板载CSP封装循环弯曲与热循环试验的相关性研究

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382231

G. Chang, Chi-Ko Yu, T. Shao, C. Chen, J. Lee

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引用次数: 1

摘要

本文讨论了四点循环弯曲试验在焊点可靠性评价中的新应用。鉴于热循环测试的周期时间较长，业界一直在寻找一种更具成本效益和时效性的方式来完成评估任务。4点循环弯曲试验被认为是本研究的一个很好的候选。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The correlation investigation between cyclic bending and thermal cycle testing in CSP package on board

In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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