","doi":"10.1109/IMPACT.2009.5382292","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382292","url":null,"abstract":"The forward current draft with the temperature changes is a characteristic of LED. This research used this characteristic to achieve control optimization of LED by the forward current feedback. Temperature detection through forward current measurements was applied to LED PWM to carry out the best thermal management of LED arrays under temperature variations, which can offer steady illumination and keep constant chromaticity. LED spotlight products are mainly used for lighting show box display to replace the incandescent lamp which has been forbidden by EU from the year of 2009. Such kind of products now is available on the market. However, the illumination decay and chromaticity changes with operation temperature obstruct wide distribution of LED spotlight for decorative lighting systems. The developed technology by this research can be used to control the chromaticity and the illumination of the LED spotlight and a great niche is outward. This research tested various types of LED are provided by different manufacturers, and the database of the changes of LED chip grains against forward current is build. Constant temperature bath was employed to get the curve of forward current and temperature, which will be a basis of forward current feedback and temperature conversions. Self-developed driving circuits were used to control LED to make the relative illumination decays to be less than 5% and the coordinate excursion of Color rendering index on the CIE chromaticity diagram is lower than 0.1. The circuit control of LED spotlight with low difference of illumination and Color rendering index were therefore successfully realized in this study.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"47 1","pages":"734-737"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81707829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Mathematical model of heat and mass transfer in a wick structure of a loop heat pipe 环状热管芯结构传热传质的数学模型

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382190

F. Lin, C. Yeh, Shen-Chun Wu, Yau‐Ming Chen

{"title":"Mathematical model of heat and mass transfer in a wick structure of a loop heat pipe","authors":"F. Lin, C. Yeh, Shen-Chun Wu, Yau‐Ming Chen","doi":"10.1109/IMPACT.2009.5382190","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382190","url":null,"abstract":"A mathematical steady-state model of a loop heat pipe (LHP) system was developed in this study. The model was based on the energy conservation and the phase-change heat transfer in porous media. The evaporator temperature was predicted including using a monoporous wick structure and using a biporous wick structure, which has two characteristic pore sizes. Experiments were also executed in this study. The model indicated that the monoporous wick with narrow pore size distribution accumulated gradually the vapor blanket; it brought the higher thermal resistance at increasing heat load. The biporous wick with the lager pores providing the passages for vapor and thus improved the heat transfer capacity of a LHP's evaporator. The calculation results showed that, at 10°C of sink temperature, 25°C of ambient temperature, and 350W of heat load, the evaporator temperature of monoporous wick was 88°C and the thermal resistance of the vapor blanket was 0.13°C/W, 60% of the total thermal resistance of the system (0.22°C/W). At the same modeling condition, the evaporator temperature of biporous wick was 50°C and the thermal resistance of the vapor blanket was 0.003°C/W, about 3% of the total thermal resistance (0.1°C/W). It indicated the biporous wick effectively enhanced the heat transfer performance of a LHP. To summarize, the development of this model could be a useful tool for predicting the performance of a LHP using the monoporous and biporous wicks.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"1 1","pages":"356-359"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83132472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Design and fabrication of passive components using TF-IPD technology 利用TF-IPD技术设计和制造无源元件

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382289

Tsaitzu Lee, Yo-Shen Lin, Chiajiun Chen

引用次数: 4

The correlation investigation between cyclic bending and thermal cycle testing in CSP package on board 板载CSP封装循环弯曲与热循环试验的相关性研究

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI: 10.1109/IMPACT.2009.5382231

G. Chang, Chi-Ko Yu, T. Shao, C. Chen, J. Lee

引用次数: 1