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2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)
2010 3rd International Nanoelectronics Conference (INEC)
2009 IEEE Symposium on Computational Intelligence for Security and Defense Applications
2013 International Conference on Materials for Renewable Energy and Environment
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - 最新文献
Estimation design of MEMS-based inertial navigation systems with noise coupling input saturation: Robust approach
Pub Date : 2009-12-01 DOI: 10.1109/IMPACT.2009.5382288 Yung-Yue Chen, Shyang-Jye Chang, Yung-Hsiang ChenExperimental investigation and finite element analysis of bump wafer probing
Pub Date : 2009-12-01 DOI: 10.1109/IMPACT.2009.5382232 H. Chang, W. Pan, M. Shih, Y. LaiFundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn
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本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。
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