Yuxuan Wu;Kushan Choksi;Samuel Defaz;Abdul Basit Mirza;Fang Luo
{"title":"高密度双向变换器电源环与栅极驱动近场耦合建模与优化","authors":"Yuxuan Wu;Kushan Choksi;Samuel Defaz;Abdul Basit Mirza;Fang Luo","doi":"10.1109/TEMC.2025.3571381","DOIUrl":null,"url":null,"abstract":"With the advent of wide-bandgap devices, power converters are achieving higher performance switching capabilities. As a result, manufacturers are increasingly focused on reducing the complexity of power converters and enhancing the production and assembly process by transitioning from modular to highly integrated designs, which are high-density bidirectional converters (HDBCs). As a result, near-field (NF) coupling is becoming a concern for stable operation in HDBCs. Optimization for the power loop and gate drive (GD) can be achieved through computational electromagnetics tools and circuit simulators, allowing for a detailed visualization of NF distributions. In addition, the GD impedance can be fine-tuned by optimizing the gate-source trace layout, while near-electric field coupling must be considered when implementing a shielding layer between the GD and high <inline-formula><tex-math>$\\text{d}\\mathbf {v}/\\text{d}\\mathbf {t}$</tex-math></inline-formula> nodes. This work presents a workflow for GD and power loop NF coupling modeling and optimization in HDBCs, aimed at mitigating issues such as mistriggering of switching devices and electromagnetic interference concerns in low-voltage systems.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 4","pages":"1334-1351"},"PeriodicalIF":2.5000,"publicationDate":"2025-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters\",\"authors\":\"Yuxuan Wu;Kushan Choksi;Samuel Defaz;Abdul Basit Mirza;Fang Luo\",\"doi\":\"10.1109/TEMC.2025.3571381\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the advent of wide-bandgap devices, power converters are achieving higher performance switching capabilities. As a result, manufacturers are increasingly focused on reducing the complexity of power converters and enhancing the production and assembly process by transitioning from modular to highly integrated designs, which are high-density bidirectional converters (HDBCs). As a result, near-field (NF) coupling is becoming a concern for stable operation in HDBCs. Optimization for the power loop and gate drive (GD) can be achieved through computational electromagnetics tools and circuit simulators, allowing for a detailed visualization of NF distributions. In addition, the GD impedance can be fine-tuned by optimizing the gate-source trace layout, while near-electric field coupling must be considered when implementing a shielding layer between the GD and high <inline-formula><tex-math>$\\\\text{d}\\\\mathbf {v}/\\\\text{d}\\\\mathbf {t}$</tex-math></inline-formula> nodes. This work presents a workflow for GD and power loop NF coupling modeling and optimization in HDBCs, aimed at mitigating issues such as mistriggering of switching devices and electromagnetic interference concerns in low-voltage systems.\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"67 4\",\"pages\":\"1334-1351\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2025-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11039661/\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/11039661/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Modeling and Optimization of Near-Field Coupling Between Power Loop and Gate Drive in High-Density Bidirectional Converters
With the advent of wide-bandgap devices, power converters are achieving higher performance switching capabilities. As a result, manufacturers are increasingly focused on reducing the complexity of power converters and enhancing the production and assembly process by transitioning from modular to highly integrated designs, which are high-density bidirectional converters (HDBCs). As a result, near-field (NF) coupling is becoming a concern for stable operation in HDBCs. Optimization for the power loop and gate drive (GD) can be achieved through computational electromagnetics tools and circuit simulators, allowing for a detailed visualization of NF distributions. In addition, the GD impedance can be fine-tuned by optimizing the gate-source trace layout, while near-electric field coupling must be considered when implementing a shielding layer between the GD and high $\text{d}\mathbf {v}/\text{d}\mathbf {t}$ nodes. This work presents a workflow for GD and power loop NF coupling modeling and optimization in HDBCs, aimed at mitigating issues such as mistriggering of switching devices and electromagnetic interference concerns in low-voltage systems.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.