IEEE Transactions on Electromagnetic Compatibility最新文献

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A Novel Decoupling Method to Reduce Radio Frequency Interference (RFI) Noise From High-Speed Connector 一种降低高速连接器射频干扰(RFI)噪声的新型解耦方法
IF 2.5 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-07-01 DOI: 10.1109/TEMC.2025.3580282
Chih-Yu Fang;Li-Ching Huang;Bin-Chyi Tseng;Tzong-Lin Wu
{"title":"A Novel Decoupling Method to Reduce Radio Frequency Interference (RFI) Noise From High-Speed Connector","authors":"Chih-Yu Fang;Li-Ching Huang;Bin-Chyi Tseng;Tzong-Lin Wu","doi":"10.1109/TEMC.2025.3580282","DOIUrl":"10.1109/TEMC.2025.3580282","url":null,"abstract":"This article proposes an innovative method to effectively suppress radio frequency interference (RFI) noise from a high-speed differential channel passing through connectors. The proposed method uses a decoupling network (DN) to eliminate common-mode (CM) radiation generated from a high-speed connector to a nearby antenna. The DN comprises a six-port coupler on the connector side, a four-port coupler on the antenna side, and a phase delay line. This article presents the design concept, detailed signal flow graph analysis, and a step-by-step design procedure for implementing the DN. To demonstrate the effectiveness of the approach, a DN was designed and implemented for a universal serial bus (USB) 3.0 connector and a planar inverted-F antenna operating at 2.475 GHz. Both simulation and measurement results are presented, showing good agreement. The implemented DN achieved about 25-dB reduction in CM noise coupling at the target frequency and at least 10-dB reduction over a wide frequency range from 2.43 to 2.55 GHz. This validates the outstanding performance of the proposed method in mitigating RFI issues in compact electronic devices with high-speed interfaces. Furthermore, the proposed DN does not affect the normal operation of both the antenna and the high-speed differential signals.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1129-1138"},"PeriodicalIF":2.5,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144533274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Broadband Transmission Rasorber With Dual-Broadband Absorption by High-Accuracy Equivalent Admittance Analysis Method With Convergent Solution Conditions 采用收敛解条件下高精度等效导纳分析方法的双宽带吸收宽带传输反射器
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-07-01 DOI: 10.1109/temc.2025.3580406
Zijian Xing, Jilong Cui, Pengyue Yang, Qian Wang, Guangwei Yang, Jianying Li, Ling Wang
{"title":"Broadband Transmission Rasorber With Dual-Broadband Absorption by High-Accuracy Equivalent Admittance Analysis Method With Convergent Solution Conditions","authors":"Zijian Xing, Jilong Cui, Pengyue Yang, Qian Wang, Guangwei Yang, Jianying Li, Ling Wang","doi":"10.1109/temc.2025.3580406","DOIUrl":"https://doi.org/10.1109/temc.2025.3580406","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"47 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144533275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Model-Order Reduction of the Full-Wave Partial-Element Equivalent-Circuit (PEEC) Method Based on a Modal Approach 基于模态方法的全波部分单元等效电路(PEEC)模型阶降阶方法
IF 2.5 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-23 DOI: 10.1109/TEMC.2025.3577351
Philipp Herwigk;Marco Leone
{"title":"Model-Order Reduction of the Full-Wave Partial-Element Equivalent-Circuit (PEEC) Method Based on a Modal Approach","authors":"Philipp Herwigk;Marco Leone","doi":"10.1109/TEMC.2025.3577351","DOIUrl":"10.1109/TEMC.2025.3577351","url":null,"abstract":"An alternative and very efficient model-order reduction for the full-wave partial-element equivalent-circuit (PEEC) method is presented. It is based on a frequency-independent eigenvalue problem, which has to be solved once, in order to obtain a set of eigenvalues and eigenvectors, which can be used as global basis and test functions. Utilizing these eigenvalues and eigenvectors, allows to straightforwardly derive a canonical Foster-type modal equivalent circuit. This resulting network representation is stable and describes the full-wave system behavior accurately, while reducing the overall number of unknowns drastically, as compared to the original retarded PEEC equivalent circuit.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1271-1281"},"PeriodicalIF":2.5,"publicationDate":"2025-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11047259","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144370691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Impact of Discharge-Point Geometry on Air-Discharge ESD Testing: Current-Waveform Shape and Intensity 放电点几何形状对空气放电ESD测试的影响:电流波形形状和强度
