Information Display最新文献_第2页

ID Asks/Qun (Frank) Yan ID Asks/群（Frank） Yan

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1611

Sri Peruvemba

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Potential Future of QDEL Technology: The OLED Replacement? QDEL技术的潜在未来：OLED的替代品？

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1618

Ian Hendy, Bruce Berkoff, Artur Podhorodecki

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MAX OLED Solution for Next-Generation OLED Displays 下一代OLED显示器的MAX OLED解决方案

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1610

Yu-Hsin Lin, Dieter Haas, Ji-Young Choung, Chung-Chia Chen, Sheng-Wen Wang, Jungmin Lee, Wenhao Wu, Jae-Wook Jeong, Takashi Anjiki, Manuel Radek, Stefan Keller, Si-Kyoung Kim, Max McDaniel, Indrajit Lahiri

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MicroLED Technology Shift Signifies a Transformative Moment in Displays 微led技术的转变标志着显示器的变革时刻

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1606

Nag Patibandla

{"title":"MicroLED Technology Shift Signifies a Transformative Moment in Displays","authors":"Nag Patibandla","doi":"10.1002/msid.1606","DOIUrl":"10.1002/msid.1606","url":null,"abstract":"THE USE OF MICROLEDS (TINY LIGHT-EMITTING DIODES of gallium nitride) as subpixels represents a significant advancement in display technology, offering improved luminance, energy efficiency, and color quality. This innovation unlocks new opportunities in high dynamic range in direct-view displays, while also enabling high brightness and wider viewing angle near-eye displays for augmented and mixed reality (AR/MR) applications. However, to fully realize this potential, several critical challenges must be addressed, particularly in the realms of pixel yield during die-transfer and laser-assisted or anisotropic conductive film (ACF) bonding, optical efficiency, and manufacturing costs.The traditional fabrication methods for microLED displays involve the use of red, green, and blue (RGB) GaN LED dice epitaxially grown on sapphire (or silicon) wafers. It is worth noting that AlGaInP red dice grown on gallium arsenide (or silicon or germanium) substrates may be substituted. In these conventional approaches, arrays of dice are created on each wafer and subsequently transferred to a backplane through a series of complex steps involving multiple interposers. This intricate transfer process can lead to yield loss, necessitating the implementation of die repair measures or redundancy in the form of two sets of RGB dice, both of which contribute to higher manufacturing costs. Furthermore, as the die-size decreases to achieve cost efficiency, microLED efficiency tends to decline based on increased carrier loss at the sidewalls, ultimately limiting overall pixel efficiency.Current display technologies predominantly use backplanes with thin-film transistors (TFT) on glass substrates, optimized for high-yield production in display fabrication facilities that handle large substrates. Transitioning these TFT production lines to accommodate high-resolution microLED backplanes required for AR/MR displays presents significant engineering hurdles that may not be financially sustainable. For instance, manufacturing AR/MR displays at 5,000 ppi entails producing millions of subpixels in a small area—a monumental engineering feat. A more viable solution for AR/MR displays may lie in using silicon complementary metal-oxide semiconductor (CMOS) backplanes. Some companies have already demonstrated silicon CMOS backplanes capable of achieving 3,000-ppi resolutions. The ongoing development of high-yield CMOS backplanes at larger sizes with resolutions exceeding 5,000 ppi is still in its nascent stages, but this holds promise for future advancements.To foster a sustainable business model, it is essential to develop microLED display technology applicable to both direct-view and near-eye applications using processes and tools adaptable for both TFT on glass and silicon CMOS backplanes. The advancements in microLED display manufacturing are highlighted in this issue, which includes three articles focused on critical aspects of microLED manufacturing t","PeriodicalId":52450,"journal":{"name":"Information Display","volume":"41 5","pages":""},"PeriodicalIF":0.0,"publicationDate":"2025-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sid.onlinelibrary.wiley.com/doi/epdf/10.1002/msid.1606","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145129177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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Some Green Shoots for the Display Business 显示业的一些萌芽

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1617

Bob Raikes

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Complete Issue 完整的问题

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1623

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Laser-Assisted Bonding for MicroLED Modules in Head-Up Display Applications 平视显示应用中微led模组的激光辅助键合

Information Display Pub Date : 2025-09-23 DOI: 10.1002/msid.1607

Wenya Tian, Yiran Wu, Yuanhao Sun, Peilin Zhang, Yatong Qiao, Ming Chen

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