微纳电子与智能制造最新文献_第8页

Thermal Performance and Reliability of Thermal Interface Materials: A Review 热界面材料的热性能与可靠性研究进展

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644070

P. Rodgers, V. Eveloy, E. Rahim, D. Morgan

引用次数: 9

Challenges in using nano-textured surfaces to reduce pressure drop through microchannels 利用纳米纹理表面减少微通道压降的挑战

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644071

Tara Dalton, Marc Scott Hodes, Cormac Eason, P. Kolodner, Ryan Enright, T. Krupenkin

{"title":"Challenges in using nano-textured surfaces to reduce pressure drop through microchannels","authors":"Tara Dalton, Marc Scott Hodes, Cormac Eason, P. Kolodner, Ryan Enright, T. Krupenkin","doi":"10.1109/ESIME.2006.1644071","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644071","url":null,"abstract":"Advances in silicon processing and micro-machining now allow the consistent manufacture of micro- and nanoscale features necessary for the production of controlled roughness superhydrophobic surfaces. Superhydrophobic surfaces combine roughness features with low surface energy to create materials with substantially decreased wettability and, subsequently, reduced hydrodynamic drag. Thus, they represent a promising technology for reducing microchannel flow resistance; a major technical issue in microfluidic systems. In there, however, limits to the pressure a superhydrophobic surface can support before irreversible wetting transition occurs, leading to a loss of the drag-reducing effect. Of greater importance are preliminary observations that, even before a superhydrophobic surface wets irreversibly, the drag reduction over a superhydrophobic surface may be compromised by subtle changes in the three-phase contact line position. The positive impact of micro-geometries on heat transfer is well known. Coupling this phenomenon with superhydrophobic surfaces to reduce flow resistance, could represent a significant step forward in areas such as electronics cooling. However, theoretical models of superhydrophobic surfaces are complex due to the requirement for high resolution on multiple scales. This paper aims to present current results and discuss issues in implementing superhydrophobic surfaces, specifically nano-structured posts, in a microchannel","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"26 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77143354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation 基于分子动力学模拟的环氧树脂材料性能预测

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644033

H. Fan, C. Wong, M. Yuen

{"title":"Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation","authors":"H. Fan, C. Wong, M. Yuen","doi":"10.1109/ESIME.2006.1644033","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644033","url":null,"abstract":"Epoxy is widely used in electronic packaging and its performance is very important to the reliability of electronic packages. It is necessary to understand the mechanical properties of epoxy materials at a fundamental level as a guide in the experimental design of epoxy resin for high reliability. Molecular modeling is widespread in its usage and has been used to investigate the mechanical properties of polymer at the molecular level, including the investigation of the Tg. The present study is focused on the material properties of the cured epoxy resin. MD model of the epoxy was built using the amorphous module. MD simulations were carried out starting at 225degC under a pressure of 0.1Mpa using the ensembles of the constant number of particles, constant-pressure and constant temperature (NPT). Temperature was lowered to room temperature at a rate of 10 degC/200ps. Each subsequent simulation was started from the final configuration obtained at the preceding temperature. Non-bond interactions cut-off distance of 1.5 nm with a smooth switching function was used in all simulations. The simulation in each case study was performed with an interval of 1 femto second (fs) in each MD simulation step. Density of the epoxy at each temperature was calculated from the average specific volume. Tg was estimated based on the discontinuity in the slope of the density-temperature plot. The volumetric thermal expansion coefficient was obtained from the relation of the variation of the volume and temperature. The corresponding linear thermal expansion coefficient of the epoxy can be calculated. Young's modulus and Poisson's ratio of the epoxy can also be obtained from MD simulations. The predicted values of these mechanical properties are close to the experimental values","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"5 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80691772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Modelling effects of packaging on pull-in behaviour of doubly-anchored beams 包装对双锚梁拉入行为的模拟效应

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1643946

Maryna Lishchynska, C. O’Mahony, O. Slattery, O. Wittier

引用次数: 0

High Speed Pull Test Characterization of BGA solder joints BGA焊点的高速拉伸试验特性

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644005

A. T. Valota, A. Losavioa, L. Renarc, A. Vicenzo

{"title":"High Speed Pull Test Characterization of BGA solder joints","authors":"A. T. Valota, A. Losavioa, L. Renarc, A. Vicenzo","doi":"10.1109/ESIME.2006.1644005","DOIUrl":"https://doi.org/10.1109/ESIME.2006.1644005","url":null,"abstract":"The changeover to lead-free solder and components metallization in conjunction with the market transition to portable products is expected to have a strong impact on the reliability of lead-free electronics. For handheld electronic products, particular concern has raised over solder joint fracture induced by drop impact. Existing test methods used to evaluate solder ball attachment, shear and pull test, thus far have not been considered suitable for the evaluation of shock reliability, due to their inability to simulate the high strain rate deformation, which characterizes impact loading. Recently, pull test equipment enabling high speed testing has become commercially available, thus calling for further study to assess its applicability for the measurement of joint strength under dynamic load conditions. In this paper, board level drop test and component level pull test results are reported and compared for different BGA assembly alloys and reflow cycle. Pull testing is performed at different test speed on BGA lead-free solder joints after reflow and after thermal ageing in order to investigate the correlation between failure analysis results and lead-free joints micro structural evolution. High-speed pull testing of solder joints is shown to be a promising test methodology for the evaluation of solder joints brittle fracture resistance. Moreover, high speed pull test results are shown to qualitatively correlate with drop test performance if the failure mode is taken as criterion","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"124 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79636744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 21

Electro-thermal Simulation of a DC/DC Converter using a Relaxation Method 基于松弛法的DC/DC变换器电热仿真

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644018

M. Vellvehí, X. Jordà, P. Godignon, J. Millán

引用次数: 11

Reliability Optimization of Stacked System-in-Package Using FEA 基于有限元分析的堆叠系统级封装可靠性优化

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1644049

J. Valtanen, P. Heino

引用次数: 1

Impact Force Characteristics of Package-level Solder Joints Under Ball Impact Test 球形冲击试验下封装级焊点的冲击力特性

微纳电子与智能制造 Pub Date : 2006-04-24 DOI: 10.1109/ESIME.2006.1643951

Chang-Lin Yen, Y. Lai