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-19 DOI: 10.1109/temc.2025.3576324
Hans Kunz
{"title":"The Impact of Discharge-Point Geometry on Air-Discharge ESD Testing: Current-Waveform Shape and Intensity","authors":"Hans Kunz","doi":"10.1109/temc.2025.3576324","DOIUrl":"https://doi.org/10.1109/temc.2025.3576324","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"26 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144328537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Systematic Analysis of an Innovative DDR5 Connector Design 一种新型DDR5连接器设计的系统分析
IF 2.1 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-19 DOI: 10.1109/temc.2025.3577371
Yuchen Lee, Shuhao Liang
{"title":"Systematic Analysis of an Innovative DDR5 Connector Design","authors":"Yuchen Lee, Shuhao Liang","doi":"10.1109/temc.2025.3577371","DOIUrl":"https://doi.org/10.1109/temc.2025.3577371","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"3 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144328543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis and Integration of Chaotic Gaussian PWM and Passive Filter for Conducted EMI Suppression 混沌高斯脉宽调制与无源滤波器在传导电磁干扰抑制中的分析与集成
IF 2.5 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-18 DOI: 10.1109/TEMC.2025.3571194
Chentao Li;Jingsong Wang;Ping Xu;Qishuang Ma
{"title":"Analysis and Integration of Chaotic Gaussian PWM and Passive Filter for Conducted EMI Suppression","authors":"Chentao Li;Jingsong Wang;Ping Xu;Qishuang Ma","doi":"10.1109/TEMC.2025.3571194","DOIUrl":"10.1109/TEMC.2025.3571194","url":null,"abstract":"As wide bandgap semiconductor devices continue to be adopted, power converters can now operate at higher switching frequencies and power densities. However, this progress presents new challenges in controlling electromagnetic interference (EMI). Traditional passive EMI filters (PEFs) effectively suppress EMI, but are constrained by their size and weight, limiting power density improvements in converters. To address these issues, this article introduces an innovative strategy combining chaotic pulsewidth modulation (PWM) with Gaussian waveforms to produce chaotic Gaussian PWM (CGPWM). While CGPWM demonstrates excellent performance in reducing high-frequency EMI, stringent electromagnetic compatibility standards still necessitate the use of robust passive filters. Accordingly, this article designs a PEF based on CGPWM, aimed at enhancing EMI suppression while significantly reducing the size and inductance of common-mode (CM) inductors. By examining the spectrum reduction effects of square, Gaussian, and chaotic Gaussian waveforms, an optimized PEF is developed based on CGPWM. Experimental results reveal that this integrated approach reduces CM inductor volume by over 74.28% and inductance by 60%, achieving up to 50 dB of EMI attenuation. These outcomes highlight the potential of combining CGPWM and PEF for effective EMI suppression and minimized filter size, making it a promising solution for high-density power electronics.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1171-1181"},"PeriodicalIF":2.5,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144319769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters 高密度双向变换器电源环与栅极驱动近场耦合建模与优化
IF 2.5 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-18 DOI: 10.1109/TEMC.2025.3571381
Yuxuan Wu;Kushan Choksi;Samuel Defaz;Abdul Basit Mirza;Fang Luo
