Thermal Performance and Reliability of Thermal Interface Materials: A Review

Abstract

This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives