包装对双锚梁拉入行为的模拟效应

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1643946

Maryna Lishchynska, C. O’Mahony, O. Slattery, O. Wittier

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引用次数: 0

摘要

了解封装工艺对MEMS器件性能的影响对于器件和封装的成功设计和分析至关重要。本文关注的是精确预测包装过程对双锚定微梁的拉入行为的影响。给出了粘接(模贴)对不同长度、宽度、锚固类型、胶粘剂和胶粘剂厚度的梁的拉入行为影响的参数化研究结果。在有实验数据的地方，测量结果和模拟结果之间的相关性很好

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Modelling effects of packaging on pull-in behaviour of doubly-anchored beams

Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved

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来源期刊

微纳电子与智能制造

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发文量

145