{"title":"Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters","authors":"Yuxuan Wu;Kushan Choksi;Samuel Defaz;Abdul Basit Mirza;Fang Luo","doi":"10.1109/TEMC.2025.3571381","DOIUrl":"10.1109/TEMC.2025.3571381","url":null,"abstract":"With the advent of wide-bandgap devices, power converters are achieving higher performance switching capabilities. As a result, manufacturers are increasingly focused on reducing the complexity of power converters and enhancing the production and assembly process by transitioning from modular to highly integrated designs, which are high-density bidirectional converters (HDBCs). As a result, near-field (NF) coupling is becoming a concern for stable operation in HDBCs. Optimization for the power loop and gate drive (GD) can be achieved through computational electromagnetics tools and circuit simulators, allowing for a detailed visualization of NF distributions. In addition, the GD impedance can be fine-tuned by optimizing the gate-source trace layout, while near-electric field coupling must be considered when implementing a shielding layer between the GD and high <inline-formula><tex-math>$text{d}mathbf {v}/text{d}mathbf {t}$</tex-math></inline-formula> nodes. This work presents a workflow for GD and power loop NF coupling modeling and optimization in HDBCs, aimed at mitigating issues such as mistriggering of switching devices and electromagnetic interference concerns in low-voltage systems.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1334-1351"},"PeriodicalIF":2.5,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144319770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Institutional Listings 机构清单
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3577542
{"title":"Institutional Listings","authors":"","doi":"10.1109/TEMC.2025.3577542","DOIUrl":"https://doi.org/10.1109/TEMC.2025.3577542","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"C4-C4"},"PeriodicalIF":2.0,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11036534","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144281258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine Learning to Predict EMI Radiation and Optimize the Structure of Pinmap Packages 机器学习预测电磁干扰辐射和优化pmap封装结构
IF 2.5 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3574362
Yan Li;Wan Ji;Xiaotian Yang;Guoliang Yu;Yang Qiu;Da Li;Haomiao Zhou;En-xiao Liu;Er-ping Li
{"title":"Machine Learning to Predict EMI Radiation and Optimize the Structure of Pinmap Packages","authors":"Yan Li;Wan Ji;Xiaotian Yang;Guoliang Yu;Yang Qiu;Da Li;Haomiao Zhou;En-xiao Liu;Er-ping Li","doi":"10.1109/TEMC.2025.3574362","DOIUrl":"10.1109/TEMC.2025.3574362","url":null,"abstract":"With the rapid increase in integrated circuit chip frequencies, the complexity of electromagnetic interference issues and the time-consuming nature of traditional pin mapping (pinmap) design methods have become increasingly evident. This article leverages advanced machine learning techniques to accurately and efficiently predict the maximum 3-m radiated electric field of pinmap packages. Among the various models tested, the convolutional neural network (CNN) demonstrated the best performance. When combined with the Adam optimizer, the CNN achieved an average relative error of less than 1.5% across the 6 to 20 GHz frequency range. The trained CNN model’s prediction speed is several orders of magnitude faster than full-wave simulation methods. Furthermore, this article proposes a structural optimization method to minimize radiation in pinmap packages. By integrating ground ball position optimization with the trained CNN model, the method achieves optimal radiation suppression. Validation across three different cases demonstrated a reduction in radiation by 4.85 to 10.37 dB (mV/m), confirming the effectiveness and applicability of the proposed approach.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1259-1270"},"PeriodicalIF":2.5,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144288474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Open Access Publishing IEEE开放获取出版
IF 2 3区 计算机科学
IEEE Transactions on Electromagnetic Compatibility Pub Date : 2025-06-13 DOI: 10.1109/TEMC.2025.3577554
{"title":"IEEE Open Access Publishing","authors":"","doi":"10.1109/TEMC.2025.3577554","DOIUrl":"https://doi.org/10.1109/TEMC.2025.3577554","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 3","pages":"1032-1032"},"PeriodicalIF":2.0,"publicationDate":"2025-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11036563","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144281316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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